Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > TSMC Fab 12

TSMC Fab 12 Search results

?
?
total search136 articles
2005-02-07 TSMC libraries support Nexsys 90nm production
Taiwan Semiconductor Mfg Co. (TSMC) has unveiled a full suite of internally developed libraries that support its Nexsys 90nm technology
2010-01-28 TSMC completes Fab 12, Phase 5 construction
TSMC held a topping ceremony for its Fab 12, Phase 5 building located in the Hsinchu Science Park and announced that volume production is expected to begin in Q3 10.
2011-04-11 What's behind TSMC's 450mm move
Aside from reducing production costs and keeping the company ahead of its rivals, TSMC's move into 450mm would allow it to hire 7,000 fewer engineers over a 10-year period
2005-04-28 TSMC unveils 65nm process, production due December
Foundry chip maker Taiwan Semiconductor Mfg Co. Ltd unveiled its 65nm manufacturing process at its Technology Symposium held in San Jose, California, declaring that first wafers processed with the rules are expected in December.
2002-04-26 TSMC to use KLA-Tencor test systems for its Fab 12
Taiwan Semiconductor Mfg Co. (TSMC) has selected KLA-Tencor Corp.'s Klarity Defect automated analysis and defect data management system for its Fab 12, which manufactures advanced ICs on 300mm wafers.
2004-09-22 TSMC to use 193nm immersion lithography for 12-inch wafers
Taiwan Semiconductor Mfg Corp. (TSMC) will begin producing 12-inch wafers using 193nm immersion lithography by October after adopting the process to its Fab 12.
2002-04-16 TSMC to offer SoC design-to-manufacturing services
Taiwan Semiconductor Manufacturing Co. Ltd is moving to better coordinate the design and manufacturing flow for SoC customers with the introduction of a development architecture called Nexsys.
2013-04-05 TSMC to kickstart 20nm line ahead of schedule
TSMC is reportedly poised to start installing equipment for 20nm production at its fab in Tainan, Taiwan, on April 20 enabling it to begin volume production at the end of the second quarter
2003-11-14 TSMC to boost production output at Fab 12
Taiwan Semiconductor Mfg Co. Ltd will expand production capacity at its 12-inch wafer fab this quarter to 40,000 units of 12-inch wafers per month
2005-01-04 TSMC to accelerate 90nm process ramp
Amid a move to ramp up its 65nm technology, Taiwan Semiconductor Mfg Co. Ltd (TSMC) on Wednesday (Dec. 29) said that it will accelerate its 90nm fab capacity throughout 2005
2010-03-01 TSMC takes on 40nm yields, high-k, litho issues
At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node."
2004-09-24 TSMC registers 1 million wafers using 0.13?m tech
Taiwan Semiconductor Mfg Co. (TSMC) has reached the one millionth mark in its shipment of 8-inch equivalent wafers made with the company's 0.13?m technology
2011-12-16 TSMC preps for $26B fab
TSMC is building a $26 billion fab on a 50-hectare plot at Central Taiwan Science Park in Taichung, Taiwan
2005-08-15 TSMC plans $7.5 billion superfab, says report
Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd has applied to build a next-generation 300mm wafer fab in Taichung, according to a Taipei Times report, which referenced a science park official and a TSMC spokesman as sources
2008-05-16 TSMC okays $1B expansion budget
TSMC said it has approved a capital appropriation of $995 million to expand a 300mm fab and increase its advanced process capacity
2009-04-23 TSMC invests in R&D despite downturn
Taiwan Semiconductor Manufacturing Co. Ltd remains cautiously optimistic about the IC industry and vowed that it will continue to invest in R&D despite the downturn.
2013-04-15 TSMC FinFET production set in 2013
Company executives detailed the new processes and how they aim to get there and also gave an update on 3D chip stacks and their on-going ramp of today's 28nm process node.
2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016.
2004-09-21 TSMC claims lead in 0.13-micron, low-k production
Taiwan Semiconductor Mfg Co. Ltd said that it has cumulatively produced and shipped more than one million 8-inch equivalent wafers with circuits made using 0.13?m processing.
2010-07-21 TSMC breaks ground for new Taiwan plant
Taiwan Semiconductor Manufacturing Co. will invest more than $9.4 billion in a new plant in Taiwan.
2011-02-03 TSMC bares plan to build 450mm fab
TSMC's announcement that it will build a 450mm fab could push rivals Samsung and GlobalFoundries to follow suit and include 450mm into their plans immediately
2005-08-23 TSMC applies at CTSP to build a wafer plant
An official from the Central Taiwan Science Park (CSTP) has confirmed the application of wafer manufacturer Taiwan Semiconductor Mfg Co. (TSMC) to build a new facility at the industrial center
2003-07-15 TSMC adopts PDF technology for 90nm process ramp
Taiwan Semiconductor Mfg Co. Ltd and PDF Solutions Inc. have collaborated in which the latter will provide its PDF technology for TSMC's 90nm Yield Learning Infrastructure project
2012-06-14 Taiwan OKs TSMC's 450mm fab
The plan, approved by the Council for Economic Planning and Development, has a total investment cost estimated at between $8 billion and $10 billion.
2002-03-07 Philips, STMicro, TSMC ally on deep-submicron process work
Steeling themselves for the imposing challenge of developing process technology for deep-submicron ICs, three chip industry heavyweights said Tuesday they will pool resources to share the risk of process development for ICs below 0.15m.
2012-04-10 Fifth phase of TSMC's Fab 14 gigafab underway
The Fab 14 Phase 5 facility will be combined with the planned Fab 14 Phase 6 to offer a total cleanroom area of 87,000 square meters, four times larger than a typical 300mm fab
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain.
2002-02-12 UMC seeks control of Japan joint-venture fab
United Microelectronics Corp. is seeking to gain management control of its 300mm wafer joint venture with Hitachi Ltd, UMC chairman and chief executive Robert Tsao said Friday (Feb. 8).
2006-12-04 TSMC, SMIC increase flash efforts
TSMC and SMIC are reportedly increasing their efforts to raise their flash memory market shares
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top