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2003-04-03 TEL, Teseda rolls integrated DFT system
Tokyo Electron Ltd and Teseda Corp. have released an integrated design for testability (DFT) system targeted for wafer testing applications.
2008-02-20 TEL, Sharp form thin-film PV joint venture
TEL has entered the photovoltaic cell production business with a joint venture with Sharp to commercialize plasma CVD systems for thin-film silicon PV.
2004-07-13 TEL, IMEC team up in immersion lithography
Tokyo Electron Ltd (TEL) has collaborated with IMEC for the research of 193nm immersion lithography.
2003-11-20 TEL, Clariant co-establish unique suppression process
Tokyo Electron Ltd has announced that it will begin sales of a process resulting from joint development with Clariant KK.
2003-07-15 TEL transfers PVD equipment line to Metron
Tokyo Electron Ltd (TEL) has signed a LOI with Metron Technology N.V. which outlines the transfer of the Eclipse PVD equipment product line from TEL to Metron.
2004-05-24 TEL to streamline U.S. operations
Semiconductor and FPD production equipment supplier Tokyo Electron Ltd (TEL) has revealed plans to restructure its U.S. operations by creating a new holding company to be named Tokyo Electron U.S. Holdings Inc.
2004-03-16 TEL to sell AIBIT ion implantation system
Tokyo Electron Ltd (TEL) has signed a distribution contract with Advanced Ion Beam Technology Inc. (AIBT).
2002-07-16 TEL to roll out next-gen processing systems for 300mm wafers
Tokyo Electron Ltd is developing a next-generation process coater/developer for use in 300mm wafers.
2004-04-22 TEL test handler supports WLCSP, KGD technologies
Tokyo Electron has developed the WDF DP test handler that supports the WLCSP and KGD packaging and test technologies.
2005-12-21 TEL sees orders 15% ahead, says report
Orders for chipmaking equipment from Tokyo Electron are likely to beat a previous forecast by 15 percent and bode well for the company in its next fiscal year, according to a Bloomberg report.
2005-08-26 TEL seen slipping in equipment rankings
With ASML Holding NV nipping at its heels, Japans Tokyo Electron Ltd (TEL) must show stronger than average growth to maintain its position as the worlds second largest chip-equipment provider, behind Applied Materials Inc., according to a report from The Information Network (New Tripoli, Penn.).
2003-07-31 TEL secures multiple orders from Therma-Wave
Tokyo Electron Ltd, a supplier of semiconductor and FPD production equipment in Japan, has placed multiple follow-on orders to Therma-Wave Inc.
2004-04-15 TEL photomask system eyes 90-, 65nm device nodes
Tokyo Electron has begun accepting orders for its Clean Track ACT M photomask resist coater/developer that is targeted for 90nm to 65nm technology nodes.
2008-02-11 TEL obtains MMP portfolio license
A Moore Microprocessor Patent Portfolio license has been purchased by TEL from The TPL Group.
2005-06-21 TEL led display equipment rankings in '04
Japan's Tokyo Electron Ltd (TEL) was the world's top equipment supplier for flat-panel displays in a market dominated by Japanese vendors in 2004, according to VLSI Research Inc. (See rankings table below).
2012-02-17 TEL joins DSA, maskless litho projects
Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute.
2007-01-12 TEL acquires GCIB technology provider
Tokyo Electron has acquired Epion Corp., a supplier of gas cluster ion beam technology for semiconductor applications and emerging nanotechnology markets.
2007-01-31 Sematech, TEL advance work on 3D interconnects
Sematech and Tokyo Electron entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advanced manufacturing.
2003-09-22 Metron purchases TEL's Eclipse PVD line
Metron Technology N.V. has completed its acquisition of the Eclipse PVD equipment product line from Tokyo Electron Ltd.
2004-08-12 Japan's TEL selected for European 'gate-stack' project
Chip equipment vendor Tokyo Electron Ltd (TEL) has signed an agreement with France's CEA LETI (Laboratory of Electronics and Information Technologies) to develop a CMOS gate stack that includes a high-k insulator and metal gate materials and deposition steps for 45nm and lower manufacturing process nodes.
2012-03-20 Japan's TEL buys deposition vendor
Nexx's advantages in electronmechanical deposition will help TEL's strategy to advance wafer level packaging.
2006-02-23 ATMI, TEL partner in photoresist packaging system
ATMI Packaging, a provider of high quality materials-handling solutions, unveiled a packaging system designed for direct pressure dispensing of advanced photoresist chemicals.
2006-12-07 ASML, TEL team on advanced litho tools
Tokyo Electron and ASML Holding NV are joining forces to develop next generation R&D and manufacturing tools.
2006-07-03 Tokyo Electron unveils probe mark analyzer
Tokyo Electron has released a new probing accuracy diagnosis system that is integrated with the company's 300mm fully automatic wafer prober.
2003-12-22 Therma-Wave, Tokyo Electron partner on CD metrology developments
Therma-Wave Inc., a semiconductor metrology company, has received a multi-system, multi-million dollar order from Tokyo Electron (TEL). Under the terms of the order, Therma-Wave's advanced INTEGRA CD metrology products will be used with TEL's CLEAN TRACK ACT and CLEAN TRACK LITHIUS series of coater/developer products.
2006-02-07 Sales slide at Tokyo Electron on display weakness
Sales revenue and net income fell at Tokyo Electron Ltd (TEL) in the third fiscal quarter to Dec. 31, 2005, on declining sales of flat panel display making equipment.
2016-05-13 Lego-like electronic bricks redefines 'playing with blocks'
The chrome-plated bricks from Brixo Smart Toys can conduct electricity, integrate active parts such as LED lights, motor blocks, and even sound, light and proximity sensors.
2007-02-08 Fab-tool sales expect slowdown
Despite the positive early signs for 2007, it is still expected to be a slow year in the chip-equipment market, as previously reported.
2006-10-06 CVD system enables low-temperature processing
TEL has announced its latest 300mm metal CVD system that enables deposition of Ti and TiN films in low temperature process regimes.
2006-08-03 AccuSoft announces distribution partnership in China
AccuSoft announced distribution partnerships with Shanghai-based TechMax and Tel Aviv, Israel-based Engineering Software Lab.
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