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2002-11-04 Tellium expands reach with new China office
Tellium Inc. is establishing an office in China as part of its expansion plan in the Asia-Pacific region.
2002-05-30 NEC, Tellium develops multi-vendor transport switch
NEC Corp. and Tellium Inc. has announced the development of what they claim to be the industry's first commercially-available multi-vendor integrated transport-switch.
2002-04-30 Lockheed Martin, Tellium sign optical switch contract
Aeronautics and technology integrator Lockheed Martin Corp. has entered into a multiyear agreement with Tellium.
2015-02-25 Thin sensors boast high-level gas, chemical detection
UC scientists have built sensors made of molybdenum disulphidesmall, thin and highly sensitive to gases and chemical vapours including ethanol, acetonitrile, toluene, chloroform.
2014-05-08 3D chip-making technique utilises metallisation layers
The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs.
2011-01-21 'First' accelerated processing unit launched
AMD has made available the new AMD Embedded G-Series processor, which the company claims is the world's first and only accelerated processing unit (APU) for embedded systems.
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