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2009-04-03 Asia to bid farewell to NECCAP PCs
NEC Computers Asia Pacific Sdn. Bhd. intends to withdraw from the PC markets in South and Southeast Asia, Hong Kong, and Australia and New Zeland due to adverse worldwide economic conditions, and focus on Japan's PC market, where NEC holds a leading position.
2002-05-28 Artisan, 1st Silicon collaborate on standard cell library
Artisan Components Inc., a provider of semiconductor intellectual property (IP), will deliver its library products on 1st Silicon Sdn. Bhd 's 0.185m CMOS process.
2002-12-16 ARM, ParthusCeva, Unive, strengthens Silterra IP Portfolio
Silterra Malaysia Sdn. Bhd. has joined the ARM Foundry Program, giving the company access to the ARM7TDMI core.
2002-12-13 ARM program extends to Asia-Pacific region
Anam Semiconductor and Silterra Malaysia Sdn. Bhd. have joined ARM Ltd's Foundry Program.
2015-02-12 7 communications tech that will shape 2015
Developing technologies such as LTE and LTE-Advanced, voice over LTE, small cells, heterogeneous networks, NFV/SDN are predicted to make a huge impact this year.
2005-03-31 1st Silicon to fab sensor technology for Russian firm
1st Silicon (Malaysia) Sdn. Bhd and UniqueICs LLC of Russia, a subsidiary of Kedah Wafer Emas (KWE) of Malaysia, have completed the development of a color CMOS photoreceiver cell technology for sensors.
2005-05-11 1st Silicon starts production of Sharp's flash technology
1st Silicon Sdn. Bhd. has completed qualification and begun production shipment of Sharp Corp.'s 0.13?m NOR flash technology.
2004-04-22 1st Silicon selects HP to implement IT system
Malaysia's semiconductor foundry 1st Silicon Sdn Bhd has chosen HP to implement its new Computer Integrated Manufacturing System, an IT solution for improved operational efficiency and customer service.
2003-10-13 1st Silicon selects Artisan for 0.15?m library
Wafer foundry 1st Silicon (Malaysia) Sdn. Bhd and Artisan Components Inc. have signed an agreement in which Artisan will develop and deliver its library products for 1st Silicon's 0.15?m CMOS process.
2004-06-08 1st Silicon selects Applied Materials foundry tools
1st Silicon of Malaysia Sdn Bhd has purchased Applied Materials Inc.'s Centura SiNgen LPCVD and Centura Radiance RTP systems for fabricating advanced logic, flash and embedded flash chips in its Fab 1 foundry facility in Kuching, Sarawak, Malaysia.
2005-11-22 1st Silicon seeks diversification strategy
Not long ago, silicon foundry specialist 1st Silicon (Malaysia) Sdn. Bhd. was looking to become the undisputed champion in the flash foundry business.
2004-08-04 1st Silicon ramps up 0.25?m embedded flash
Semiconductor manufacturing foundry 1st Silicon (Malaysia) Sdn Bhd has disclosed that it is accepting tape-outs for its new 0.25?m embedded flash technology.
2005-03-03 1st Silicon begins 0.25?m embedded flash production
1st Silicon (Malaysia) Sdn. Bhd has completed qualification and begun production shipment of 0.25?m embedded flash technology.
2003-07-29 1st Silicon adopts SST embedded Flash technology
1st Silicon Sdn. Bhd., a semiconductor foundry in Malaysia, has licensed Silicon Storage Technology Inc.'s 0.25?m SuperFlash technology.
2009-03-27 110nm CMOS squeezes extra die per wafer
Silterra Malaysia Sdn. Bhd. has debuted a foundry-compatible copper-based 110nm CMOS logic process technology. Codenamed CL110G, the technology offers a 10 percent optical shrink for the copper-based 130nm and enables customers to squeeze extra die per wafer.
2014-11-11 100G tech enables up to 4Tb/s aggregate throughput
Artesyn successfully tests the industry's first 100G ATCA technology that sets the groundwork for enabling bandwidth-hungry applications in SDN and network functions virtualisation deployments.
2015-11-05 Xilinx set to demo 16nm All Programmable MPSoCs
The latest UltraScale MPSoC architecture extends Xilinx SoCs to enable true heterogeneous multi-processing for various systems including smarter control, vision and network.
2013-03-06 Xilinx fills ASIC, ASSP gaps for data centres
Incorporating both SmartCORE IP and ARM processor-based smarts with All Programmable devices, the IP targets networks for LTE and LTE Advanced wireless HetNets, and 400G and Nx100G OTN.
2015-11-19 X-Fab invests in Malaysian wafer fab
The More-than-Moore chipmaker will invest $114 million in its wafer fab in Kuching, Sarawak, Malaysia to meet demand for 0.18?m and 0.35?m manufacturing.
2016-02-11 X-FAB Award calls for new design concepts in semiconductors
X-FAB to look into integration of advanced design and functionality, awarding the winner with a free prototyping run to validate their ideas in the best-suited technology.
2014-11-10 Virtualisation platform cuts cost for network deployments
The Centellis VP from Artesyn is an open hardware and software solution that allows network equipment and service providers to reduce time-to-market when implementing virtualised applications.
2006-02-22 USITC decides on Dominant, Osram patent dispute
Dominant Semiconductor announced that the USITC has determined that there is no violation by Dominant on five out of the eight patents brought forward by Osram GmbH.
2012-02-17 Using OpenFlow protocol to control network flow
Learn why it is important to build the open-source specification OpenFlow into routers, switches, and other devices to realize the benefits of Software-Defined Networks.
2012-06-29 U.S., Europe team up to compete with China's mfg dominance
While U.S. and European EMS providers probably can't by themselves compete with the Chinese electronics manufacturing juggernaut, partnerships between contract manufacturers appear to be one viable option for competing in the global electronics manufacturing market.
2014-09-26 TSMC fabricates networking chip with 16nm FinFET
The 32-core ARM Cortex A57-based processor is fabricated using TSMC's 16nm FinFET technology, and boasts a three-fold increase in performance compared with the previous processors.
2012-02-23 Touchscreen controller integrates 12bit SAR ADC
The KTF7793 from ICdidik LAB features complete on board switches that have very low on resistance allowing for direct driving of resistive touchscreens.
2015-03-09 Top 6 trends at Mobile World Congress
Imagination Technologies recognised six trends at the recent Mobile World Congress 2015 in Barcelona, Spain, which tend to drive industry momentum and related.
2015-08-07 TIA surveys operators on 5G future
5G cellular is expected to have an impact on everything in its attempt to extend 4G-LTE and support new use cases, and this new generation of wireless technology is expected to roll out in 2020.
2006-03-03 TI extends SMBus multiplexer/switch offering
Texas Instruments unveiled three new 4-bit bidirectional translating (level shifting) I2C and SMBus multiplexers and switches.
2009-11-13 Tech groups join hands to boost Malaysia 4G network
YTL Communications led the formation of the 4G Innovation Network in Malaysia, with the help of technology industry players Cisco, Clearwire, GCT Semiconductor and Samsung.
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