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2005-05-13	TSMC to get wafer bumping service from STATS Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2006-02-06	Tessera sues ST, ASE, SPIL, STATS, Siliconware Tessera Technologies said that it has expanded its legal efforts by filing a patent suit against five companies: ASE, ChipMOS, STATS ChipPAC, STMicroelectronics and Siliconware.
2004-10-21	Teradyne supports STATS chip testing needs Teradyne Inc. revealed that STATS ChipPAC Ltd has selected its FLEX test system as a key platform for testing a wide range of devices for applications including communications, broadband and other consumer electronics.
2002-09-02	Synad adopts LTX, STATS technologies for WLAN chipsets Synad Technologies has selected LTX Corp.'s Fusion CX configuration technology for its dual-band WLAN chipsets.
2002-04-02	STATS to provide full turnkey services for Chipcon Chipcon AS has selected ST Assembly Test Services Ltd to provide turnkey test development, assembly and final testing services for its RF devices that are targeted at the wireless communication markets.
2003-07-04	STATS to open manufacturing facility in Shanghai ST Assembly Test Services Ltd (STATS) has announced that it is opening a manufacturing facility in Shanghai, China.
2004-02-12	STATS to merge with ChipPAC ST Assembly Test Services (STAT) and ChipPAC have agreed to merge their businesses to create an independent semiconductor assembly and test solutions company.
2007-05-22	STATS shareholders dodge private-equity buyout Temasek Holdings' buyout plan of Singapore-based STATS ChipPAC did not push through as it fell short of the 90 percent share needed to make the test and assembly house private.
2002-07-08	STATS rolls out advanced version of EBGA package ST Assembly Test Services Ltd has introduced its latest thermal array product, the Enhanced Ball Grid Array Build Up (EBGA-A) package, an advanced version of the traditional EBGA package.
2004-01-07	STATS purchases multiple Agilent SoC test systems ST Assembly Test Services Ltd (STATS) has purchased multiple Agilent 93000 CMOS Image Sensor systems by Agilent Technologies Inc.
2002-05-31	STATS PBGA package improves thermal performance ST Assembly Test Services Ltd has introduced the Exposed Drop In Heat Spreader PBGA (XDPBGA) package that offers better thermal performance than traditional die-down packages.
2004-01-22	STATS offers FCLGA package for wireless apps ST Assembly Test Services Ltd has qualified an environment-friendly version of its Flip-Chip Land Grid Array (FCLGA) package.
2003-11-14	STATS introduces 0.50mm version of QLP ST Assembly Test Services Ltd (STATS) has added a super thin version of its Quad Leadless Package (QLP) to its technology portfolio.
2003-11-14	STATS introduces 0.50mm version of QLP ST Assembly Test Services Ltd (STATS) has added a super thin version of its Quad Leadless Package (QLP) to its technology portfolio.
2004-01-05	STATS forms alliance with SimmTech ST Assembly Test Services Ltd (STATS) has formed a strategic alliance with SimmTech Co. Ltd, a provider of semiconductor substrate materials.
2004-05-25	STATS expands turnkey solutions with DFT capabilities STATS has expanded its integrated turnkey solutions with DFT capabilities that will assist customers in improving testability and throughput of their devices.
2002-08-26	STATS EBGA package offers more I/O STATS Ltd. has launched the EBGA Multi-Tier package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection.
2002-05-28	STATS develops thermally-enhanced PBGA ST Assembly Test Services Ltd has introduced an enhanced version of its Plastic Ball Grid Array package called Exposed Drop in Heat Spreader Plastic Ball Grid Array (XDPBGA).
2008-08-29	STATS ChipPAC, Infineon ink eWLB manufacturing deal STATS ChipPAC Ltd has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first generation embedded eWLB technology.
2005-10-20	STATS ChipPAC wants to be 3D king Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market.
2014-03-13	STATS ChipPAC unveils novel wafer level manufacturing FlexLine claims to provide freedom from wafer diameter constraints while enabling supply chain simplification and cost reductions that are not possible with a conventional manufacturing flow.
2013-07-02	STATS ChipPAC to shut down Malaysia plant The firm plans to consolidate its leaded wirebond packaging and related test operations in Malaysia into its Shanghai, China operations and the closure of its Malaysia plant by the end of 2014.
2005-05-17	STATS ChipPAC to offer 300mm electroplated wafer bumping services STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications.
2005-07-28	STATS ChipPAC to build new China plant Seeking to meet exploding demand in a hot market, Singapore's STATS ChipPAC Ltd plans to build its second chip assembly and test facility in Shanghai, China.
2010-12-01	STATS ChipPAC ships 100 millionth copper wire bond interconnect semiconductor packages STATS ChipPAC expects continued surge in use of copper wire as interconnect material
2005-11-04	STATS ChipPAC opens wafer bump plant in China Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market.
2007-10-25	STATS ChipPAC opens second China facility STATS ChipPAC has announced the opening of a second manufacturing facility in Shanghai, China.
2005-11-24	STATS ChipPAC offers copper process for passives Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems.
2014-01-23	STATS ChipPAC makes IEEE patent ranking STATS ChipPAC was recognised for patent innovations by the IEEE for the third consecutive year.
2010-12-15	STATS ChipPac flip chip biz grows over 50% Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.