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2012-09-05 FormFactor to buy SoC wafer test firm
FormFactor signed a merger agreement with Astria Semiconductor to acquire MicroProbe for $100 million in cash and $16.8 million in stock.
2012-10-16 TSMC preps CoWoS test car with JEDEC Wide I/O DRAM Interface
The company's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component
2011-07-12 Test system targets 3D, 28nm node ICs
Verigy has released a new generation of test systems for advanced semiconductor designs, including 3D device architecture and IC designs for 28nm technology node and beyond
2006-03-22 SMIC to employ UltraFLEX system for high volume wafer testing
Teradyne disclosed that SMIC has selected its UltraFLEX test systems for high volume wafer testing
2010-08-02 Shorten test time with package-based MBIST strategy
Test time is a significant component of ASIC cost. It needs to be minimized and yet has to have maximum coverage to ensure zero-defect scenario for an automotive application
2004-02-02 Serial storage SoCs demanding to test
The storage industry this year began widespread implementation of serial-based technologies to replace parallel physical-interface standards currently used to connect a system bus to disk storage devices.
2013-07-10 Production test system reduces test costs for SoC devices
J750Ex-HD includes system enhancements and new High Density (HD) instruments which can be used with over 4,000 J750 and IP750 installed test systems to run new and existing test programs
2001-04-15 New thinking needed amid runaway test costs
There is a need to achieve test-cost reductions that rival the reductions in wafer fabrication costs to ensure continued growth of semiconductor markets. ATE should not wait for someone else to do it
2003-07-23 Japan opens joint test line for 90nm designs
Advanced SoC Platform Corp. will begin shuttle services later this year using its 300mm wafer-prototyping line and 90nm process technology
2003-07-02 Japan opens joint test line for 90nm
A research center funded by the Japan government and the semiconductor industry has opened a 300mm wafer line to test and develop specs for 90nm and finer process technologies
2007-02-16 Integrate 'hard' IP into an SoC
During the course of delivering such IP over the past several years, Impinj has witnessed a range of IP integration experiencesfrom the painless to the nearly disastrous. Most of the pitfalls can be avoided by following a few recommendations.
2012-08-09 Improve SoC yields with diagnostic and repair tools for embedded memory
Learn about embedded memory test solutions, including fault detection in very deep submicron technologies, repair at the manufacturing level, as well as diagnosis for process improvement and field repair capabilities
2005-04-18 DATE minds offer an array of fixes for SoC design
Designing high-performance SoCs needs a breakthrough from system-level design through manufacturing, according to DATE.
2007-07-19 Amkor, IMEC sign 3D wafer-level packaging pact
Amkor has agreed to develop 3D integration technology with IMEC based on its wafer-level processing techniques
2002-10-16 Passing the SoC test with flying colors
The key concern of product developers, SoC design houses and wafer fabs is to provide higher performance and functionalities of SoC at the lowest cost
2010-09-21 VOICE 2011 Forum on Semiconductor Testing Technologies call for papers
The VOICE 2011 Forum on Semiconductor Testing Technologies is now accepting papers from the international community.
2003-06-27 Ultratech readies gear to fab sub-65nm chips
Ultratech said that it has optimized its laser thermal processing (LTP) technology to form junctions down in the 20nm technology node, and is now ready to enter the commercialization phase of its LTP program.
2012-10-17 TSMC names EDA partners for CoWoS, 20nm
TSMC has validated technologies from Cadence, Mentor and ANSYS for use in its 20nm and CoWoS design infrastructure.
2002-12-09 Tower licenses Virage Logic embedded memories
Wafer foundry Tower Semiconductor Ltd has licensed several of Virage Logic Corp.'s embedded memories as part of a multi-year licensing agreement
2015-10-20 Spotlight on the Apple A9 processor: Samsung vs. TSMC
Test revealed that while the chip from both foundries are supposed to perform identically, the manufacturing processes used by TSMC and Samsung are not the same
2007-07-17 Rise of mixed-signal SoCs hints at changing analog market
Despite such well-reasoned doubts, market statistics show an analog IP market on the rise. The analog and mixed-signal IP market grew 34 percent in 2006, accounting for 16 percent of the overall design IP market, says Gartner.
2005-06-16 Platform SoCs now possible
To a large extent, platform SoCs have been science fiction--until now. Such designs can span a wide range of markets.
2013-10-03 Online quoting service drastically cuts MPW quote time
eSilicon's automated, instant, online quoting service for MPW Shuttle Services takes only around 15 minutes, a vast improvement from the usual process that takes 40 hours.
2003-01-17 Motorola pare plants, seeks 300mm partner
In 2000, Motorola Inc.'s Semiconductor Products Sector had 27 front-end and back-end manufacturing sites. By the middle of this year, the company will have reduced that number to 10.
2002-08-22 LogicVision, SiidTech explore use of silicon fingerprinting
LogicVision Inc. has formed a partnership with SiidTech Inc. to explore the advancement, utilization, and potential of silicon fingerprinting and embedded test in ASIC and SoC technologies
2007-06-18 Industry tackles approach to DFM, DFY issues
Experts from chip, EDA and foundry companies ask whether it's better to deal with DFM and DFY issues at tape-out or minister to the design starting at the register transfer level.
2003-08-18 Embedded memories multiply in system-on-chips
The latest embedded memories are even bringing the added benefits of low-power operation to handheld systems.
2002-09-24 Dolphin Integration: Taiwan foundries acquiring design capabilities
Outsourcing fab responsibilities to Taiwan was adopted by many companies to deverticalize the chip industry. But design changes are slowly creeping in.
2002-06-19 Chip industry tackles escalating mask costs
The rapid increase in the cost of photomask sets for advanced IC processes has made a lot of news in recent months.
2003-01-31 ARM looks to China to improve flat revenues
ARM Holdings said it was forecasting "flattish" revenues in the short term after releasing its annual results.
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