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| 2002-11-04 | Tellium expands reach with new China office Tellium Inc. is establishing an office in China as part of its expansion plan in the Asia-Pacific region. |
| 2002-05-30 | NEC, Tellium develops multi-vendor transport switch NEC Corp. and Tellium Inc. has announced the development of what they claim to be the industry's first commercially-available multi-vendor integrated transport-switch. |
| 2002-04-30 | Lockheed Martin, Tellium sign optical switch contract Aeronautics and technology integrator Lockheed Martin Corp. has entered into a multiyear agreement with Tellium. |
| 2015-02-25 | Thin sensors boast high-level gas, chemical detection UC scientists have built sensors made of molybdenum disulphidesmall, thin and highly sensitive to gases and chemical vapours including ethanol, acetonitrile, toluene, chloroform. |
| 2014-05-08 | 3D chip-making technique utilises metallisation layers The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs. |
| 2011-01-21 | 'First' accelerated processing unit launched AMD has made available the new AMD Embedded G-Series processor, which the company claims is the world's first and only accelerated processing unit (APU) for embedded systems. |
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