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2004-09-30 Anadigics selects Takachiho as distributor in Japan
Anadigics Inc. has selected Takachiho Koheki Co. Ltd as its distributor in Japan.
2005-05-12 Anadigics reveals HBTs, pHEMTs process on single InGaP GaAs die
Anadigics Inc. has unveiled its proprietary, patent pending, commercial process for integrating heterojunction bipolar transistors (HBTs) with psuedomorphic high electron mobility transistors (pHEMTs) on a single indium gallium phosphide (InGaP) gallium arsenide (GaAs) die.
2004-08-27 Anadigics expands presence in U.S., Canada
Anadigics Inc. has appointed Columbia Marketing Inc. to distribute its complete line of wireless and broadband products in Washington State, Oregon, and Idaho in the U.S.; as well as British Columbia, Alberta, and Saskatchewan provinces in Canada.
2010-02-24 Altair, ZTE partner on LTE interoperability testing
Altair and ZTE are cooperating on LTE interoperability testing, performing extensive system level Interoperability Development Testing on their respective products
2010-01-29 Altair, Anadigics team to push LTE adoption
In this latest cooperation, Altair is integrating Anadigics power amplifiers into an LTE USB ExpressCard.
2008-11-21 Agilent tips solutions for TDD-LTE designs
Agilent has launched a fully coded BER solution for the time division duplex version of 3GPP's long-term evolution standard using 2 x 2 and 4 x 4 MIMO technology.
2008-05-02 Agilent tips 10x faster planar 3D EM simulator
Agilent Technologies has announced a 10x speedup of its planar 3D EM simulator, which is part of the Update 1 release of its ADS 2008 EDA software platform.
2014-05-05 Agilent buys technology that identifies thermal problems
The electrothermal analysis technology from Gradient Design Technology enables designers to identify and correct thermal problems encountered when developing integrated circuits. The acquisition stems from a cooperative relationship between the two firms involving the integration of this technology with Agilent's ADS software.
2008-06-20 Aeroflex tips 3GHz RF generator
Aeroflex has rolled the 3020C PXI modular digital RF signal generator, a 3GHz variant to the growing PXI signal generator line.
2011-12-23 Address 4G issues with SystemVue
A number of EDA tools available on the market today can be used for LTE-based design; however, creating systems designs for the emerging LTE-A standard requires an entirely new set of functionality.
2015-09-10 60 start-up companies to watch in 2015
EE Times has selected 30 start-up companies to come on to version 16.1 of its list of 60 firms that are worth keeping an eye on. Readers are welcome to nominate their own emerging companies.
2007-07-16 3G LSI chip combines advanced low-power techs
NEC Electronics' M2 system LSI chip integrates 3G to 3.5G W-CDMA and HSDPA communications technologies with advanced low power technologies optimized for mobile handsets.
2006-12-14 'First' CE-grade 802.11n-draft-compliant chipset rolls
Metalink touts the industry's first CE-grade IEEE-802.11n-draft-compliant dual-band chipset for wireless home entertainment systems.
2007-03-16 'All fuss but no elan,' analyst says of .11n
Analysts don't see a big take-off for .11n, insisting that the 100Mbps link will not prove very useful for some time, either in public hotspots or home networks.
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