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| 2010-02-11 | ST-Ericsson leverages on power-efficient solutions ST-Ericsson senior VP and head of strategic planning Edgar Auslander sat down with EE Times to outline what the company believes are the main mobile handset trends for 2010. |
| 2008-12-02 | ST-Ericsson JV gets green light from EC The European Commission announced Nov. 26 it has authorized, under the European Union merger regulation, the creation of a joint venture between EMP, the wireless platform business of Ericsson, and ST-NXP, the wireless semiconductors business of STMicroelectronics. |
| 2009-09-21 | ST-Ericsson debuts 65nm TD-HSPA modem chips ST-Ericsson and its China subsidiary T3G are sampling what they tout to be the first 65nm TD-HSPA modem chip. |
| 2008-08-22 | ST-Ericsson deal births mobile chip powerhouse STMicroelectronics and Ericsson have agreed to merge Ericsson Mobile Platforms and ST-NXP Wireless into a joint venture. |
| 2012-03-16 | ST-Ericsson a target for takeover Potential buyers for ST-Ericsson could include Advanced Micro Devices Inc., Intel Corp., Nvidia Corp. and Texas Instruments, a Reuters report said quoting sources. |
| 2002-12-18 | ST-BUS generic device specification This article describes specifications of the st-bus generic device. |
| 2003-08-15 | ST-Bus generic device specification This application note provides device specifications such as timing parameters of the ST-BUS interface for different data rates. |
| 2012-06-18 | ST, Wasion deliver NFC-enabled power meters China smart meter provider Wasion Group is using STMicroelectronics NFC Technology to enable payments of electricity bills using mobile phones. |
| 2010-06-23 | ST, Tsinghua University expand R&D partnership ST will provide the Tsinghua University with digital multimedia and advanced analog chips, expert support and advanced design tools, and jointly cooperate on applications engineering projects. |
| 2007-12-21 | ST, TJ FAW open joint automotive lab in China STMicroelectronics and TIANJIN FAW Xiali Automobile, a China-based automotive manufacturer, have inaugurated their joint automotive application laboratory in Tianjin, China. |
| 2002-01-16 | ST, Thomson expand R&D pact to include ICs for digital consumer apps STMicroelectronics and Thomson multimedia have signed a five-year agreement to cooperate in the R&D of SoC for digital consumer applications. |
| 2013-03-14 | ST, Thingsquare partner to drive Internet of Things Thingsquare Mist is a software system that brings true Internet-connectivity to IoT while ST's SPIRIT1 is an RF transceiver geared for RF wireless-sensor node applications in the sub-1GHz band. |
| 2013-08-23 | ST, Tapko team up for smart building automation STMicroelectronics and Tapko Technologies have released a KNX communication stack to further develop smart building systems for automatic lighting, heating and other environmental controls. |
| 2005-09-27 | ST, Synopsys demonstrate SATA IP compatibility for 90nm STMicroelectronics and Synopsys announced that they are working together to conduct Serial ATA (SATA) interoperability testing using ST's 90nm Multi-Interface PHY (MIPHY) physical layer interface macro-cell and Synopsys' DesignWare SATA host controller intellectual property (IP) core. |
| 2005-09-23 | ST, Synopsys conduct testing of SATA IP cores for 90nm tech STMicroelectronics and Synopsys Inc. are working together to conduct Serial ATA (SATA) interoperability testing using ST's 90nm MIPHY (multi-interface PHY) physical layer interface macro-cell and Synopsys' DesignWare SATA host controller intellectual property (IP) core. Interoperability testing reduces integration risk and speeds time-to-market for designers integrating SATA functionality into their system-on-chip (SoC) designs. |
| 2008-12-22 | ST, Synopsys collaborate on 32nm components Synopsys Inc. and STMicroelectronics NV have joined efforts to enable the readiness of key components in a 32nm design flow, including ST's standard cell library for low-power and high-performance design, and the support of the latest route rules in Synopsys' IC Compiler Zroute technology. |
| 2009-08-04 | ST, Stollmann drive NFC adoption in mobile apps STMicroelectronics and Stollman E+V GmbH have signed a joint agreement to offer turnkey NFC interface solutions. |
| 2012-10-23 | ST, Soitec roll 28nm FD-SOI CMOS process thru CMP ST's CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process that uses silicon substrates from Soitec is available for prototyping to universities, research labs and design firms. |
| 2009-05-19 | ST, Soitec co-develop BSI tech for CMOS image sensors STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products. |
| 2014-03-24 | ST, SoftAtHome bring cinema experience to STBs The combination of technologies from STMicroelectronics and SoftAtHome enables operators to benefit from a high efficiency video coding for HD eligibility extension. |
| 2005-12-15 | ST, SmardTech collaborate on smart card solution STMicroelectronics announced an on-going collaboration with SmardTech to develop and deliver a highly efficient smart card solution, based on the ST19W secure MCU family and the SmardOS OS. |
| 2011-07-13 | ST, Sharp open PV fab in Italy Enel Green Power, Sharp and STMicroelectronics has opened a PV plant in Italy with a solar panel production capacity of 160MW. The fab's capacity is expected to reach 480MW in the coming years. |
| 2005-01-19 | ST, Scientific-Atlanta partner on STB chip ST and Scientific-Atlanta announced that they are in full production with a jointly developed highly integrated cable STB chip. |
| 2005-11-29 | ST, Sagem push MPEG4 set top boxes Sagem Communication will start selling this month MPEG4 capable set-top boxes based on a single-chip decoder from ST Microelectronics targeted at HDTV capable models. |
| 2007-05-18 | ST, SAES team on multi-axis MEMS gyroscopes The SAES Getters Group and STMicroelectronics (ST) have signed a co-operation agreement that will support development and production of next-generation MEMS gyroscopes. |
| 2009-01-15 | ST, Paratek cooperate on RF tunable products Paratek and STMicroelectronics have partnered to supply RF tunable products to mobile wireless markets. |
| 2006-05-05 | ST, others join coaxial cable alliance The Multimedia over Coax Alliance announced the newest additions to its growing list of silicon vendors with the addition of STMicroelectronics, Conexant and BroadLight. |
| 2005-05-13 | ST, Octasic deliver VoP telecom ICs STMicroelectronics and Octasic Inc. have signed an agreement to deliver a family of Voice-over-Packet (VoP) telecom ICs. |
| 2008-06-30 | ST, NXP team up to set new global wireless trends NXP and ST announced that their joint venture being set up to address mobile applications will be called ST-NXP Wireless. The venture of these two complementary and formidable forces in the worldwide market will create a new global wireless powerhouse. |
| 2009-11-19 | ST, NXP ink Mifare license agreement The ST-NXP licensing agreement gives operators and vendors widened availability of contactless smart card ICs. |
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