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2002-06-18 Toshiba Semiconductor, TAEC to implement TiVo DVR technology
TiVo has identified Toshiba Semiconductor Co. and Toshiba America Electronic Components Inc. as its latest technology licensees of TiVo's digital video recorder technology.
2004-01-29 TAEC to accept SoC hand-off from Magma Design
Toshiba America Electronic Components Inc. (TAEC) has implemented a 3-million SoC using Magma Design Automation's Blast Create, an RTL-to-placed-gates system.
2003-01-21 TAEC SoC doubles gate integration
Toshiba America Electronic Components Inc. has launched its 90nm TC300 family of SoCs based on the company's CMOS4 process technology.
2003-08-25 TAEC publishes NAND flash apps design guide
Toshiba America Electronic Components Inc. has arrived with a comprehensive NAND flash design guide for engineers.
2005-11-24 TAEC power amp boosts WLAN, PHS and Bluetooth signals
Toshiba America Electronic Components released a new medium power Silicon Germanium BiCMOS power amplifier that is suitable for use in 1.9GHz to 2.5GHz band wireless apps.
2006-04-05 TAEC MCU targets portable consumer apps
TAEC has announced the availability of a new 32bit, single-chip MIPS-based reduced instruction set computer microcontroller with 2Mbyte of on-chip NANO FLASH memory.
2003-11-03 TAEC LCD modules feature reverse-scan capability
Toshiba America Electronic Components Inc. (TAEC) has announced the availability of two wide-viewing-angle, high-brightness TFT LCDs.
2003-07-04 TAEC GaAs FET targets satcom systems
Toshiba America Electronic Components (TAEC) Inc. has released what it claims to be the industry's first 90W c-band GaAs FET that is suitable for use in SSPAs.
2003-09-11 TAEC Flash devices come in lead-free versions
Toshiba America Electronic Components Inc. has announced that all its NAND Flash memory TSOP devices are available in lead-free packaging.
2003-07-10 TAEC expands NAND Flash design for mobile apps
Toshiba America Electronic Components Inc. (TAEC), together with its parent company Toshiba Corp., has announced a wider NAND flash memory configuration.
2003-09-29 TAEC expands FCRAM II family
Expanding its portfolio of DRAM technology, Toshiba America Electronic Components has released what it claims is the industry's first x36 FCRAM II.
2003-11-13 TAEC enhances IGBT line with device technology
Toshiba America Electronic Components Inc. (TAEC) has announced a 1,200V series of IGBTs that provide improved performance in motor drive apps.
2013-06-07 TAEC debuts 200W GaN HEMT
The 200W TGI5254-200P operates in the 5.2GHz to 5.4GHz range AND enables increased output power and helps reduce size and weight in solid state power amplifiers (SSPA) for RADAR applications.
2007-07-31 TAEC adds Vista support to USB flash memory line
TAEC has expanded its TransMemory family of USB flash memory devices supporting Windows ReadyBoost for use with Microsoft Windows Vista OS.
2002-12-16 Toshiba, WIDCOMM partner on Bluetooth solutions
Toshiba America Electronic Components Inc. has partnered with WIDCOMM Inc. to co-develop embedded and PC Bluetooth solutions.
2006-10-06 Toshiba unveils three new MCUs
Toshiba America Electronic Components unveiled two new 16bit MCUs and a new 32bit MCU based on SuperFlash technology.
2004-07-12 Toshiba unveils 64-bit MIPS-based microprocessor
Toshiba America Electronic Components topped off its MIPS-based microprocessor line with a 64-bit single-chip RISC processor.
2006-07-07 Toshiba unveils 'smallest' memory card
Toshiba's new microSD card, with approximately one-fourth the cubic measure of a miniSD memory card, is touted to be the smallest memory card available worldwide.
2004-12-21 Toshiba supports Cadence RTL compiler for ASIC design
Cadence Design Systems Inc. announced that Toshiba America Electronic Components Inc. (TAEC) has introduced a design kit to support its custom System-on-Chip (SoC) and ASIC customers using Cadence Encounter RTL compiler synthesis.
2003-08-01 Toshiba subsidiary pushes for lead-free manufacturing
Toshiba America Electronic Components Inc. has announced that it is implementing manufacturing procedures using new materials that support the current industry movement to lead-free manufacturing.
2006-09-05 Toshiba readies U3 smart USB flash devices
TAEC and Toshiba Corp. have announced the forthcoming introduction of TransMemory USB Flash Drives that will bring U3 smart technology into the company's USB lineup.
2004-07-13 Toshiba photocoupler supports up to 400ns
Toshiba America Electronic Components introduced a high-speed, high-gain photocoupler that supports signal transmission and switching speeds up to 400ns.
2002-11-28 Toshiba opens second design center for 2002
Toshiba America Electronic Components Inc. has opened its seventh U.S.-based design center located in San Diego, California, which also is the second design center to be launched by the company this year.
2007-03-26 Toshiba offers LED-backlit LCDs for notebooks
TAEC has announced the development of new 10.4-inch and 10.6-inch TFT LCD panels for notebook PC applications, each incorporating an LED backlighting system to provide low-profile, lightweight and low-power consumption features.
2003-12-10 Toshiba offers lead-free packaging
Toshiba America Electronic Components Inc. (TAEC) announced that many of its power semiconductor package types will be manufactured using either lead-free packaging or lead-free finishes.
2007-01-10 Toshiba offers four NAND flash solutions
To address the rapidly growing market for embedded flash solutions in consumer electronics and other handheld systems, TAEC is rolling out four embedded NAND solutions.
2002-02-15 Toshiba lays off 12 percent of U.S. workforce
Blaming the continued weakness in the electronics industry, Toshiba America Electronic Components Inc. confirmed Wednesday that it has laid off 60 of its employees, or 12 percent of its workforce, working at various U.S. branches.
2006-05-30 Toshiba extends miniSD memory cards
Toshiba Corp. announced an expanded line-up of large capacity miniSD Memory Cards with the introduction of a 2Gbyte capacity card.
2004-11-11 Toshiba announces smallest GaAs MESFET switch for Bluetooth, WLAN apps
Toshiba released a small, low-profile GaAs MESFET SPDT switch that is suited for use in multi-band/mode cellular ASMs, Bluetooth modules and WLAN apps.
2002-02-04 Toshiba 8Mb SRAM boasts 40ns access time
The company is set to commercialize 8Mb low-power SRAMs designed to maximize the operation of mobile phones.
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