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2006-02-21 Connectors support up to 500 I/Os
Samtec has expanded its high-density product portfolio with the introduction of its SEARAY (SEAM/SEAF series) interconnects that support up to 500 I/Os.
2010-04-28 Coax cable assembly offers up to 240 contacts
Samtec's SEARAY coax cable assembly (SEAC) series offers 180 or 240 contacts (six or eight rows, 30 positions per row) on .050-inch (1.27mm) pitch.
2008-01-29 Board-to-board connectors fit high-density mezzanine cards
Molex has announced the availability of its HD Mezz and SEARAY board-to-board connectors for applications with high-pin-count devices on mezzanine cards or module PCBs.
2007-05-28 Signal integrity models roll for RF design tools
Samtec Inc. announces the launch of its interconnect signal integrity models for Agilent's advanced design system RF electronics design automation software.
2008-05-22 Samtec announces new Edge Rate contact solutions
Samtec has expanded its line of board-to-board and cable-to-board solutions featuring its rugged Edge Rate contact.
2007-06-04 New interconnects, signal integrity devices roll
Samtec Inc. unveils new interconnects and signal integrity services for panel and I/O, cable assemblies and board-to-board applications.
2007-04-30 High-density interconnects support 92 signal pairs
Samtec's new HD Mezz elevated, high-density interconnects provide a solid grid of contacts on 1.2-by-2mm pitch with up to 299 signals/grounds or 92 signal pairs.
2008-06-26 Crosstalk measurement, extraction and validation in 10Gbps serial systems
This paper provides a process to extract accurate connector crosstalk models. The Molex
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