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2007-10-04 Infineon, Hosiden co-develop silicon microphones
Infineon Technologies and Hosiden announced they have partnered on silicon microphones activities
2015-12-14 Imec showcases next-gen devices to supersede silicon
Imec's R&D programme on advanced logic scaling is targeting the latest and mounting challenges for performance, power, cost and density scaling for future process technologies.
2009-10-06 IMEC pushes 3D integration of DRAM on logic
IMEC and its 3D integration partners have prototyped a DRAM chip integrated on top of a logic IC
2015-03-02 imec announces WDM hybrid CMOS silicon photonics transceiver
The SiPh chip, fabricated on imec's 25Gb/s Silicon Photonics Platform, includes an array of four compact 25Gb/s ring modulators, coupled to a common bus waveguide to allow WDM transmission
2004-12-17 IBM, AMD develop strained silicon transistor tech
IBM and Advanced Micro Devices Inc. (AMD) have developed strained silicon transistor technology aimed at improving processor performance and power efficiency
2012-12-12 IBM says silicon nanophotonics ready for chip manufacturing
IBM announced that its silicon nanophotonics technology can help solve bandwidth limitations of servers and data centres
2002-12-16 High integration makes IPSec fly
Integrating encryption circuitry into the same silicon as the network processor adds security functionality into the network processor while maintaining wire rate and minimizing new silicon area
2003-03-31 Goyatek to provide integration services to ISSI
Goyatek Technology Inc. has been tapped by Integrated Silicon Solution Inc. to support its Embedded Search IP product line
2012-06-04 Globalfoundries to demo enhanced silicon-validated design flow
According to the company, the flow provides proven and complete front-to-back support for advanced analog/mixed-signal (AMS) design using the industry's latest design automation technology.
2005-05-05 Fujitsu team develops single-chip opto-silicon technology
Fujitsu Laboratories Inc. and the Tokyo Institute of Technology have developed a technology to form high quality ferroelectric crystal film on silicon, opening the way for a single-chip platform integrating optical and silicon devices
2006-09-13 Frontier Silicon, SigmaTel DAB partnership eyes Chinese arena
Frontier Silicon and SigmaTel are partnering up to offer a combined digital audio broadcasting, FM and MP3 player platform for portable devices, targeted at Chinese OEMs
2006-11-30 Frontier Silicon unrolls 'smallest' DAB radio module
Frontier Silicon has launched the Capri FS3010, a DAB digital radio module touted to be the industry's smallest and lowest-cost
2002-01-22 Frontier Silicon to penetrate global digital broadcasting market
Fabless semiconductor startup Frontier Silicon claims to have established a new approach to highly integrated SoC silicon that will enable mass-market penetration of digital multimedia technology
2005-02-22 Frontier Silicon rolls out 'smallest RF tuner for T-DMB
Frontier Silicon launched its first tuner chip for digital multimedia broadcasting (T-DMB) apps
2002-01-21 Flextronics aligns with Virtual Silicon for SoC IP
Virtual Silicon Technology Inc. has formed a comprehensive ASIC IP sourcing agreement with Flextronics Semiconductor
2010-07-13 EVG, IME join hands on 3D IC integration
EV Group and Singapore's Institute of Microelectronics (IME) signed a two-year agreement to cooperate on developing 3D IC integration technologies
2012-09-26 Erbium-silicon chip acts as optical amplifier
Silicon and erbium integrated on a single chip has the ability to amplify light up to 170 gigabits per second
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm
2010-01-12 DTV design platform eases interface integration
The integrated hardware and software platform lets multiple ASSPs be designed into one device tailored for DTV apps.
2002-09-24 Dolphin Integration: Taiwan foundries acquiring design capabilities
Outsourcing fab responsibilities to Taiwan was adopted by many companies to deverticalize the chip industry. But design changes are slowly creeping in.
2016-03-08 Developments in MEMS integration
Learn about the advances in MEMS industry aimed at tackling the integration challenges head on at the package, wafer and die levels
2006-03-20 Development tools support wireless USB silicon
WiQuest's reference design tool provides an integrated end-to-end approach in designing Wireless USB products.
2015-11-19 Detect corner-case issues with post-silicon testing
Here is a look at the various areas identified for post-silicon stress tests on automotive SoC to enable early detection of system level issues
2012-05-10 Design suite speeds up programmable systems integration
Xilinx's Vivado Design Suite addresses the major bottlenecks in programmable systems integration
2011-06-09 Design firm debuts Silicon One initiative
Magma Design Automation has launched Silicon One, an initiative that is intended to make silicon profitable for customers
2008-06-16 Commentary: Integration in wireless SoCs may be cost-defective
The industry faces an interesting dilemma then: How much functionality should it integrate on a single device to be cost-effective?
2013-01-31 Cisco banks on silicon photonics for 2.5D, 3D ICs
Cisco is one of many firms pushing silicon photonics on 2.5D and 3D chips to lessen the cost of next-generation networks
2005-05-30 Choose the best IC integration method when designing a 3G handset
When designing a 3G handset, what's the best IC integration method�system-in-package or system-on-chip
2007-07-10 China digital STB maker picks Freescale silicon tuner
Freescale Semiconductor has announced that its MC44S803 silicon tuner has been selected by Chinese DTV STB manufacturer Jiangsu Yin He Electronics
2015-01-09 CEA-Leti describes true 3D monolithic integration
According to the research institute, the CoolCube technology no longer relies on tall through silicon vias (TSVs) and coarse redistribution layers typically used for wafer-on-wafer die stacking
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