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2013-09-13 ST tweaks gyroscopes for shake-free images on cameras
The new 2-axis and 3-axis gyroscopes operate with a resonant frequency of the sensing mass at around 20kHz.
2006-04-03 ST transceiver targets home automation apps
STMicroelectronics unveiled a power line transceiver designed for compact and cost-sensitive home and building automation applications and remote monitoring systems.
2013-12-05 ST touts low-power, always-on 6-axis inertial motion sensors
The LSM6DB0 is the latest device in ST's iNEMO smart sensor family that combines modern motion sensing with an ARM Cortex microprocessor core.
2011-06-16 ST touts first 2Mbit chip
STMicroelectronics claims to have launched the industry's first 2Mbit serial EEPROM chip for write-intensive applications.
2010-12-06 ST touts F-2 with 'ART Accelerator', Cortex-M4, -M0 plans
STMicroelectronics combined the launch of its new STM32 F-2 series, which hits 150DMIPS when executing code from Flash at 120Mhz, with the announcement of its roadmap for MCUs based on ARM Cortex-M4 and CM0 cores.
2008-09-22 ST toughens further new power MOSFETs
STMicroelectronics has increased further the ruggedness, switching performance and efficiency of power MOSFETs for lighting ballasts, where they are used in the PFC and Half Bridge sections, as well as in switching power supplies.
2007-07-09 ST touch sensors use ATLabs capacitive technology
STMicroelectronics unveils a new family of ultralow-power touch-sensor chips, following the signing of a technology-licensing agreement with the Korea's ATLab Inc.
2005-02-28 ST to use Rambus Fiber Channel, PCI Express apps
ST signed an agreement to license Rambus' RaSer Fiber Channel and PCI Express serial link technologies to be incorporated into the ST 90nm process technology library.
2015-12-15 ST to supply chips for LoRa IoT network
STMicroelectronics will offer a complete line of solutions, including LoRa systems on chips, to accelerate deployments of low-power wide-area networks by mobile network operators.
2007-07-12 ST to shut down U.S. manufacturing operations
Over the next two or three years, ST will wind down operations at its older wafer fabs in Texas and Arizona, and move these to less-expensive plants abroad.
2012-10-10 ST to provide sensor tech for remote monitoring system
The BodyGuardian Remote Monitoring System is enabled by ST hardware and software technology that includes MEMS, STM32 microcontrollers, and analogue components with advanced ST-proprietary algorithms.
2008-01-25 ST to maximize Crolles2 wafer capacity
Alain Dutheil, ST's COO, noted that the total capacity of Crolles2 was 2,500 wafers, adding that this could be raised to 2,800 wafers.
2005-09-26 ST to invest $500 million in Singapore
Alleviating fears about its fab efforts in China, STMicroelectronics Inc. said that it remains committed to Singapore and is on target to invest $500 million in the city state, according to a report from The Business Times.
2007-01-29 ST to import CMOS, change Crolles function
STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs.
2006-02-22 ST to hire 300 more engineers in India
STMicroelectronics said it plans to invest $30 million in Indian operations over the next two years and recruit 300 engineers by the end of 2006.
2007-05-15 ST to explore fuel cell, plastic electronics markets
STMicroelectronics said it expects to bring samples of micro-fuel cells to market in 2009 and to sample biochemical sensors and electronics-on-plastics in 2008.
2005-01-28 ST to exit select IC markets amid 4% sales jump
Amid lackluster results in Q4and a gloomy outlook for Q1STMicroelectronics Inc. (ST) said this week (Jan. 26) that it plans to take a $60 million impairment charge for scaling back its efforts in the modem and other non-strategic chip markets.
2002-03-22 ST to embed IBM speech technology in multimedia processors
STMicroelectronics has signed a memorandum of understanding with IBM Voice Systems concerning voice interface technology for mobile Internet terminals and telematics solutions.
2008-01-21 ST to complete Genesis acquisition
STMicroelectronics has received tenders of approximately 34.6 million shares of Genesis Microchip, representing approximately 91 percent of the outstanding Genesis shares.
2006-02-21 ST to build Chinese TMP factory
STMicroelectronics is planning to spend $500 million on a wholly-owned test, marking and packaging facility in Shenzhen, China.
2007-12-13 ST to boost DTV initiatives with Genesis acquisition
ST and Genesis have announced that they have entered into a definitive agreement for ST to acquire Genesis.
2007-12-28 ST tips three-axis linear accelerometers
STMicroelectronics has released a new solution extending its family of ultracompact 'low-g' linear accelerometers with a three-axis analog-output sensor.
2007-12-18 ST tips 65nm HDD iterative decoding channel
STMicroelectronics is sampling its first 65nm iterative read channel for the low-power mobile segment of hard disk drives.
2009-11-30 ST taps Omron sensor tech for MEMS mic
STMicroelectronics has expanded its portfolio with MEMS microphones that use sensor technology from Omron Corp.
2009-07-31 ST taps GlobalFoundries for 40nm low-power devices
STMicroelectronics and GlobalFoundries have teamed up to develop products based on 40nm low-power (LP) bulk silicon technology.
2009-05-11 ST taps FET's lithium battery tech
STMicroelectronics has signed a commercial agreement with Front-Edge Technology (FET), enabling ST to bring FET's NanoEnergy ultrathin lithium battery technology to a wide range of new markets and applications.
2008-09-24 ST talks about domino logic
Engineers at STMicroelectronics have revealed how to use domino logic, a very fast circuit design style utilized in the highest performance custom designs, in an automated framework.
2008-09-09 ST takes wrap off AC-switch gate driver with supervisor IC
The STCC08 from STMicroelectronics is said to be the first solid-state AC-switch driver to integrate switch-supervision, allowing designers to save board space and reduce workload with a straightforward solution for mains-powered devices designed to meet IEC60335-1 and IEC60730-1 safety standards.
2013-03-20 ST takes 2G and 3G, Ericsson gets LTE modem
CEO Carlo Bozotti promised support for existing products and customers of ST-Ericsson but has revealed STMicroelectronics is wary of an increasingly vertically-integrated mobile devices market.
2004-12-07 ST switch IC tailored for AC/DC converters
ST rolled out a primary-side switch IC for AC/DC converters, designed for DVD players, LCD monitors and STBs.
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