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2013-04-23 Understand thermal management for power supplies
Know the basics of dissipating heat in power supplies while keeping the noise down.
2001-05-10 TMS320C6x thermal design considerations
This application discusses thermal analysis and heat sink selection for Texas Instruments' TMS320C6x DSP family
2008-05-15 TI acquires power management company
Beefing up efforts in power management, TI has acquired Irish power supply reference design provider Commergy Technologies
2002-05-14 Thermal management of UltraVolt HVPS
This application note discusses the system design and heat process dissipation of Ultravolt's HVPS systems.
2013-10-18 Thermal management materials post $1.8B for 2013
Lux Research forecasts that thermal management materials for LEDs and power electronics to grow by 4.8 billion market in 2020.
2008-05-09 Thermal management kit offers 100 heat sink options
ATS has introduced the Thermal Management Design Kit that contains 96 of its maxiFLOW heat sinks and maxiGRIP sink attachment systems.
2006-06-27 Thermal management ICs generate market heat
Databeans Inc. thinks thermal management ICs are hot. With revenue hitting $674 million in 2005, the firm believes this market could reach just under $2 billion in 5 years.
2009-12-21 Thermal management for FPGAs
This application note provides the information you need to determine the thermal requirements for your application
2007-08-31 Thermal management chips suit smaller packages
SMSC has introduced the EMC210x family of fan controllers and SMBus temperature sensors designed for smaller geometries such as 45nm.
2002-12-06 Thermal management
This application note provides an introduction into thermal management of PLDs.
2006-12-19 Thermal gap filler can be reused
Unlike many gap fillers, MH&W International said its Softtherm 86/200 thermally conductive gap filling retains its memory after compression, which enables the material to be reused.
2014-11-05 Thermal evaluation method for TLV62065
Here's a look at an accurate evaluation method of junction temperature. This method is proven to be easy to use and have good accuracy and relevance to real applications.
2007-08-13 System management tool starts at $1.20
Actel has introduced a new reference design for embedded applications that enables intelligent system and power management implementations starting at $1.20
2005-05-20 Surface-mount power resistor delivers greater thermal cycling performance
Designed to resolve thermal cycling issues with power components in high-temperature environments, IRC has developed a "capped" version of its cylindrical power resistor that is said to deliver superior thermal compliance and thermal isolation
2009-01-28 Specification, handling, thermal management and design-in
The following application note gives the necessary instructions for an efficient application and a long LED life time.
2014-02-26 Significance of LED thermal characterisation
Learn how improving the thermal characterisation of LEDs will help to spur on the LED lighting revolution
2009-03-04 Scientists shed light on nano-thermal management
IBM Research scientists have announced a landmark study in the field of nanoelectronics, the development and demonstration of novel techniques to measure the distribution of energy and heat in powered carbon nanotube devices.
2005-05-02 Science and art of telecom thermal design
Good thermal design is equal parts science and artan iterative process requiring constant adjustments based on real-world feedback
2007-09-17 Recognize high-power LED thermal problems
Designers attempting to create high-power LED systems are well served by understanding the thermal problems associated with LEDs. Smart thermal management will increase the operating temperature range, and thermal monitoring will maintain the accuracy of LED products.
2001-08-24 RDRAM thermal interface material specification
This application note specifies the thermal interface material properties for robust thermal/mechanical performance of the RIMM assembly. It applies to RIMMs with cover assemblies over the RDRAM components
2007-12-03 Power management chip boosts energy efficiency
Texas Instruments Inc. introduces what it claims as the industry's first single-chip, interleaved power factor correction (PFC) control circuit for multi-kilowatt communications, server and industrial systems.
2001-03-26 Power estimation and thermal management for Cypress CPLDs
This application note discusses the estimation of power consumption and thermal management for Cypress Semiconductor's FLASH370i and Ultra37000 families of CPLDs.
1999-06-29 Power conversion and management methodologies in a portable system
This paper presents an overview of why thermal management is critical to the success of a product, the power conversion process, and power management techniques for portable products from the dc supply and battery pack to the CPU and system consumption of power.
2005-06-10 Philips to offer thermal models of its power semiconductor
Royal Philips Electronics will provide thermal models of its power semiconductors to help customers predict the thermal performance of their devices - in a fraction of the time it takes to build and test prototypes
2005-06-16 Philips makes predicting power ICs' thermal performance easier
Philips disclosed that it will provide thermal models of its power semiconductors to help its customers accurately predict the thermal performance of their devices
2011-06-07 PCBs boast improved LED thermal management
SinkPAD has rolled out its thermally enhanced SinkPAD aluminum PCB technology, which offers a solution to the challenges in the solid state lighting industry.
2010-12-22 PCB thermal management tech gets US patent
Viasystems' thermal management system for PCBs utilizes a copper heatsink as an integral part of the board rather than as an attachment. It holds US patent no. 7,741,566 B2.
2006-05-16 New power resistor packaging eases heat management
A molded SOIC-style package for surface mount power resistors features a metal lead frame with an integral heat sink directly under the resistor element.
2005-10-10 New memory modules improve thermal management
With nearly 15 years experience in the stacked, high-capacity memory market, Staktek realized that it needed to come up with a process that would improve thermal and electrical issues. At the same time, it strived to sustain its manufacturing processes so that when other companies are manufacturing its devices, they don't have to invest a huge amount of capital equipment to license its technology
2006-03-22 New material eases thermal management
Honeywell Electronic Materials has announced the release of a new screen-printable phase-change material that aims to provide semiconductor chip manufacturers flexibility in thermal management.
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