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2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany
2013-06-27 SPTS purchases Xactix to expand etch sol'ns
SPTS now supports release technologies for silicon/molybdenum/germanium and silicon oxide sacrificial layers that eliminate "stiction" among moving parts that can disable precision MEMS devices.
2011-05-31 SPTS, Griffith University to develop SiC-on-Si wafers
A joint agreement has been forged between SPTS and Griffith University for the commercial development of SiC-on-silicon wafers as viable semiconductor material for LED, power and MEMS devices
2013-09-09 PVD system enables power devices' 300mm transition
The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow.
2013-05-31 Research reveals SiC film epitaxial growth on 300mm silicon
The Queensland Micro and Nanotechnology Facility of Griffith University and SPTS said the finding is the result of over 10 years research at QMF on low temperature SiC deposition on silicon
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2014-02-06 3D TSV Summit underscores cost-effective production
From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing TSVs and all the ensuing steps can be largely compensated by the IC performance benefits.
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