Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > STATS ChipPAC

STATS ChipPAC Search results

?
?
total search66 articles
2005-05-13 TSMC to get wafer bumping service from STATS
Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2006-02-06 Tessera sues ST, ASE, SPIL, STATS, Siliconware
Tessera Technologies said that it has expanded its legal efforts by filing a patent suit against five companies: ASE, ChipMOS, STATS ChipPAC, STMicroelectronics and Siliconware.
2004-10-21 Teradyne supports STATS chip testing needs
Teradyne Inc. revealed that STATS ChipPAC Ltd has selected its FLEX test system as a key platform for testing a wide range of devices for applications including communications, broadband and other consumer electronics.
2004-02-12 STATS to merge with ChipPAC
ST Assembly Test Services (STAT) and ChipPAC have agreed to merge their businesses to create an independent semiconductor assembly and test solutions company
2007-05-22 STATS shareholders dodge private-equity buyout
Temasek Holdings' buyout plan of Singapore-based STATS ChipPAC did not push through as it fell short of the 90 percent share needed to make the test and assembly house private.
2008-08-29 STATS ChipPAC, Infineon ink eWLB manufacturing deal
STATS ChipPAC Ltd has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first generation embedded eWLB technology.
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market.
2014-03-13 STATS ChipPAC unveils novel wafer level manufacturing
FlexLine claims to provide freedom from wafer diameter constraints while enabling supply chain simplification and cost reductions that are not possible with a conventional manufacturing flow.
2013-07-02 STATS ChipPAC to shut down Malaysia plant
The firm plans to consolidate its leaded wirebond packaging and related test operations in Malaysia into its Shanghai, China operations and the closure of its Malaysia plant by the end of 2014.
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications.
2005-07-28 STATS ChipPAC to build new China plant
Seeking to meet exploding demand in a hot market, Singapore's STATS ChipPAC Ltd plans to build its second chip assembly and test facility in Shanghai, China.
2010-12-01 STATS ChipPAC ships 100 millionth copper wire bond interconnect semiconductor packages
STATS ChipPAC expects continued surge in use of copper wire as interconnect material
2005-11-04 STATS ChipPAC opens wafer bump plant in China
Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market.
2007-10-25 STATS ChipPAC opens second China facility
STATS ChipPAC has announced the opening of a second manufacturing facility in Shanghai, China.
2005-11-24 STATS ChipPAC offers copper process for passives
Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems.
2014-01-23 STATS ChipPAC makes IEEE patent ranking
STATS ChipPAC was recognised for patent innovations by the IEEE for the third consecutive year.
2010-12-15 STATS ChipPac flip chip biz grows over 50%
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.
2012-02-03 STATS ChipPAC closes Thai plant
Damages to the facility was so extensive that economic restoration is no longer possible.
2012-01-16 STATS ChipPAC builds new factory
Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet).
2011-04-21 STATS ChipPAC aims TSV expansion in Singapore
STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2007-03-05 Singapore private equity eyes STATS ChipPAC
Singapore's Temasek Holdings is offering of up to $1.6 billion for local packaging house STATS ChipPACa bid that analysts said may undervalue the once-troubled firm.
2004-08-09 Shareholders approve STATS, ChipPAC merger
Shareholders of both semiconductor test and assembly service providers STATS and ChipPAC have approved a merger originally announced in February 2004.
2012-09-17 QFN package design kit for ADS launched by STATS ChipPAC
The QFN package design kit enhances package modeling and simulation accuracy with Agilent's ADS electronic design automation software for radio frequency.
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies.
2005-08-03 Merger continues to weigh on STATS ChipPAC
With STATS ChipPAC Ltd continuing to post losses nearly a year after the merger that created it, and failing to leverage on a generally positive industry environment, observers said the immediate outlook for the test and packaging firm is grim.
2007-10-04 LSI sells Thailand facility to STATS ChipPAC
LSI Corp. announced it has completed the sale of its semiconductor assembly and test operation in Pathumthani, Thailand, to STATS ChipPAC Ltd.
2005-07-29 Amkor, STATS ChipPAC still spilling red ink
Two major chip packaging and test vendors - Amkor and STATS ChipPAC - continue to spill red ink amid slumping demand and severe price pressures in the market.
2004-11-08 Agilent to provide Stats Chippac with 93000 SOC system
Agilent Technologies Inc. has been selected as Stats Chippac Ltd strategic test supplier in an agreement worth up to $125 million.
2014-12-17 Packaging and testing industry trends from 2013 to 2014
In 2014, the output value of OSAT industry is seen to grow by 8.4 per cent and the advanced packaging industry is expected to increase by 10 per cent.
2005-12-27 IC packaging providers upbeat
Continued strength in the IC packaging and test sector during the fourth quarter and possibly beyond has prompted an investment banking firm to raise its estimates for Amkor, Siliconware and STATS ChipPAC.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top