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2008-07-14 Sematech: 450mm program is on track
International Sematech is moving full speed ahead with its 450mm programs, but the question is whether the industry can meet its lofty goals in building 450mm fabs by 2012
2009-10-27 Sematech installs tools in 450mm prototype fab
International Sematech has moved into the "test wafer generation" stage and installed the first tools in its 450mm prototype clean room, including metrology and wet-clean systems
2009-07-06 Sematech continues 450mm campaign
Despite the current downturn, International Sematech claims it continues to make progress on 450mm tool technology by announcing several new efforts in the arena.
2007-11-21 Intel CEO to tool makers: 'Let's cooperate on 450mm
Despite some resistance for 450mm fabs in the market, Intel is moving ahead with 450mm technology and would like to cooperate with the IC-equipment industry in the arena, according to Paul Otellini, president and CEO of the chip giant
2007-07-25 Foundry tool makers cool to Sematech 450mm plan
Sematech's announcement of a plan to hasten the industry's move to 450mm wafers has driven a wedge between the semiconductor equipment community and some chipmakers
2010-01-15 Downturn, low support further delay 450mm
Despite rumblings about possible delays for the next-generation wafer size, leading fab tool companies still resist to support 450mm technology
2008-07-21 450mm debate remains in the hot seat
The 450mm debate rages on. At the Semicon West Trade Show, SEMI and many fab-tool vendors earlier this week telegraphed their position on 450mm, reiterating that the economics do not add up for the next-generation wafer size
2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012
2011-05-17 TSMC expands R&D efforts with Sematech affiliation
TSMC is now one of the core members of Sematech. This will accelerate the improvement of R&D and manufacturing solutions in leading edge technologies
2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016
2009-11-25 Sematech expands, muses fabless push
Sematech is looking at ways to bring fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers
2008-06-12 Samsung gains edge in 450mm technology
Sources said the first 450mm tool, which is believed to be a R&D prototype, is said to go to South Korea's Samsung Electronics Co. Ltd
2004-10-08 Matsushita joins Sematech manufacturing initiative
The Semiconductor Company of Matsushita Electric Industrial Co. Ltd has joined the International Sematech Manufacturing Initiative (ISMI) effective Friday Oct. 1, Sematech said Tuesday (Oct. 5
2007-10-31 Fab tool vendors on 450mm move: 'Flawed and misguided
Fab tool vendors called Sematech's 450mm fab program flawed and misguided, and argued that moving to the next-generation wafer size would yield little or no cost benefit
2007-10-26 AMD puts 450mm fab transition on hold
Adopting a different approach than rival Intel Corp., Advanced Micro Devices Inc. (AMD) is set on maximizing utilization of existing 300mm fabs before moving to the larger 450mm wafer size
2010-01-25 450mm, EUV, TSVs suffer further delays
IC Insights sees more delays for two emerging and key IC manufacturing technologies: 450mm and extreme ultraviolet (EUV) lithography
2007-10-30 450mm tool testing facility in Sematech's agenda
Sematech is proposing to establish a "factory integration test bed" facility for the development of 450mm fab tools
2009-01-19 450mm fab spins new round of debate
The Industry Strategy Symposium (ISS) witnessed the next round of the 450mm fab debate
2003-07-21 Chip roadmap to get wireless upgrade
Semiconductor industry representatives from around the world gathered to consider changes to the chip roadmap at the 2003 International Technology Roadmap meet
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2010-11-18 Semiconductor equipment industry flounders
The semiconductor equipment industry has been experiencing tough times since 2007 and is in a difficult position to face today's challenging economic conditions.
2010-07-21 Migration to 450-mm: To be or not to be?
While no major 450-mm announcements were made at Semicon West, fab tool makers are anticipating a major development to either fast-track or push out plans for the next-gen wafers.
2007-11-05 Intel pushes for common platform in fabs
Intel is interested in having a common and standard "vacuum processing platform" throughout its fabs.
2010-01-06 Fearless IC forecasts for 2010
2010 is just beginning to unfold in the electronics industry and there is already uncertainty in the air. EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2009-07-22 Fab tool collaboration: Mission impossible?
Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projectsjust to help the industry keep pace on Moore's Law?
2011-01-21 Does the fab tool business model need mending?
Fewer fabs coupled with cyclical downturns have caused massive consolidation in the fab tool industry. While some insist the industry should further consolidate to make it more efficient, others fear that fewer players could lead to higher tool costs and monopolies.
2009-01-06 2009 IC fearless forecasts
2009 is just beginning to unfold in the electronics industry and there is already a looming uncertainty based on recent industry data.
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