Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > sle

sle Search results

total search16 articles
2003-01-23 TI, SLE to co-develop complex ASICs for high-end markets
Texas Instruments Inc. and Silicon Logic Engineering Inc. have agreed to jointly develop complex ASICs for TI customers in the wireless/wireline infrastructure and computing markets.
2005-07-29 Synopsys test methodologies verify SLE's chip developments
Synopsys Inc. announced that its VCS comprehensive RTL verification solution and Vera testbench automation tool have been adopted by ASIC design services provider Silicon Logic Engineering (SLE) to accelerate its chip development process.
2003-09-23 Mentor, SLE form strategic alliance
Silicon Logic Engineering (SLE) and Mentor Graphics Corp. have entered into a business collaboration that is expected to speed mission-critical design verification and reduces the risk of additional manufacturing operations due to undetected design errors.
2007-01-31 Tundra division rolls out Interlaken IP core
Silicon Logic Engineering, a division of Tundra Semiconductor Corp., has announced the development of a licensable Interlaken protocol IP core for use in ASIC or FPGA designs.
2006-11-10 Contactless MCUs offer global reader compatibility
Infineon's new high-security contactless-interface MCUs are the only contactless chips today that are able to communicate with the existing reader device infrastructure all over the world.
2008-11-07 MCUs tout digital security features
Infineon introduces its latest high-security microcontroller family, the SLE 78, and a hardware security technology called "Integrity Guard."
2007-03-22 Tundra offers RapidIO Endpoint IP for license
Tundra Semiconductor Corp. is developing RapidIO Endpoint IP for license, offering designers low risk and accelerated time-to-market.
2006-06-06 Tundra acquires Silicon Logic Engineering for $14M
Tundra Semiconductor Corp. announced that it has acquired Silicon Logic Engineering Inc.
2004-07-05 Sharp sets road map for silicon-on-glass
2007-11-20 Security MCUs boost functions of SIM cards
Infineon Technologies has unveiled its new product family of security MCUs specifically designed for use in SIM cards.
2010-03-03 Open-Silicon opens Japan headquarters
Open-Silicon Inc. has launched Open-Silicon Japan with headquarters in the Landmark Tower, Yokohama, Japan.
2007-11-15 Infineon-Intel team eyes high-density SIM cards
Infineon Technologies and Intel are working together for the development of optimized chip solutions for high-density SIM cards.
2008-08-14 Infineon boosts security of China's transportation cards
Infineon Technologies claims it is the sole chip supplier for one of China's large contactless MCU transportation card issued by Shenzhen Tong Ltd, a public transportation company.
2010-06-25 IBM to produce Infineon secure ICs for gov't IDs
Infineon Technologies AG has tapped IBM Corp. to manufacture its highly secure ICs for secure identification applications, including electronic passports.
2002-05-17 Cray CMOS team receives funding for advanced ASICs
Wisconsin-based Silicon Logic Engineering has received $2.5 million in venture funding under that state's certified capital companies program.
2009-11-16 China taps Infineon MCUs for e-Passport
The China government has selected Infineon Technologies AG microcontrollers for the country's electronic passports.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top