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2010-10-14 Silicon Integration Initiative gets new member
Tanner EDA cites EDA tool interoperability as reason for joining Silicon Integration Initiative
2011-01-27 Silicon Image designs 'connectivity co-processor' for smarter TVs
Silicon Image will launch a connectivity co-processor for TV to help TV makers' turn today's "not-so-intelligent TVs to smart TVs." The solution could also stimulate more SoC competition on the consumer market for OEMs
2011-06-09 Design firm debuts Silicon One initiative
Magma Design Automation has launched Silicon One, an initiative that is intended to make silicon profitable for customers
2008-09-30 Asian start-ups to get hold of silicon shuttle services
HKSTP and e-Shuttle Inc. have signed an agreement to provide silicon shuttle services for start-up IC design houses in Asia
2011-05-27 Analog partner program targets first-time silicon success
Analog Bits started launching its partnership program to enhance the semiconductor design ecosystem prioritizing first-time silicon success among its analog partners
2007-11-30 AMD 'accelerated computing' initiative gains ground
Although only few commercial products have emerged as yet from the accelerated computing initiative announced by AMD last year, the company believes it has moved the effort past the first phase of a three-stage strategy to make specialized processing engines more commercially viable
2002-09-11 Entegris, Tru-Si partner on wafer handling initiative
Entegris Inc. and Tru-Si Technologies have formalized a nonexclusive open alliance to support thin silicon wafer handling in the semiconductor industry
2013-07-10 Dow Corning boards Imec's 3D IC packaging initiative
Dow Corning has teamed up with Imec to advance enabling technologies for 3D IC semiconductor packaging.
2006-05-15 Synopsys, Si2 to form Liberty modeling standard board
Synopsys and the Silicon Integration Initiative plan to form a technical advisory board to facilitate the evolution of the Liberty library modeling standard.
2006-10-13 Si2 to facilitate standardization of common power format
Cadence and the Silicon Integration Initiative have agreed on Si2 facilitating standardization of the Common Power Format through the IEEE.
2013-06-03 Si2 set to unveil PDN Standard for 3D integrated ICs
The 3D IC Design Exchange Format Standard for Power Distribution Networks describes a unified interface protocol for both Power/Ground and signal ports for die-2-die and package-2-PCB interfaces.
2002-02-05 Si2 renews push for adoption of OLA
Silicon Integration Initiative Inc. (Si2) will try to proliferate the adoption of its Open Library Architecture (OLA) standard this month when it announces that several EDA companies have committed to back its efforts.
2006-10-16 Power standard standoff reaches stalemate
Participants behind two rival efforts to define a standard IC power description format are attempting to make their initiatives more inclusive.
2005-01-03 OpenAccess adoption challenging, worth it
Adopting OpenAccess database brings benefits to chip designers, but it's a challenging task that should not be taken lightly.
2006-12-01 EDA vendor rivalry bogs single power spec
Amid calls for a single power spec throughout the design flow, EDA vendor rivalry continues to fuel two separate efforts to develop a low-power description standard.
2006-09-18 EDA rivals spar over power issues
Any EDA vendor or large EDA user will tell you there's a compelling need for a standard way to express power-management intent throughout the IC design flow. The problem is that two separate groups are working toward that objective, amid profound disagreements over how to get there.
2006-10-06 Coalition seeks to unify IC power standards efforts
The Silicon Integration Initiative launched the Low Power Coalition which may help unite two disparate efforts for standardizing a power specification format.
2005-11-29 Coalition regroups in design-to-mask bid
The Silicon Integration Initiative launched a design-to-mask coalition last year with a grand visiona "universal data model" that would extend from IC design through manufacturing. But the challenge proved harder than it looked, and is now taking the coalition into a second, more pragmatic, phase.
2006-11-06 Cadence, Si2 team up for unified low-power standard
Cadence and Silicon Integration Initiative partnered to enable a common industry standard for low-power design, implementation and verificationthe Common Power Format.
2006-05-05 ST, others join coaxial cable alliance
The Multimedia over Coax Alliance announced the newest additions to its growing list of silicon vendors with the addition of STMicroelectronics, Conexant and BroadLight
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability
2004-12-15 Mentor adds more functions to Calibre platform
Mentor announced additional functionality for its Calibre design-to-silicon platform in the form of Calibre Transition, Measure and Analyze
2005-07-18 Nanotech conference plots future of electronics
Presenters at the First International Nanotechnology Conference on Communication and Cooperation have identified key issues facing nanotechnology.
2010-11-04 LAST POWER Project aims to develop advanced SiC and GaN semicon
The partners in a new publicly-funded European research project have just announced details of the multinational/multidisciplinary program called LAST POWER (Large Area silicon carbide Substrates and heTeroepitaxial GaN for POWER device applications
2007-09-14 Jazz fortifies post in analog, mixed-signal markets
Jazz Semiconductorhas announced its Analog-Intensive Mixed-Signal initiative to strengthen its position in price/performance and power consumption for specialty CMOS technologies and quicken time-to-revenue for analog-intensive products
2009-07-13 Eyeing Intel's strides in SoC biz
Intel Corp. isn't giving much detail on its two-year old initiative to become an SoC supplier. But interviews with executives and analysts show the company is making gradual progress laying the foundations to build competitive SoCs
2009-07-08 Coming soon: Carbon chips
Carbonthe basis of all organic compoundsseems destined to displace silicon as the material of choice for future semiconductors
2001-05-01 Cadence's 'all-in-one' tool gets skeptic reviews
Cadence's Integration Ensemble (IE) is the first single tool that can take a hierarchical chip design all the way from synthesizable RTL code through a GDSII layout file and designers are raising an eyebrow if it will perform as well as it promises
2008-10-24 450mm wafer standard gets industry nod
Hoping to accelerate the development of 450mm fabs, International Sematech and others have formulated a preliminary standard for 450mm silicon wafers
2007-01-25 Virage Logic joins Low Power Coalition
Virage Logic has joined Silicon Integration Initiative's Low Power Coalition, a unified effort that aims to create a common format for low-power design, implementation and verification.
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