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2010-02-11 ST-Ericsson leverages on power-efficient solutions
ST-Ericsson senior VP and head of strategic planning Edgar Auslander sat down with EE Times to outline what the company believes are the main mobile handset trends for 2010.
2008-12-02 ST-Ericsson JV gets green light from EC
The European Commission announced Nov. 26 it has authorized, under the European Union merger regulation, the creation of a joint venture between EMP, the wireless platform business of Ericsson, and ST-NXP, the wireless semiconductors business of STMicroelectronics.
2009-09-21 ST-Ericsson debuts 65nm TD-HSPA modem chips
ST-Ericsson and its China subsidiary T3G are sampling what they tout to be the first 65nm TD-HSPA modem chip.
2008-08-22 ST-Ericsson deal births mobile chip powerhouse
STMicroelectronics and Ericsson have agreed to merge Ericsson Mobile Platforms and ST-NXP Wireless into a joint venture.
2012-03-16 ST-Ericsson a target for takeover
Potential buyers for ST-Ericsson could include Advanced Micro Devices Inc., Intel Corp., Nvidia Corp. and Texas Instruments, a Reuters report said quoting sources.
2002-12-18 ST-BUS generic device specification
This article describes specifications of the st-bus generic device.
2003-08-15 ST-Bus generic device specification
This application note provides device specifications such as timing parameters of the ST-BUS interface for different data rates.
2012-06-18 ST, Wasion deliver NFC-enabled power meters
China smart meter provider Wasion Group is using STMicroelectronics NFC Technology to enable payments of electricity bills using mobile phones.
2010-06-23 ST, Tsinghua University expand R&D partnership
ST will provide the Tsinghua University with digital multimedia and advanced analog chips, expert support and advanced design tools, and jointly cooperate on applications engineering projects.
2007-12-21 ST, TJ FAW open joint automotive lab in China
STMicroelectronics and TIANJIN FAW Xiali Automobile, a China-based automotive manufacturer, have inaugurated their joint automotive application laboratory in Tianjin, China.
2002-01-16 ST, Thomson expand R&D pact to include ICs for digital consumer apps
STMicroelectronics and Thomson multimedia have signed a five-year agreement to cooperate in the R&D of SoC for digital consumer applications.
2013-03-14 ST, Thingsquare partner to drive Internet of Things
Thingsquare Mist is a software system that brings true Internet-connectivity to IoT while ST's SPIRIT1 is an RF transceiver geared for RF wireless-sensor node applications in the sub-1GHz band.
2013-08-23 ST, Tapko team up for smart building automation
STMicroelectronics and Tapko Technologies have released a KNX communication stack to further develop smart building systems for automatic lighting, heating and other environmental controls.
2005-09-27 ST, Synopsys demonstrate SATA IP compatibility for 90nm
STMicroelectronics and Synopsys announced that they are working together to conduct Serial ATA (SATA) interoperability testing using ST's 90nm Multi-Interface PHY (MIPHY) physical layer interface macro-cell and Synopsys' DesignWare SATA host controller intellectual property (IP) core.
2005-09-23 ST, Synopsys conduct testing of SATA IP cores for 90nm tech
STMicroelectronics and Synopsys Inc. are working together to conduct Serial ATA (SATA) interoperability testing using ST's 90nm MIPHY (multi-interface PHY) physical layer interface macro-cell and Synopsys' DesignWare SATA host controller intellectual property (IP) core. Interoperability testing reduces integration risk and speeds time-to-market for designers integrating SATA functionality into their system-on-chip (SoC) designs.
2008-12-22 ST, Synopsys collaborate on 32nm components
Synopsys Inc. and STMicroelectronics NV have joined efforts to enable the readiness of key components in a 32nm design flow, including ST's standard cell library for low-power and high-performance design, and the support of the latest route rules in Synopsys' IC Compiler Zroute technology.
2009-08-04 ST, Stollmann drive NFC adoption in mobile apps
STMicroelectronics and Stollman E+V GmbH have signed a joint agreement to offer turnkey NFC interface solutions.
2012-10-23 ST, Soitec roll 28nm FD-SOI CMOS process thru CMP
ST's CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process that uses silicon substrates from Soitec is available for prototyping to universities, research labs and design firms.
2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products.
2014-03-24 ST, SoftAtHome bring cinema experience to STBs
The combination of technologies from STMicroelectronics and SoftAtHome enables operators to benefit from a high efficiency video coding for HD eligibility extension.
2005-12-15 ST, SmardTech collaborate on smart card solution
STMicroelectronics announced an on-going collaboration with SmardTech to develop and deliver a highly efficient smart card solution, based on the ST19W secure MCU family and the SmardOS OS.
2011-07-13 ST, Sharp open PV fab in Italy
Enel Green Power, Sharp and STMicroelectronics has opened a PV plant in Italy with a solar panel production capacity of 160MW. The fab's capacity is expected to reach 480MW in the coming years.
2005-01-19 ST, Scientific-Atlanta partner on STB chip
ST and Scientific-Atlanta announced that they are in full production with a jointly developed highly integrated cable STB chip.
2005-11-29 ST, Sagem push MPEG4 set top boxes
Sagem Communication will start selling this month MPEG4 capable set-top boxes based on a single-chip decoder from ST Microelectronics targeted at HDTV capable models.
2007-05-18 ST, SAES team on multi-axis MEMS gyroscopes
The SAES Getters Group and STMicroelectronics (ST) have signed a co-operation agreement that will support development and production of next-generation MEMS gyroscopes.
2009-01-15 ST, Paratek cooperate on RF tunable products
Paratek and STMicroelectronics have partnered to supply RF tunable products to mobile wireless markets.
2006-05-05 ST, others join coaxial cable alliance
The Multimedia over Coax Alliance announced the newest additions to its growing list of silicon vendors with the addition of STMicroelectronics, Conexant and BroadLight.
2005-05-13 ST, Octasic deliver VoP telecom ICs
STMicroelectronics and Octasic Inc. have signed an agreement to deliver a family of Voice-over-Packet (VoP) telecom ICs.
2008-06-30 ST, NXP team up to set new global wireless trends
NXP and ST announced that their joint venture being set up to address mobile applications will be called ST-NXP Wireless. The venture of these two complementary and formidable forces in the worldwide market will create a new global wireless powerhouse.
2009-11-19 ST, NXP ink Mifare license agreement
The ST-NXP licensing agreement gives operators and vendors widened availability of contactless smart card ICs.
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