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What is an EEPROM?
Electrically Erasable Programmable ROM or EEPROm is a rewritable memory chip that holds its content without power. The two main categories of EEPROM interfaces are Serial bus and Parallel bus. These interfaces require between 1 and 4 control signals for operation, resulting in a memory device in an 8-pin (or less) package. Most common EEPPROM serial interface types are SPI, I²C, Microwire, UNI/O, and 1-Wire.  (Souce: EE Times, Wikipedia http://en.wikipedia.org/wiki/EEPROM)
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2009-03-26 Power supply ref design promises 94% efficiency
Fairchild Semiconductor now offers RD212, a 200W DC/DC power supply reference design that makes it easier for designers to develop more efficient power supplies and to meet stringent energy efficiency specification.
2010-01-27 PoL DC/DC converters enable design flexibility
Based on 600kHz synchronous buck topology, the new converters offer power conversion efficiencies of 93 and 92 percent respectively.
2012-12-05 POL converters tout ultra-miniature packaging
Renesas' RAA20770X series is geared for personal computers, servers, industrial, office automation and networking equipment.
2008-05-23 POL converters deliver high power efficiency
Power-One's new series of DC/DC converters uses topologies that help generate efficient power conversion in communications and server applications.
2010-06-18 PoL converter supports 500?F load capacitance
Extending its range of Okami non-isolated PoL DC/DC converters, Murata Power Solutions has introduced the OKI-78SR series of switching regulator converters for industrial applications.
2006-05-10 PoE interface modules drive down component count, cost
C&D Technologies' family of fully-integrated powered device interface modules aim to reduce component count, design time and installation cost of Power-over-Ethernet applications.
2008-10-13 PMC-Sierra enlists GPON devices for FTTH deployments
PMC-Sierra Inc. claims the industry's most highly integrated GPON devices for Fiber-to-the-Home deployments.
2011-08-29 Placement system touts high-speed die bonding
Single machine solution eases IC manufacturing with die bonding speeds at 3,500cph per head at 25?m.
2006-10-20 Phone systems offer full IP telephony, mobile functions
Oki Electric has released two new key telephone systems with full scale IP telephony and mobile functions.
2006-03-21 Philips, Samsung showcase mobile TV solutions at IIC-China
At the recently concluded IIC-China, Philips Semiconductor and Samsung Electronics demonstrated their respective solutions targeted at the mobile TV market.
2005-06-27 Philips Semiconductors CEO sets out platform for the future
Six months after taking charge of Philips Semiconductors as President and CEO, Frans van Houten, has survived the inaugural phase of his leadership with a smile.
2005-03-17 Philips debuts reference design for converged handsets
Philips Electronics took the wraps off a complete Unlicensed Mobile Access (UMA) reference design for converged mobile handsets at the CTIA Wireless show Monday (March 14) and said it is working with Alcatel on interoperability tests between UMA handsets based on the Nexperia reference design and the French group's Spatial Atrium server/softswitch
2005-02-08 Philips commences Nexperia based EDGE handsets
Royal Philips Electronics has commenced mass production of its first EDGE cellular system solution.
2005-02-15 Philips aids handset manufacturers to speed up design
Philips announced its first dual mode UMTS/EDGE Nexperia Cellular System Solution 7130, which it is demonstrating in this week's 3GSM World Congress in France.
2008-01-02 Perform integrated HW/SW verification
As the lines marking the responsibilities of HW/SW teams and who is responsible for implementation and debug are getting blurred, new methodologies must be adopted to effectively validate an entire IP or silicon solution. The ability to efficiently and optimally design, and perform system-level verification can result in a significant competitive advantage, especially as software solutions become expected deliverables along with complex IP or silicon.
2004-03-16 Passive integration activates wireless
The PiiP concept is a unique design approach for integrating package-level design into the silicon world via BiCMOS SiGe process.
2008-01-09 Partners aim to bring China DTV standard in handhelds
Legend Silicon and Sharp Corp. will develop an integrated single-chip solution that will enable mobile devices in China to receive GB20600-2006 terrestrial DTV broadcasts.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions.
2007-10-04 Panasonic appoints Digi-Key distributor of Zigbee modules
Panasonic Industrial Company has announced the appointment of Digi-Key as an authorized distributor for its latest in a line of RF modules, the PAN4555.
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development.
2014-12-17 Packaging and testing industry trends from 2013 to 2014
In 2014, the output value of OSAT industry is seen to grow by 8.4 per cent and the advanced packaging industry is expected to increase by 10 per cent.
2012-08-23 Overcoming embedded memory bottleneck (Part 2)
Here's a closer look at the specifics of how algorithmic memories work and how the techniques can be integrated into a system.
2012-08-17 Overcoming embedded memory bottleneck (Part 1)
Learn about the concept of algorithmic memory and the benefits of memory operations per second (MOPS) as a metric.
2006-09-01 One-chip core logic eyes ultramobile PCs
Via Technologies Inc. is set to launch a single-chip core logic platform that squeezes a host of connectivity options and multimedia acceleration into a 35mm2 footprint.
2004-05-21 Oki NT VoIP gateways suit toll-quality QoS
Oki NT has released two VoIP broadband media gateways - the BV7100 and the BV7060 series.
2015-05-06 NXP, Qualcomm to bring 'Apply Pay' to Android phones
The collaboration between the two will go beyond mobile payment applications for smartphones. They plan to develop new reference designs to expand the reach of NFC into other applications.
2007-10-24 NXP, Cadence ink multiyear EDA partnership deal
Cadence Design Systems and NXP Semiconductors have announced the signing of a multiyear strategic agreement that positions Cadence as NXP's primary EDA solutions partner.
2006-01-16 NoC: A new venue for system innovation
The SoC concept has evolved through a number of design challenges over the years and so has the number of semiconductor IP blocks.
2008-09-22 Next-generation embedded packaging solution rolls
Imbera Electronics introduces its next-generation integrated module board technology, available across the company's full range of turnkey manufacturing services.
2006-06-05 New EMI filters optimized for Vicor V-I chip
Picor has expanded its QPI QuietPower input filter product line with two product additions that are optimized for use with Vicor's V-I Chip devices.
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