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2007-05-16 Multicore spurs RTOS, tool revisions
RTOS and tool providers are aggressively supporting multicore programming and debugging while improving model-driven design, virtual prototyping and C-language compilation.
2009-09-17 Mentor CEO: IC industry is recovering
Mentor Graphics Mentor CEO Walden Rhines said optimism in the IC industry is spreading to the EDA sector, though most design companies are still limiting new spending.
2013-03-25 Memory prototype made up of mineral, graphene
EPFL researchers have developed a flash memory prototype that leverages the electronic capabilities of the mineral molybdenite and the conductivity of graphene.
2006-10-24 Media processor enables multiformat transcoding of digital video
LSI Logic's next-gen multicore transcoding media processor architecture, Domino[X], provides multiformat encoding, decoding and transcoding of digital video.
2013-06-07 Maxim CEO talks analogue, strategic integration
Maxim Integrated's Tunc Doluca discusses his new 90nm analogue process, his integration strategy, Intel, Samsung and China.
2008-01-23 Market watchers see mixed signals in analog
The analog semiconductor market is positioned for a rebound this year, but not all analog vendors are expected to reap the benefits, according to various market watchers.
2012-11-20 LSI banks on wireless base stations
Mobile networks such as wireless base stations will drive significant growth at LSI, CEO Ahbi Talwalkar declares.
2009-05-28 Long wait for IC recovery
The semiconductor market is gradually improving amid the downturn, but analysts disagree about the timing of the recovery.
2004-11-02 LCD storage scopes are low cost performers
Protek offers two versions of its dual-channel digital scopes - Model 6810CN and Model 6810MN.
2009-05-14 Korean, Taiwan companies toughen LED competition
Competition is stiffening in the global LED market as fast-growing Korean and Taiwan companies threaten to end the long-reign of the top three vendors, according to a market research firm.
2002-06-10 KLA-Tencor rolls system for gate dielectric processes
KLA-Tencor Corp. has introduced Quantox XP, its next-generation, non-contact, in-line electrical monitoring and characterization system for controlling advanced gate dielectric processes at 130nm and below nodes.
2007-07-25 Keithley intros 6.5-digit USB digital multimeter
Keithley Instruments Inc. has released the Model 2100 6.5-digit USB digital multimeter (DMM), a high precision, low-cost USB-based instrument.
2011-12-21 JEDEC to release 3D IC standard
JEDEC will release in late December or early January 2012 the first 3D IC interface standard.
2016-03-11 ISSCC: RF CMOS on the edge of transceiver chain
At the ISCC, Steve Ohr finds that what has happened is not a replacement of GaAs power amps by RF CMOS amps. The RF power amp function is performed at the edge of a radio transceiver chain.
2010-11-08 ISMI reaches out to old fabs
The group's mature fabs program addresses problems faced by companies with older fabs such as cost and productivity pressures, equipment lifecycle management, safety procedures and logistics.
2014-09-15 Is there a bright future for smart homes?
Wireless homes are a thing of the future, with key industry players investing big to push for intelligent homes with smartphones at the centre.
2010-04-09 iPad equipped to deliver richer graphics
UBM TechInsights' teardown of the Apple iPad found it has an unusually high processor-to-memory channel, an abundance of touchscreen silicon and a novel case design.
2015-01-21 IoT, sensor synergy key to driving the market forward
A group established to drive IoT development is setting its eyes on the fusion of both MEMS and non-MEMS sensors to add more functionality to IoT devices and wearables.
2010-01-25 Intel, Carnegie Mellon work on solder nanocomposites
Carnegie Mellon University and Intel Corp. are working on a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging.
2005-06-14 Intel sets up $200 million venture fund in China
Expanding its efforts in China, Intel Corp. on Monday (June 13) announced the establishment of a $200 million venture capital fund in that nation.
2011-06-23 Intel MIC to pave way for next-gen supercomputers
As Intel outlines its vision for this decade, they see the role of their Intel Many Integrated Core (Intel MIC) as a critical component of the company's exascale computing solutions.
2009-07-21 Intel exec paints picture of better days
In the opening moments of his keynote at Semicon West, Intel Corp. Ultra Mobility Group senior VP and general manager Anand Chandrasekher offered the beleaguered semiconductor capital equipment executives in the audience the perspective of history.
2009-09-04 Integrated PLC modem simplifies smart meter design
The new member of ON Semiconductor's PLC modem family suits smart electric automatic meter reading and management.
2000-12-01 Integrated approach for emerging tech designs
This technology article describes the integration of clock tree synthesis with logic synthesis, placement route and interconnect extraction to maximize the potentials of cell-based designs.
2010-09-06 Inspection tool monitors edge profiles
The metrology and inspection tool can help fabs identify potentially yield-impacting irregularities in the shape of the wafer edge profile or in the edges of films deposited on the wafer.
2005-02-22 Infineon's memory strategy: invest during downturn
Executives of Infineon Technologies' North America operations said its plan to ramp up a new 300mm fab here is part of a simple strategy: bigger wafers, smaller die size, maximum capacity utilization and continuing investment in its memory technology during a downturn.
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs.
2015-03-17 Industrial semiconductors ride wave of surging economy
IHS predicted that the industrial semiconductor market will register a 9.7 per cent CAGR over the next several years as revenue increases from $34.8 billion in 2013 to $55.2 billion in 2018.
2016-01-25 Improvement in light source could speed up EUV progress
Prototype systems in commercial fabs now use an 85W light source, soon to be upgraded to 125W, while ASML recently demoed an 185W capability and promises it will hit 250W before the end of the year.
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
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