Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > Reduced Latency DRAM

Reduced Latency DRAM Search results

total search47 articles
2010-07-13 RLDRAM 3 boasts low latency, increased density
Micron Technology Inc.'s third-generation reduced latency DRAM (RLDRAM 3) will be available for sampling in 1H 11.
2002-02-12 Infineon samples low-latency DRAMs aimed at networking
Signaling its readiness to fight for the networking market, Infineon Technologies AG said it would start sampling its flavor of low-latency DRAM chips Monday (Feb. 11
2004-04-22 High-bandwidth DRAM optimization
This paper focuses on recent advances in DRAM architecture with emphasis on reduced latency DRAM (RLDRAM) technology.
2010-07-29 FPGAs support reduced-latency DRAM
Altera Corp.' reveals its Stratix V family of FPGAs features a memory architecture that supports Micron Technology's next-generation reduced-latency DRAM.
2002-04-23 Elpida, Hynix entries further muddy network DRAM waters
Network systems designers beware: If the low-latency memory market seemed fragmented before, it is about to be diagnosed as downright schizophrenic
2010-10-14 Pseudo SRAMs join SRAM ease, DRAM density, cost
The memory products cut the need for an external refresh controller, and offer partial array refresh, low standby current and deep power down modes that cut power use.
2010-12-14 Use RLDRAM II memory interface for FPGA
Learn how to use a Virtex-5 device to interface to Common I/ Double Data Rate Reduced Latency DRAM devices.
2007-03-12 Synthesizable CIO DDR RLDRAM II controller for Virtex-4 FPGAs
This application note describes how to use a Virtex-4 device to interface to Common I/O (CIO) Double Data Rate (DDR) Reduced Latency DRAM (RLDRAM II) devices. The reference design targets two CIO DDR RLDRAM II devices at a clock rate of 200/235MHz with data transfers at 400/470Mbps per pin.
2009-01-23 RLDRAM II memory interface for Virtex-5 FPGAs
This application note describes how to use a Virtex-5 device to interface to Common I/O (CIO)
2008-03-10 RLDRAM II clocking strategies
This technical note addresses the operation of the device outside the specified range of clock periods and the timing changes that occur in this mode of operation. It
2006-09-18 Micron's RLDRAM II upgrade supports triple play services
Micron Technology has introduced the next-generation of its RLDRAM II memory to meet the growing bandwidth requirements of triple play of communications services.
2003-10-10 Micron RLDRAM II operates at 400MHz
Micron Technology Inc. has announced sample availability of its 288Mb reduced latency DRAM II products that operate at 400MHz DDR operation.
2004-09-23 Micron offers fast random access, high bandwidth and density
Micron Technology announced the qualification of its 288Mb reduced latency DRAM II products.
2004-01-01 Memory evolution: The world of things to come
The memory industry is now in a period of evolution that underscores its competitive nature.
2010-11-24 ISSI to provide long term supply of RLDRAM 3 memory
ISSI has just announced that it is working with Micron Technology, Inc. to be an alternate supplier of Micron's third-generation reduced-latency DRAM. RLDRAM 3 memory offers a long-term solution for high-bandwidth, reduced-latency memory needs that are being demanded by networking standards such as 100 Gigabit Ethernet.
2003-05-14 Infineon, Micron launch memory spec for comms, storage apps
Infineon Technologies AG and Micron Technology Inc. have come up with a complete specification for reduced latency DRAM II (RLDRAM II) architecture.
2003-03-21 Infineon rolls 512Mb Mobile-RAM device
Infineon Technologies AG has extended its Mobile-RAM family of memory devices with its 512Mb offering.
2003-07-03 Cisco nixes network DRAMs, pushes high-end SRAMs
Networking giant Cisco Systems has abandoned plans to adopt a DRAM variant it had custom-designed for networking, but is moving forward with a proprietary high-end SRAM design
2013-07-08 Addressing memory scaling concerns
Here are some promising research and design directions to overcome challenges posed by memory scaling.
2006-09-14 NEC introduces 'first' 55nm CMOS-compatible eDRAM tech
NEC Electronics and its subsidiaries announced the industry's first 55nm CMOS-compatible embedded DRAM technology
2014-12-19 IBM claims PCM non-volatility not necessary
Ron Neale gets down to the nitty-gritty of IBM's invited paper at IEDM 2014. IBM has stated that for PCM, non-volatility/data-retention is no longer needed.
2008-08-01 Get DDR2 PCB design right the first time
DDR2 is still relatively new in the industry. It is an evolutionary improvement over its predecessor, DDR, and is the next memory standard, as defined by Joint Electronic Device Engineering Council document JESD79-2E. It behooves layout designers to completely comprehend the interface before doing layout so that the boards they design will be created "right the first time."
2008-02-11 GDDR5 gears for bandwidth-hungry graphics
The GDDR5 technology is targeted to become the next predominant graphics DRAM standard and is eyed to boost memory bandwidth of graphics applications to a new dimension
2015-03-11 ECC bumps up mobile device reliability, efficiency
Here is a look at how error correcting code enables enhanced memory density and bandwidth while maintaining power neutrality and reliability.
2011-10-12 Consortium to develop hybrid memory standard
Micron and Samsung aim to develop a memory standard that combines DRAM and logic processes in a single unit
2013-01-10 Everspin exhibits ST-MRAM viability for SSD
The reduced switching current and simplified circuitry of ST-MRAM enables it to support the write bandwidth required for DDR3 performance, according to Everspin Technologies
2016-05-04 Selecting memory for high performance FPGA platforms
Given the competitive advantage a few nanoseconds can make, the type of memory used is also a critical aspect when building a custom FPGA-based solution.
2014-04-17 Niche SRAM market thrives in networking, telecoms
Given the memory's speed capabilities, SRAM finds success in networking, where infrastructures are regularly updated in order to manage moving and storing data, and keep up with the growing Internet traffic.
2011-07-05 400Gb chipset to integrate RLDRAM 3 memory
Alcatel-Lucent has chosen Micron's RLDRAM 3 memory to support its 400Gb-capable chipset.
2015-04-22 Solid-state driver vendors choose NVMe for servers
The interest in NVMe is growing as more vendors begin supporting the standard. HGST claims that customers now better understand the operational benefits of NVMe and limitations of PCIe-based SSDs.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top