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2006-08-03 SiP tech stacks logic, gigabit-class memory in one package
NEC Corp., NEC Electronics Corp. and NEC Electronics America Inc. unveiled a new system-in-package technology capable of stacking logic and gigabit-class memory in a single package.
2006-08-22 New dice interconnects support up to 100Gbps
NEC Electronics has a wafer-level packaging technology that it says permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
2006-10-02 3D interconnects transmit at 100Gbps
NEC Electronics has launched a wafer-level packaging technology that allows more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
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