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2008-09-15 Multicell Li-ion and Li-Pol battery gas-gauge application using the bq26500
This application report describes implementation of multicell battery packs using bq26500 circuits
2008-06-23 Understanding TI's PCB routing rule-based DDR timing specification
This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious
2004-11-10 TI, Xilinx partner on FPGA-based deserializer reference design
Texas Instruments and Xilinx announced the availability of an FPGA-based deserializer reference design that they have jointly developed.
2013-05-27 TI rolls out massive support for its MSP430 MCUs
Texas Instruments recently revealed its broad portfolio which allows designers to have an easy time in creating capacitive touch designs that replace mechanical buttons.
2008-05-22 Interfacing the FLEx72 18Mbit synchronous dual-port RAM to the TI TMS320C641x DSPs
This application note describes wiring, EMIF register settings and other design considerations for connecting the TMS320C6416 DSP to the Cypress FLEx72 18Mbit synchronous dual port
2008-08-27 Interfacing Spansion flash to TI OMAP processors
This application note assumes that the reader is familiar with asynchronous, page and synchronous flash memory timings
2001-04-30 FIFO patented synchronous retransmit: Programmable DSP-interface application for FIR filtering
This application note presents an of the synchronous-retransmit feature of TI's DSP application-specific FIFOs. It describes a synchronous-retransmit feature and shows how this feature can be used in conjunction with a DSP for FIR filtering.
2014-08-26 Choosing TI SigCon devices for SFF-8431 SFP+ apps
This application note outlines the SFP+ physical medium dependent options, and assists in mapping them to product part numbers from TI's Signal Conditioning family.
2010-11-09 TI, Maxim push 300mm analog
Texas Instruments and Maxim Integrated Products have made recent advances in manufacturing 300mm analog devices, prompting analysts to ask how much impact the move will have on the segment.
2012-06-28 TI bets on China for MCU design
TI's facility in China is not there just to support existing MCU products. Rather, it actually executes some MCU product line development from China
2010-01-04 What's the next big application
Here's a list of the 10 technology applications to watch for in 2010, examining examine the features that make them so compelling as well unresolved issues that might keep them from breaking out.
2010-05-19 Usage of MPU sub-regions on the TI TMSx70 Cortex devices
A memory protection unit (MPU) is a module used to modify the memory types and attributes as defined in a processor's memory ordering model.
2008-09-16 Interfacing Xilinx FPGAs to TI DSP Platforms using the EMIF
This application note provides several implementations that connect Xilinx FPGAs to a Texas Instruments DSP platform using the External Memory Interface
2009-10-14 Interfacing the KXP94 or KXR94 tri-axis accelerometer with TI's MSP430F149 microprocessor to measure tilt and other motions
This application note describes how to integrate the Kionix KXP94 or the KXR94 tri-axis accelerometer with the MSP430F149 to capture and use the motion sensing capabilities of the accelerometer
2001-03-21 Interfacing the CY7C276 high-speed PROM to the AT&T, AD, Motorola and TI DSPs
This application note discusses how to use Cypress Semiconductor's CY7C276 PROM as program memory for various DSPs. It covers the topic of interfacing the CY7C276 to popular DSPs for program memory only
2001-05-10 Emulation fundamentals for TI's DSP solutions
This application note explains the fundamentals of how the emulation logic and emulation tools work together with Texas Instruments' DSPs
2009-06-02 Electrical overstress damage of TI 1394 PHY devices
This application note provides information on how to recognize a 1394 PHY device that has been damaged by a late Vg event, an explanation of how the damage occurs and suggestions on both decreasing the frequency of late Vg events in a system and protecting 1394 PHY devices from damage due to late Vg events
2001-03-30 Connecting the Cypress VIC068/VAC068 to the TI TMS320C40: A prototype design
This application note high-level as well as low-level details of interfacing Cypress Semiconductor's VIC068/VAC068 VMEbus controllers to Texas Instruments' TMS320C40 DSP
2008-09-16 Wall adapter powers IEEE 802.3af powered device
Power-over-Ethernet is an emerging technology that allows an existing Ethernet connection to carry both data and power. However, today’s powered-device (PD) designers face a dilemmanot all Ethernet connections are wired for power. To operate with these legacy connections, a PD can use a wall adapter, but this capability must be designed into the PD.
2008-09-15 Using Standard Power over Ethernet controllers for high-powered devices
Any IEEE 802.3af power sourcing equipment (PSE) power controller can be used for higher power by adding a simple circuit to the port to increase available current.
2008-04-25 USB 2.0 board design and layout guidelines
This application note from Texas Instruments discusses schematic guidelines when designing a universal serial bus system
2008-08-07 Understanding MSP430 flash data retention
The MSP430 family of MCUs, as part of its broad portfolio, offers both ROM-based and flash-based devices. Understanding the MSP430 flash is extremely important for efficient, robust, and reliable system design.
2008-09-17 TPS61059 powers white-light LED as photoflash or movie light
Manufacturers of smart phones, cellphones and PDAs are incorporating digital camera technology into their products so they can be used as cameras as well as for their intended use. Each of these devices uses a megapixel CCD camera that generally performs poorly in low-light conditions such as indoors, on cloudy days, or in the morning or evening. To provide a photoflash function for these low-light conditions, manufacturers are starting to turn to new high-power, white-light LEDs.
2008-07-09 Three-phase electronic watt-hour meter design using MSP430
This TI application report describes the implementation of a three-phase electronic electricity meter using MSP430 4xx family of MCUs. The implemented functions are RMS voltage for each phase, RMS current for each phase, frequency, power and a real-time clock
2008-09-15 Stacking multiple bq2941x Li-ion secondary voltage protectors
Li-ion battery applications, requiring five or more series cells, can make use of standard 4-series-cell secondary voltage protectors, such as the bq2941x series.
2008-09-15 Single-Cell Impedance Track gas gauge for novices
This application report introduces the bq27350 Impedance Track gas gauge solution
2008-09-18 Selecting the correct IC for power supply applications
Selecting the proper IC for a power supply application may seem like an easy task. However, as newer consumer electronics come out that require multiple voltage rails, the task becomes more complex
2008-09-16 Powered device controllers comparison: TPS2375/TPS2377 vs TPS2370/TPS2371
Two generations of powered device (PD) controllers are available from Texas Instruments for PoE PD solutions. They are the TPS2370/TPS2371 and the TPS2375/TPS2377. This report explains the major differences between the two families.
2008-09-18 Power-management solutions for telecom systems improve performance, cost, and size
Deregulation and competition in wire line and wireless infrastructure telecommunications systems have accelerated the need for lower-cost equipment solutions with ever increasing bandwidth. The challenge of power-management requirements for telecom equipment continues to grow.
2008-09-18 Power management for processor core voltage requirements
Today’s high-performance processors have very stringent power requirements. Typically, the power requirements consist of at least two supply voltage requirements. One voltage requirement is for the processor core voltage, VCORE, while the others are input-output voltage requirements, VIO.
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