Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > Thermal test chips

Thermal test chips Search results

?
?
total search51 articles
2015-03-10 Addressing difficult thermal analysis problems
Find out how a simple analogue ASIC can be used to solve a difficult thermal analysis problem. It allows system designers to fully model, measure and modify designs before committing to costly silicon
2003-06-27 Ultratech readies gear to fab sub-65nm chips
Ultratech said that it has optimized its laser thermal processing (LTP) technology to form junctions down in the 20nm technology node, and is now ready to enter the commercialization phase of its LTP program
2009-04-23 TI ramps production in Philippine test plant
Texas Instruments Inc.'s new assembly/test facility within the Clark Freeport Zone in the Philippines is now fully operational and ramping production with the latest packaging technologies
2011-05-10 Test device adds XTC features
Multitest has announced that their MT9510 pick-and-place handler now provides extended temperature control with its extended temperature calibration (XTC) feature.
2014-04-10 Self-cooling chips operate up to 300°C
A team at Fraunhofer IMS developed a type of high-temperature process that allows the fabrication of compact microchips that can keep their cool even at 300°C.
2008-07-03 Confab stresses potential thermal crisis in IC design
At the Design Automation Conference in Anaheim, California, an educational panel addressed the thermal issue in IC design. Two key questions raised were when will this issue be emerging as a crucial concern? What are the solutions to solve this potential crisis
2002-06-07 ChipPAC designs five-stacked chips in 1.4mm package
ChipPAC Inc. has engineered five-stacked memory chips in a 1.4mm thick package
2011-02-02 National, Rambus launch products with 20G+ capability
The demo of both National's prototype retimer chips and Rambus' multimodal memory interface is considered a major step toward overcoming today's speed, power and noise challenges in signal integrity
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals
2014-07-17 Utilising ARM Cortex-M based SoCs (Part 1)
Learn how internal SoC peripherals, such as an op-amp, ADC, PWM, and most importantly a processor core, are used to develop a system with the least number of components on the PCB.
2015-09-17 Spot IGBT degradation through power cycling
Here is a look at an experiment in which we conducted thermal transient tests from one steady-state to another to determine cause of failure for a small sample of IGBTs
2015-04-28 Exploring the failure analysis process
Determining the root cause of electronic system failures requires a disciplined and systematic analytical process, along with sophisticated tools for testing and visualizing the behaviours of sample devices.
2016-04-01 There's more to IC design than just circuits
It takes a village to get complex semiconductors out to market, from design, packaging, test and manufacture. It benefits everyone in the team to know where a product is headed
2006-10-04 LED driver has error-diagnostic feature
Bringing new functionality to traditional LED driver chips, austriamicrosystems' AS1109 integrates LED error-diagnostic readback circuitry for detecting open and shorted LEDs and thermal anomalies
2014-10-22 IDT unveils first RF switch with high isolation, linearity
The F2912 has a combination of low insertion loss, high isolation and linearity making, it an ideal choice for base stations, microwave backhaul and front haul, test equipment, and wireless systems
2013-04-04 Globalfoundries delays 3D IC stack production
The company says it expects to use the 20nm process for 3D chips that may not ship in volume until 2015 or later
2013-11-20 Five MEMS devices unveiled at MEMS Exec Congress
Bosch released two MEMS chips geared for the connected Internet of Things (IoT) applications while Merit Sensor's temperature-compensated pressure sensors are aimed at medical and industrial markets
2002-12-04 Error correction may stall quantum computing
According to University of Arkansas physics professor Julio Gea-Banacloche, because error correction will generate more energy than chips can dissipate, quantum computers may be further off than previously believed
2007-07-02 EDA tools add MEMS capability
By integrating its tools with existing EDA tool sets, SoftMEMS claims to be uniquely positioned to enable EEs to co-design electronics-with-MEMS chips from the comfort of their familiar EDA platform
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field.
2005-09-16 Ultrasensitive quantum lasers sniff toxins
A Georgia Tech researcher develops an ultrasensitive spectrometer using quantum cascade lasers, waveguides and detectors.
2014-01-03 Temperature sensors target advanced CMOS tech
Moortec unveiled what it describes as an improved range of on-chip temperature sensors with an uncalibrated accuracy of ±3°C and a calibrated accuracy of ±1°C, from -40°C to 125°C
2013-02-04 Tackling the challenges of transition to DDR4
Know the key technical challenges designers face in transitioning to DDR4.
2005-07-18 SiP modules call for right blend of tech
The SiP solution offers a seemingly limitless combination of silicon, package and component technologies that simplify overall system design.
2013-07-17 Saving embedded PCB design with forensic tech
Find out how forensics inspections can alleviate OEM concerns over maintaining high reliability for their systems and sub-systems.
2003-09-16 Redefining design for yield, manufacturability
By adopting a more design-driven approach to production, many of the yield and manufacturing issues daunting the semiconductor industry can be addressed before they even occur.
2014-03-25 Power trends take spotlight at APEC 2014
During this year's APEC, global players such as Fairchild, Intersil and Texas Instruments revealed their business plans and product offerings in anticipation of the power efficiencies demanded by next-generation electronic devices.
2014-03-10 Perform electrical characterisation of biosensors
Proper testing of the electrical portions of these sensors is essential to support their development.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions.
2012-08-30 Overcoming challenges for SoC verification team
Know the unique problems that SoC verification engineers face and the approach that provides them a level of automation similar to that enjoyed by block-level verification teams.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top