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SIP What is an EEPROM? Search results

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What is an EEPROM?
Electrically Erasable Programmable ROM or EEPROm is a rewritable memory chip that holds its content without power. The two main categories of EEPROM interfaces are Serial bus and Parallel bus. These interfaces require between 1 and 4 control signals for operation, resulting in a memory device in an 8-pin (or less) package. Most common EEPPROM serial interface types are SPI, I²C, Microwire, UNI/O, and 1-Wire.  (Souce: EE Times, Wikipedia http://en.wikipedia.org/wiki/EEPROM)
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2006-06-08 Wireless USB SiP includes development kit
Staccato Communications is debuting a reference design kit for developers of Certified Wireless USB HWA and DWA designs.
2005-07-18 Variables dictate 'right' SoC-SiP mix for phones
The right mix of SiP and SoC will depend on many factors&mdasj;most critical is cost
2003-06-20 USI SiP module achieves better RF efficiency
Universal Scientific Industrial Co. Ltd. has announced the SiP module that combines Agere Systems' Wi-Fi and Cambridge Silicon Radio's Bluetooth technology.
2003-09-11 USI SiP module achieves better RF efficiency
Universal Scientific Industrial Co. Ltd. has announced the availability of an SiP module that combines Agere's Wi-Fi and CSR's Bluetooth technology.
2003-08-21 Ubiquity, Convedia collaborate on SIP apps
Two of the bigger players in embedded Session Initiation Protocol software announced plans to offer joint SIP solutions for wireline and wireless systems.
2006-05-01 Systems approach delivers SiP design
System-in-Package isn't just about size. Boasting faster development and lower cost, SiP allows the combination of different wafer process chips in one solution, making it not only a package but also a true system.
2003-01-06 SynQor SIP dc/dc converters exhibit 92 percent efficiency
The NiQor line of non-isolated SIP dc/dc converters from SynQor can deliver up to 20A of total output current.
2010-07-27 SMEs push SIP to 24.3 million trunks in 2013
The use of session initiation protocol (SIP) trunking as a low-cost alternative to legacy telecom services is growing despite lingering questions about overall QoS, says Heavy Reading.
2005-09-16 SiP: a window of opportunity for passives
In the great debate of SoC vs. SiP, design engineers usually get tangled in the delicate technical intricacies while missing an important pointthe implications on the passive component industry.
2015-09-28 SiP, PVS tech enabled for TSMC InFO packaging
Cadence said the Allegro SiP design tools and PVS allow TSMC customers to cut the InFO design and verification cycle by offering an integrated solution that automates the design-rule checking (DRC) flow.
2007-02-22 SiP with 8bit MCU, LIN transceiver rolls for automotive apps
Aimed at LIN applications, Atmel's ATA6602 and ATA6603 multichip modules combine an 8bit AVR MCU and a LIN SBC in an SiP without internal connections.
2011-12-01 SiP touts Bluetooth 3 support up to 24Mbit/s
Wi2Wi's W2CBW0015 includes WiFi-802.11n support up to 150Mbit/s over the air with 40MHz channels.
2006-08-03 SiP tech stacks logic, gigabit-class memory in one package
NEC Corp., NEC Electronics Corp. and NEC Electronics America Inc. unveiled a new system-in-package technology capable of stacking logic and gigabit-class memory in a single package.
2016-05-10 SiP styles for magnetic position sensors in automotive apps
Here is a case for using a complete MPOS system produced as a System-in-Package, thus relieving the automotive supplier of the need to produce a PCB assembly when implementing magnetic position sensing.
2005-03-18 SiP solution offers faster throughput
Philips' 802.11g WLAN semiconductor SiP solution enables consumers to access content up to five times faster than current 802.11b products without compromising the battery life of the mobile phone.
2014-09-18 SiP sol'n offers precision sensing in portable medical devices
ON Semiconductor introduced Struix, a semi-customisable SiP solution for precision sensing and monitoring in various mobile medical electronics such as glucose monitors and heart rate monitors.
2006-08-31 SIP relays save board space in ATE apps
Coto Technology has developed the miniature 9117 series of vertical SIP reed relays to save board space in automatic test equipment (ATE) applications.
2011-02-01 SIP point-of-load converters 20A to 120A
Bel Power expanded its VRPx Series of single inline package (SIP) footprint point-of-load (POL) converters to include 30A, 90A, 100A, 110A and 120A modules.
2005-07-18 SiP modules call for right blend of tech
The SiP solution offers a seemingly limitless combination of silicon, package and component technologies that simplify overall system design.
2007-01-29 SiP lacks EDA tool support
System-in-package (SiP) may be an increasingly attractive alternative to SoCs, but EDA tool support is sorely lacking.
2010-12-01 SiP eases mobile entry into NFC
The SecuRead system-in-package for NFC mobile devices includes an NFC controller, security controller, Java Card OS and an open NFC protocol stack.
2010-10-25 SiP device supports automotive LIN networking
Atmel unveiled a new SiP solution for LIN automotive networking applications, the ATA6614.
2003-01-13 SIP converters deliver full output current at 85C
The DV/DH series of non-isolated SIP dc/dc converters is designed to provide full output current when operating up to 85C.
2013-07-03 SIP compatible device paired with Rava-enabled touch screens
Barix's Annuncicom 200-Rava establishes compatibility between Rava-enabled touch screens without a central server allowing customers to continue using existing devices when upgrading to Rava screens.
2002-10-01 Silicon Metrics: U.S., Taiwan alliance crucial in EDA, SIP advancement
A decade ago, the PC industry faced shrinking profit margins due to heavy competition and high production costs. Today, the electronics industry is looking beyond the PC for new areas of growth, while the ASIC supply chain is undergoing significant restructuring
2007-10-02 SanDisk opens SiP production facility in China
SanDisk has announced the opening of its production facility in Shanghai, China, which produces a flash memory-based chip package called SiP.
2003-02-07 Samsung rolls SIP processor
Samsung Electronics has introduced what it claims to be the industry's first system-in-package stacking processor with integrated NAND Flash.
2005-01-28 Radvision rolls updated SIP kit
Radvision released an updated version of its SIP Developer Toolkit that provides enhanced security and RTOS support while also delivering support for signaling compression.
2006-11-28 Pressures tip wireless apps toward SiP
System-in-Package technology has begun to challenge SoC implementations as a high-level design strategy for selected wireless applications because of lengthening SoC design cycles and other factors.
2009-04-17 POL converters available in SMD, SIP
FDK Corp. introduces five new products to its DK Series of small, low profile non-isolated point of load (POL) DC/DC converters.
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