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2016-03-02 Imagination reveals application thrust with products
Speaking to EE Times China at their summit in Shanghai, Imagination Technologies' executives shared their perspective of application trends and how they aim to address those trends with their products.
2014-09-05 If Moore's Law hangs back, revert to using old nodes
As the cost of scaling below 28nm multiplies, there has been a corresponding push to create new designs at established nodes using everything from near-threshold computing to back biasing and analogue sensors.
2005-09-21 ICI unveils latest back-end capabilities
IC Interconnect (ICI) has revealed that its wafer test, laser marking, die singulation, and tape and reel capabilities are now available as standard service offerings.
2003-04-08 IC industry looks to upswing at Semicon Europa
The mood at the annual Semicon Europa last week can be summed up as "The upswing is coming, but not just yet."
2010-03-22 IC forecasts: What keeps analysts bullish, worried
Although the signs are positive in the chip sector this year, there are still some concerns. Here are 10 reasons to remain bullishand worriedabout 2010.
2014-02-14 How much power can you derive from a brick?
Find out how much power may be extracted from a power brick.
2012-09-04 Growing audio needs in SoCs
There is a growing list of audio requirements such as a wider range of high-definition audio compression formats, multichannel audio content, higher sampling rates and advanced audio post-processing functions.
2015-04-29 Grasping DSPism and its limitations
In this article, we explore the cult of DSPism and some of its limitations, as well as how and when microcontrollers can replace analogue circuitry.
2012-11-15 Global silicon wafer shipments drops in Q3
Total silicon wafer area shipments were 2,389 million square inches during the most recent quarter, a two per cent decrease from the 2,447 million square inches shipped during the previous quarter.
2014-11-28 Fujitsu, Digital Process roll latest virtual product simulator
The FJVPS V15L15 is a digital production-preparation tool for customers in the assembly manufacturing industry that aids in considering product assembly processes using 3D models.
2004-04-05 Fujitsu debuts 10Gb Ethernet switch
Fujitsu Microelectronics America has unveiled a 10Gb Ethernet switch IC at electronicaUSA.
2011-06-28 Freescale undergoes "identity" makeover
Freescale implements a series of demos, training, and presentations to communicate to its stakeholders and constituency that it has recovered from previous state of serious debt.
2015-02-25 Freescale outdoes competitors in MCU specs
Vendors are in a real slugfest to prove their parts have lower sleep currents than the competitors, and too often "typ" is the only rating given for this critical parameter.
2006-06-29 Freescale ASICs power Hughes satellite broadband modems
Freescale Semiconductor will supply advanced satellite broadband ASIC solution to Hughes Network Systems, LLC.
2009-02-04 FPD growth swerves to the slow lane
Business and consumer reactions to global economic conditions have changed the outlook for electronic display sales and shipments over the next seven years. The difference in forecasted sales of flat panels over the seven years from 2009 through 2015 totals $135 billion, representing a 15 percent decline from the Q4 07 forecast.
2008-01-08 Fearless IC forecasts for 2008
To help sort chip market confusion, EE Times' Mark LaPedus released his own chip forecastsand other predictionsfor 2008.
2012-01-18 Fab spending sees downward trend for 2012
Spending on fab equipment is expected to drop in the first half of 2012, but will sharply increase in second half of the year to approach $10 billion by the fourth quarter.
2009-07-13 Eyeing Intel's strides in SoC biz
Intel Corp. isn't giving much detail on its two-year old initiative to become an SoC supplier. But interviews with executives and analysts show the company is making gradual progress laying the foundations to build competitive SoCs.
2008-04-23 ExpressCard interfaces designed for avionics testing
GE Fanuc Intelligent Platforms has introduced three RoHS-compliant ExpressCard interfaces for testing critical aircraft systems.
2015-02-24 Exploring near-eye display design
Know some of the key challenges for designing a compelling see-through near eye display solution that seamlessly blends the digital world with the physical world.
2014-12-01 Examining ISO 26262 from a developer's viewpoint
Here's an overview of the standard from system designer and implementer's viewpoint. It is based on QNX Software System's recent experience certifying its operating system to ISO 26262.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2015-02-25 Ethernet evolves for the connected car era
This article will explore the requirements of tomorrow's automotive networks and how the new 2-wire Ethernet PHYs currently under development will meet them.
2007-06-28 Embedded eyes multicore to save power
Like their microprocessor-making cousins in the X86-based PC world, suppliers of high-end embedded processors appear to be raising the white flag in the breakneck megahertz race.
2012-02-29 Elpida bailout denied, firm files bankruptcy
Elpida hasn't been able to reach a deal with the trade ministry, the Development Bank of Japan and its main lenders over financing for 92 billion yen in bonds and loans due by April.
2003-01-03 DRAM makers prep multichip cell phone memories
Eyeing the growing market for cellular phones, DRAM vendors are seeking ways to fold more non-volatile memory and advanced packaging techniques into their game plans.
2011-01-21 Does the fab tool business model need mending?
Fewer fabs coupled with cyclical downturns have caused massive consolidation in the fab tool industry. While some insist the industry should further consolidate to make it more efficient, others fear that fewer players could lead to higher tool costs and monopolies.
2013-10-28 Do high power LEDs emit IR heat in forward manner?
Is it true that a high power LED emits no UV or IR and that any heat is generated only in the PN junction and then transferred to a heat sink?
2015-07-30 Diamond substrate unleashes GaN potential
Diamond substrates and heat spreaders enable GaN devices to operate near its peak power output without degradation in lifetime.
2013-06-17 Designing a BLE advertise-only beacon
Here are two reference designs for BLE sensor beacons that can be powered by a single 1.5V AAA or coin cell battery.
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