Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > sonics

sonics Search results

total search37 articles
2002-06-17 K&S ball bonder targets HDM, SO packages
Specifically designed to be used with high-density matrix and SOP casings, the Nu-Tek automatic ball bonder from K&S Ind. Inc. is claimed to deliver up to 30 percent more productivity than the company's 8028-S.
2004-01-14 K&S ball bonder offers 10 percent UPH improvement
Kulicke & Soffa Ind. Inc. has released the Max?mplus ultra high speed ball bonder that is suitable for all types of ultra-fine pitch apps.
2008-11-10 IPO candidates await market recovery
The year was already shaping up to be a dismal one for IPOs when the financial crisis hit and decimated stock markets. Now IPO activity has literally ground to a halt.
2005-03-22 EDA exec offers alternative IP channel
It's very hard for small silicon intellectual property (IP) companies to create sales channels, says former Synopsys executive John Atwood. So Atwood has launched a company that serves as a "specialized sales channel partner" for emerging IP companies.
2010-12-24 Design methods shift to software, part 2
Designing via block level IP integration with virtual platforms shortens the number of steps between design intent and having working hardware and software.
2014-04-24 Cadence emerges as fourth largest IP core supplier
Strong IP and acquisition strategies placed Cadence as the fourth among the top semiconductor IP core suppliers in Gartner's 2013 ranking, with 5.1 per cent revenue share. ARM led with 43.2 per cent, followed by Synopsys and Imagination Technologies respectively.
2011-06-08 ARM's AMBA 4 spec enhances next gen apps
ARM has released the AMBA 4, which optimizes coherency for heterogeneous multicore SoCs. It also maximizes performance and power efficiency for next generation applications.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top