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2012-09-24 Enabling soft networks with SoC silicon
Find out how to address the need for a more powerful networking building block to enable a softer, more dynamic network.
2003-01-09 EDA's unique opportunity in the silicon value chain
As design sizes shrink toward 90nm, a new set of problems has arisen. Signal integrity, design for test, verification, and design reuse are becoming ever more critical in addressing today's increasing design complexities.
2006-03-08 Crosspoint switch claims highest level of integration
Intersil announced the ISL59532 32 x 32 video crosspoint switch, which integrates four separate 16 x 16 crosspoint switches to create a 32 x 32 matrix (or two 32 x 16 switches).
2004-11-03 Cellular silicon a tough nut with high growth
The evolution of the cellular handset industry has been beneficial as well as challenging for chipmakers, as they quickly integrate new technologies into many wireless handsets, prompting users to upgrade their phones.
2006-05-15 Synopsys, Si2 to form Liberty modeling standard board
Synopsys and the Silicon Integration Initiative plan to form a technical advisory board to facilitate the evolution of the Liberty library modeling standard.
2006-05-05 ST, others join coaxial cable alliance
The Multimedia over Coax Alliance announced the newest additions to its growing list of silicon vendors with the addition of STMicroelectronics, Conexant and BroadLight
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability
2006-10-13 Si2 to facilitate standardization of common power format
Cadence and the Silicon Integration Initiative have agreed on Si2 facilitating standardization of the Common Power Format through the IEEE.
2013-06-03 Si2 set to unveil PDN Standard for 3D integrated ICs
The 3D IC Design Exchange Format Standard for Power Distribution Networks describes a unified interface protocol for both Power/Ground and signal ports for die-2-die and package-2-PCB interfaces.
2002-02-05 Si2 renews push for adoption of OLA
Silicon Integration Initiative Inc. (Si2) will try to proliferate the adoption of its Open Library Architecture (OLA) standard this month when it announces that several EDA companies have committed to back its efforts.
2005-01-03 OpenAccess adoption challenging, worth it
Adopting OpenAccess database brings benefits to chip designers, but it's a challenging task that should not be taken lightly.
2012-03-15 Electronics firms clamour for more collaboration
Executives of Cadence, TSMC and ARM are calling for other companies to step up their collaborations to deal with the growing complexity of technologies of semiconductor design.
2006-12-01 EDA vendor rivalry bogs single power spec
Amid calls for a single power spec throughout the design flow, EDA vendor rivalry continues to fuel two separate efforts to develop a low-power description standard.
2006-10-06 Coalition seeks to unify IC power standards efforts
The Silicon Integration Initiative launched the Low Power Coalition which may help unite two disparate efforts for standardizing a power specification format.
2005-11-29 Coalition regroups in design-to-mask bid
The Silicon Integration Initiative launched a design-to-mask coalition last year with a grand visiona "universal data model" that would extend from IC design through manufacturing. But the challenge proved harder than it looked, and is now taking the coalition into a second, more pragmatic, phase.
2005-03-17 Chips ferry pro audio over Ether cable
Cirrus Logic is unveiling silicon that combines its 49K series of 32bit DSPs with the CobraNet control silicon first deployed in 2003
2006-11-06 Cadence, Si2 team up for unified low-power standard
Cadence and Silicon Integration Initiative partnered to enable a common industry standard for low-power design, implementation and verificationthe Common Power Format.
2004-07-21 Zoran targets multimedia, HDTV
Levy Gerzberg was a few blocks away at Stanford University when Jim Clark took his Geometry Engine technology and founded Silicon Graphics Inc
2002-08-16 Zarlink RF tuner replaces double-conversion tuners
The SL2610 RF silicon tuner is claimed to be the first tuner chip that allows compact, single-conversion tuner designs to achieve the same level of performance as double-conversion tuners
2003-01-29 Xanoptix stacks chips to create hybrid ICs
Startup Xanoptix Inc. has developed a wafer-scale manufacturing process that allows silicon die, optical semiconductors, and compound semiconductors such as GaAs and InP chips to be stacked into 3D structures to create hybrid ICs
2002-02-27 Wireless Futures partners with CSR for development of Bluetooth modules
Wireless Futures has joined Cambridge Silicon Radio's module partner program, which aims to enable a fast and reliable route to Bluetooth integration.
2007-03-21 Wi-Fi radio ref platform enables $79 audio systems
In addition to its ability to play audio via Wi-Fi, DAB and FM, another feature of Frontier Silicon's Jupiter 4 radio platform is its capability to support the new DAB+ standard
2003-08-12 VSI Alliance adds new members
Gaining new support from the semiconductor industry, the Virtual Socket Interface Alliance has added three new companies to its board of directors.
2015-09-11 Upcoming IEEE conference to focus on key IoT tech
The emerging IoT market is looking for older nodes with lower development costs, broad range of process options, with many more players both at the foundry side and the design side.
2006-11-30 Under circuit void makes thinnest chips
The Institute for Microelectronics Stuttgart has developed a method to create IC die that are just 20?m thick, claiming them as the world's thinnest silicon chips
2005-06-17 UMC shrinks Nitrided Gate-oxide thickness to 1.0nm
Taiwan semiconductor foundry United Microelectronics Corp. (UMC) revealed that its R&D team has reduced the equivalent oxide thickness (EOT) of nitrogen doped silicon oxide (Oxy-nitride, SiON) gate dielectrics to about 1.0nm using a new nitrogen profile engineering technique
2007-02-01 TV-on-a-chip simplifies entire DTV design
Broadcom Corp. rolled out a "television-on-a-chip" that the company calls the first digital HDTV silicon solution to support full 1,080p display resolution
2006-06-05 Tuner IC receives analog, digital terrestrial broadcasts
Royal Philips Electronics recently unveiled a multi-standard hybrid silicon tuner IC capable of receiving both analog and digital terrestrial broadcasts
2002-06-17 Toshiba enhances embedded DRAM with SOI wafer
Toshiba Corp. has accomplished a breakthrough in embedding DRAM on SOI wafers, which ends the DRAM performance degradation typical of such integration
2004-02-02 Toolset eyes process test-chip design
Silicon Canvas released a platform for process test-chip development that is designed to help foundries create test chips to verify, optimize and calibrate silicon processes
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