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2004-03-15 Philips tuner chips simplify circuit board design
Royal Philips Electronics has unveiled two silicon tuner chips that promise to simplify the entire circuit board design
2005-10-17 Philips addresses gain requirements of RF, microwave apps
Philips introduced QUBiC4X, the latest addition to its QUBiC4 family of high-performance BiCMOS process technologies.
2003-01-02 Philips achieves 0.12?m SoC solutions
Philips Semiconductors has become one of the first silicon companies to provide SoC solutions at an advanced process technology
2004-05-07 Peregrine DSAs impress with IP3 spec
Peregrine has introduced a family of Digital Step Attenuators that demonstrate new levels of broadband linearity, attenuation accuracy, and programming flexibility.
2003-06-05 PDF Solutions supports Artisan ServiceNet program
PDF Solutions Inc. has announced its membership in Artisan Components Inc.'s ServiceNet strategic partnership program.
2013-10-25 Oracle inches closer to macrochip vision with low-power laser
Oracle Labs is developing a low-power laser it hopes will be a significant driver in the adoption of silicon photonics
2002-09-09 Oki Electric, UMC/UMCJ broaden design alliance
The foundry partnership between Oki Electric Ind. Co. Ltd, United Microelectronics Corp., and UMC Japan, has been expanded to include the system LSI design alliance for mutual IP development and availability.
2007-06-11 NXP, Afa hatch portable TV solution
NXP and Afa Technologies plan to develop an ultralow power DVB-T front-end solution for portable viewing devices.
2010-03-22 Novellus, IBM launch 3D TSV program
Novellus Systems and IBM Corp. are opening a joint development program to design a manufacturing-worthy, copper-based, 3D semiconductor through-silicon via (TSV) process
2007-04-16 Next-gen handsets call for balance
The one constant in cellphone design is change. This article discusses the latest handset design trends and their implications.
2003-03-12 New center targets epitaxial technology advancement
Veeco Instruments Inc. has opened a 15,000-square foot epitaxial Process Integration Center adjacent to its molecular beam epitaxy manufacturing operations in Minnesota, U.S.A
2003-03-12 NEC to integrate Tera Systems technology in ISSPs
NEC Electronics Corp. has selected Tera Systems Inc.'s TeraForm RTL Design Consultant and Virtual Prototype technologies to be included in its Instant Silicon Solution Platform OpenCAD design flow
2005-07-18 Nanotech conference plots future of electronics
Presenters at the First International Nanotechnology Conference on Communication and Cooperation have identified key issues facing nanotechnology.
2006-02-13 Nanophotonics tech facilitates optical data transmission in LSI ICs
NEC announced the development of fundamental silicon (Si) nanophotonics technology that facilitates optical data transmission in LSI chips by eliminating data transmission bottlenecks
2002-04-05 NanoOpto seeks opto builders for its pillar structures
NanoOpto Corp. will work with developers of passive and active optical elements to identify optoelectronic products that could make use of the company's passive pillar elements, CEO Barry Weinbaum said.
2004-11-17 Mitsumi selects Microtune analog/digital tuner for STB RF module
Mitsumi Electronics Corp. has developed an integrated tuner/demodulator subsystem using Microtune Inc.'s MT2111 silicon tuner as the core RF component
2004-04-29 Microtune cuts power for VoIP designs
Microtune said it will help cable modem designers reduce overall power consumption in VoIP designs with the release of a silicon tuner that consumes <1W
2004-12-15 Mentor adds more functions to Calibre platform
Mentor announced additional functionality for its Calibre design-to-silicon platform in the form of Calibre Transition, Measure and Analyze
2008-08-18 Memory rests hope on floating-body cells
Intel Corp. revisited its research on floating-body cells (FBCs) for advanced cache designs in microprocessors during the 2008 Symposium on VLSI technology in Hawaii.
2006-02-16 MCUs target apps that require USB connectivity
Silicon Laboratories' C8051F34x MCU family has been designed to meet the demands of apps that require USB connectivity and high-performance analog, high-performance CPU processing and larger memory footprints
2003-12-26 LVL7 software platform has VxWorks, Linux OS
LVL7 Systems has announced that its Fastpath software is now integrated with VxWorks and Linux OSs as well as PowerPC, MIPS and ARM CPUs.
2010-11-04 LAST POWER Project aims to develop advanced SiC and GaN semicon
The partners in a new publicly-funded European research project have just announced details of the multinational/multidisciplinary program called LAST POWER (Large Area silicon carbide Substrates and heTeroepitaxial GaN for POWER device applications
2004-02-25 Laser lift-off technique to yield biodetection chip
A highly diverse integration technique based on a process called laser lift-off is being combined with system-on-chip processing technology and MEMs concepts
2002-07-10 JMAR announces breakthrough in lithography technology
JMAR Technologies Inc. is using "Collimated Plasma Lithography" to more accurately describe its breakthrough technology for processing higher performance silicon and GaAs chips
2005-01-04 Japanese companies look to integrate, not outsource
Outsourcing and fabless foundry business strategies are common in the semiconductor industry, but Rohm, Sony and Renesas are seeking more integration
2007-01-01 Japan firm grows blue LED on wafer
Shimei Semiconductor's blue LED on a silicon wafer promises to slash the cost of device and ease its integration into CMOS circuits.
2009-10-19 ITRI, Applied Materials push 3D IC dev't
Applied and ITRI will work together as members of the Stacked-System and Application Consortium
2007-01-16 IP pact expands use of MIPS cores
Fabless ASIC provider Open-Silicon Inc. has expanded its intellectual property (IP) chip and library offerings by signing a deal with MIPS Technologies Inc
2014-12-03 IP company provides one-stop solutions for IoT devices
Aside from offering low-power Silicon IP components for IoT devices, Dolphin Integration targets consistent IP verification services.
2006-01-31 Intel tips 45nm process, demos chips
Intel disclosed initial details of its 45nm process. Dubbed P1266, the process incorporates copper interconnects, low-k dielectrics, strained silicon and other features
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