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2013-01-17 Thick plated copper process for monolithic PMIC apps
UMC's TPC solution provides thick plated copper layers to achieve higher current flow and better thermal dissipation to cut chip resistance, extending battery life
2007-05-25 IBM readies super-fast Power6 chip
IBM is set to unveil its new p570 system using the 4.7GHz Power6 dual-core processor.
2007-09-07 Quad-core duel: Caneland vs. Barcelona
Intel has rolled out the last and top-end member of its quad-core processor familythe Intel 7300, previously known as Canelandjust days before the scheduled debut of AMD's Barcelona.
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