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2014-11-19 Zigbee 3.0 goes for 'one size fits all
The ZigBee Alliance is consolidating all forms of its low-power wireless technology under one standard, the ZigBee 3.0, in a move that will provide interoperability among the widest range of smart devices
2015-02-23 UT3 platform begins test cases for LLCP, SNEP Phase 2
NFC Forum allowed COMPRION to conduct test cases for the second phase of Logical Link Control Protocol (LLCP) and Simple NDEF Exchange Protocol (SNEP).
2011-08-12 USB 3.0 hub controllers support 2-layer PCB designs
SMSC's family of SuperSpeed USB hubs that claims to deliver the industry's smallest footprint eases expansion in docking stations, port replicators and all-in-one monitors.
2013-10-01 Teardown: Galaxy Note 3 still king of phablets
TechInsights deems the Galaxy Note 3 as still the leading phablet in the market based on chips utilised in the device
2014-09-17 Switch chip delivers more throughput at 3.2Tbit/s
A new breed of switches ulitises novel architecture in order to deliver more than twice of the current high-end switch's throughput as well as provide more programmability for the growing datacentres.
2013-01-08 ST introduces DOCSIS 3.0 cable-modem ICs
The DOCSIS 3.0 modem SoCs provide up to 16 downlink channels, with four uplink channels, enabling data speeds of up to 800Mb/s downstream and 108Mb/s upstream
2014-03-17 Silicon photonics evolve into 1.3m quantum dot lasers
The quantum dot lasers developed by UCSB researchers are expected to facilitate the integration of low-cost, multi-channel laser devices with CMOS driver circuits.
2006-08-07 SA1 termination-style switches save board space
This right-angle board-mount configuration of ITT, Electronic Components' pushbutton, rocker and toggle switches in SA1 termination saves 3mm of solder pad space.
2014-08-14 Rohde & Schwarz software can analyse DOCSIS 3.1 signals
The R&S DSA software, together with the R&S FSW high-end signal and spectrum analyser, is intended for cable TV network operators and manufacturers of cable TV network components.
2014-10-16 RF switch complies with DOCSIS 3.1 standard
The UltraCMOS PE42722 from Peregrine allows a dual upstream/downstream band architecture in CPE devices and gives multi-service operators the flexibility to expand their services.
2016-04-14 Renesas claims industry first in supporting USB PD v.2, v.3
Renesas Electronics is claiming an industry first with its power supply IC, the RAA230161, in supporting the USB PD 2.0 and 3.0 spec and achieving multi-voltage outputs from 5V to 20V with a 95% efficiency
2011-12-01 Power IC supports 3.5-6.5V input voltage
The TPS75005 features two low-noise, 500mA low-dropout linear regulators for TI's real-time control MCUs.
2012-12-17 Mill-Max USB 3.0 boasts 5Gbit/s data transfer rate
SuperSpeed USB is a Sync-N-Go technology that minimises user wait time and provides optimised power efficiency.
2007-08-14 MicroTCA backplane comes in Cube-style format
Elma Bustronic has released a MicroTCA backplane in a Cube-style format that features six AdvancedMC, one Power Module and one MicroTCA carrier hub slots
2015-11-02 Micron develops 3.2Gb/s NOR Flash
The XTRMFlash boasts random access times as fast as 83ns, sequential byte reads as fast as 2.5ns, 400MB/s memory, and is compatible with the Quad SPI flash pinout used in serial NOR flash.
2016-01-22 Microchip-Atmel deal to overhaul top 3 MCU vendors
Microchip Technology Inc.'s pending $3.8-billion acquisition of Atmel Corp. would move Microchip into the No. 3 position among microcontroller vendors
2012-04-05 Maxim unveils 3/8/12/18A DC/DC regulators
The MAX15058, MAX15108, MAX15112 and MAX15118 claim to be the industry's smallest current-mode, synchronous DC/DC converters that offer more than 94 percent efficiency.
2006-11-06 Low-capacitance protection devices support HDMI 1.3
Semtech claims its two new 5V protection devices are the first solid-state devices to reach 0.3pF in capacitance to meet the needs of HDMI 1.3 and other high-speed data lines
2013-04-25 LNA boasts 0.7 to 3.8GHz noise figure performance
Skyworks Solutions' SKY67151-396LF is a GaAs, pHEMT low noise amplifier features the company's advanced pHEMT enhancement mode process in a compact 2x2mm, 8-pin DFN package.
2011-03-18 Linear DACs offer 10ppm/C Reference in 3 x 3mm package
Linear Technology's LTC2632 and LTC2633 families of dual 12-, 10- and 8bit rail-to-rail, voltage output DACs offer either serial SPI or I2C interfaces.
2014-01-24 Lenovo buys another slice of IBM for $2.3 billion
Lenovo revealed Thursday that it will acquire IBM's x86 server hardware and related maintenance services for $2.3 billion
2011-11-22 LDOs operate from 3.3-20V
ADI's low dropout regulators register power supply rejection ratio of 60dB at 10kHz in 3V operation.
2007-02-19 Intel's 80-core chip crunches 1Tflop at 3.2GHz
Intel's 80-core chip crunches 1 trillion flops when running at a 3.2GHz clock speed and consumes 62W, to yield a record 16Gflops/W
2016-04-07 IHS: iPhone SE, an amalgamation of 3 generations of iPhones
Apple aims for greater phone portability across carriers by simplifying production and distribution for its latest release, the iPhone SE.
2012-01-06 IDT's 3-3-3 plan
Successful companies and startups must embrace change to capitalize on the three growth drivers that will shape the next decadecloud computing, mobility and 4G/LTE wireless infrastructure.
2013-11-05 Hillcrest unveils sensor hubs for Android 4.3
The SH-1 features the firm's Freespace sensor fusion, gesture recognition and context-aware algorithms that come pre-integrated with Atmel's SAM D20 ARM Cortex M0+ based MCU.
2012-09-10 Gyro market post 4.3% annual rate, to reach 1.66b in 2017
According to Yole Developpement's latest report, the market for Inertial Measurement Units(IMUs) was stable in 2011 with a size of $1.75 billion
2016-04-29 Global smartphone shipment drops 3% in first quarter of 2016
Global smartphone shipments fell 3% annually to reach 335 million units in Q1 2016, according to Strategy Analytics. It is the first time ever in history the global smartphone market has shrunk on an annualised basis
2008-01-03 Fujitsu equips mobile suite with 3.5G connectivity
Fujitsu PC Asia Pacific has released its 3.5G-enabled mobile suite packed with high speed connectivity in seven different models, spanning across display sizes of 5.6- to 14.1-inches wide
2014-08-06 Flash-backed DRAM rides PCIe 3.0 bus
The Flashtec card from PCM claims to offer better performance than flash-based SSD without its endurance issues, delivering 10 million IOPS when used as additional system memory.
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