Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > rambus

rambus Search results

total search223 articles
2009-11-27 USPTO rejects Rambus claims vs. Nvidia
The action, known as filing an action closing prosecution, follows preliminary rejection of the claims earlier this year by the USPTO.
2012-09-27 US Judge rules that Rambus shredded evidence
Rambus destruction of records will limit the royalties that it can collect off its patents in the SK Hynix suit.
2004-04-14 UMC licenses Rambus RaSer PHY technology
UMC is offering Rambus Inc. 0.13?m RaSer physical layer (PHY) cell for PCI Express(1) applications to its foundry customers.
2006-07-07 Toshiba, Rambus sign patent deal
Rambus has signed a new patent license agreement with Toshiba, granting Toshiba a license to Rambus patents for SDRAM and DDR SDRAM memory controllers.
2006-10-13 Toshiba, Rambus expand memory interface agreement
Toshiba Corp. and Rambus Inc. have expanded their memory-interface licensing agreement.
2004-04-01 Toshiba unveils serial link cell agreement with Rambus
Toshiba Corp. has signed an agreement with Rambus Inc. to incorporate the RaSer serial link cell technology from Rambus into the Toshiba 90nm process technology library.
2004-10-26 Toshiba to use Rambus DDR2 interface
Toshiba Corp. has selected Rambus Inc. DDR interface cells for next-generation high-volume consumer applications.
2002-11-06 Toshiba selects Rambus interface solution for memory
Toshiba Corp. has signed a licensing agreement to incorporate Rambus Inc.'s Yellowstone technology into Toshiba's high-value added DRAM products for use in next-generation systems.
2002-11-08 Toshiba memories incorporate Rambus solution
Toshiba Corp. has signed a licensing agreement to incorporate Rambus Inc.'s Yellowstone technology into its DRAM products.
2004-02-18 Toshiba licenses Rambus PCI Express PHY Cell
Toshiba Corp. has licensed Rambus Inc.'s PCI Express physical layer (PHY) cell, part of Rambus' RaSer family of serial link technologies.
2007-12-19 Toshiba licenses Rambus HDTV tech
Toshiba Corp. has licensed HDTV chipset memory technology from Rambus Inc.
2003-10-17 Toshiba IC incorporates Rambus interface
vToshiba Corp. has released its ASIC evaluation chip that that incorporates Rambus Inc.'s Redwood parallel logic interface.
2002-02-01 Suppliers' support for Rambus varies
Samsung says yes. Infineon says no. Elpida says maybe. Such are the mixed messages that DRAM makers are giving on whether they will continue to deliver faster and denser versions of Rambus DRAM.
2003-11-12 StarGen adopts Rambus technology for its switches
The company announced that its RaSer PHY IP has been selected by StarGen, a semiconductor company that supplies advanced serial switched interconnect solutions.
2005-02-28 ST to use Rambus Fiber Channel, PCI Express apps
ST signed an agreement to license Rambus' RaSer Fiber Channel and PCI Express serial link technologies to be incorporated into the ST 90nm process technology library.
2012-09-25 SK Hynix to pay Rambus over infringement suit
The judge for the Northern District of California found that Rambus' patents are valid and infringed by SK Hynix and will receive royalty payments for past infringement.
2002-08-02 SiS chipset supports Rambus memory
Silicon Integrated Systems Corp. has unveiled a PC chipset that supports Rambus memory.
2014-01-09 Samsung, Rambus sign 10-year license deal
The companies extended their relationship, giving Samsung with access to Rambus technology to place within its ICs.
2010-01-22 Samsung to pay Rambus $900M settlement
Samsung Electronics and Rambus have reached an agreement that settles all the claims between the two companies.
2003-07-03 Samsung adopts Rambus interface solution
Samsung Electronics has signed a licensing agreement to incorporate Rambus' Yellowstone technology into its next-gen DRAM products.
2005-08-25 Rambus, UMC expand process technology licensing pact
Rambus Inc. and United Microelectronics Corp. (UMC) have extended the availability of Rambus' patented PCI Express PHY cells to UMC's 180nm, 150nm and 90nm processes.
2008-04-25 Rambus, Spansion collaborate on next-gen flash
Rambus and Spansion have entered into a collaboration for DDR engineering services and future development of MirrorBit flash memory solutions.
2010-12-29 Rambus, Renesas ink logic integrated circuits licensing deal
Rambus Inc. and Renesas Electronics renewed their patent license agreement covering logic integrated circuits for a period of five years.
2008-07-18 Rambus, Qimonda revise patent license deal
Rambus Inc. has signed an amendment on its current patent license agreement with Qimonda AG, the memory spin-off of Infineon Technologies Inc.
2010-08-17 Rambus, NVIDIA ink patent agreement
Rambus Inc. and NVIDIA announced the formal signing of a patent license agreement involving memory controllers.
2005-04-19 Rambus, NEC ink memory controller patent license deal
Rambus Inc. has signed a patent license agreement with NEC Electronics Corp. that follows the development and manufacture of memory controllers based on various Rambus innovations.
2004-07-02 Rambus, Mentor to offer interoperable PCI Express solution
Rambus Inc. and Mentor Graphics are working together to develop and offer interoperable platforms for PCI Express chip designers.
2006-07-11 Rambus, Matsushita sign patent license agreement
Rambus Inc. signed a new patent license agreement with Matsushita Electric Industrial Co. Ltd, commonly known by the brand name Panasonic.
2009-09-23 Rambus, Kingston co-develop threaded module
Rambus and Kingston announced the collaborative development of a threaded module prototype using DDR3 DRAM.
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top