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2007-05-09 UMC gears up for CPUs, NAND flash memory
United Microelectronics Corp. said it is in talks on a CPU production deal, but it is being circumspect on how it will attack the high-volume flash memory market.
2003-12-10 UMC becomes member of X Initiative
Semiconductor foundry United Microelectronics Corp. (UMC) has joined the X Initiative, a semiconductor supply-chain consortium. This makes UMC the first pure-play foundry to become a member of the consortium
2002-08-01 AMD, Infineon, UMC jointly develop platforms
AMD, Infineon Technologies, and UMC have agreed to collaborate on the development of common 65nm/45nm manufacturing platform technologies for the production of logic products on 300mm wafers.
2005-12-06 Xilinx inks 65nm agreements with UMC, Toshiba
Xilinx announced the extension of foundry relationships with Toshiba and United Microelectronics Corp. to include 65nm technology
2007-06-12 UMC, ARM team on 65nm SOI solutions
United Microelectronics Corp. and ARM announced that a test chip built with ARM silicon-on-insulator libraries was taped-out successfully on UMC's 65nm SOI process
2008-06-16 UMC tips roadmap, veers away from 450mm
Taiwan foundry United Microelectronics Corp. has outlined its process roadmap and disclosed several alliances with the EDA community at the Design Automation Conference (DAC).
2007-09-21 UMC taps Synopsys memory IP design tool
UMC has selected Synopsys Inc.'s memory IP development automation environment for its advanced design processes
2008-07-30 UMC signs up with Sematech consortium
United Microelectronics Corp. has joined the Sematech research consortium to work on R&D for exploratory technologies on 300mm wafers, including 22nm and beyond process generations.
2005-04-29 UMC sees sales, capacity utilization falls in Q2
Foundry United Microelectronics Corp. predicted that its sales would continue to fall in the second quarter of 2005, driving the foundry to the brink of a gross loss as its manufacturing capacity utilization drops to about 60 percent.
2007-05-10 UMC scores Sparc deal in new TI fab scheme
In TI's new fab scheme, UMC appears to have scored a major victory, as that company will make Sparc processors on a foundry basis at the 45nm node for Sun Microsystems Inc
2006-11-22 UMC produces 45nm SRAM chip
United Microelectronics Corp. has cleared a key 45nm process hurdle by producing an SRAM chip with a bit cell size of less than 0.25?m?
2006-05-05 TI qualifies foundries for 65nm process
Texas Instruments is qualifying select silicon foundries for its 65nm process as part of an aggressive ramp for the technology
2006-12-13 TI may be outsourcing 65nm to UMC
Chipworks Inc. has found possible indications that Texas Instruments Inc. has been outsourcing the manufacture of a 65nm baseband chip for the Nokia 2610 GSM handset to UMC
2007-12-28 SMIC licenses IBM's 45nm process for 300mm fab
SMIC has licensed IBM's 45nm bulk CMOS technology for its 300mm wafer foundry service, fabricating devices in mobile, graphics and consumer applications
2008-11-12 IBM transits to 45nm SOI
With an objective to lead in an emerging technology, IBM's Microelectronics Group has launched what it claims as the industry's first 45nm, SOI foundry offering
2007-05-16 Foundries face obstacle course in 45nm race
The starting gun sounded on the 45nm foundry race when the world's largest foundry service provider announced in April it is accelerating ramp of its 45nm process
2012-08-09 Wafer discounts, rush orders from MediaTek, Nvidia
TSMC and UMC have also been offering wafer discounts to try and pull in orders for the worryingly quiet Q4 of the year, according to a Taiwan Economic News report
2007-05-03 Sun tapes out Niagara 2, shares CPU roadmap
Sun Microsystems has taped out its Niagara 2 and Rock processors, but the company faces a major hurdle getting access to 45nm and 32nm process technology for its future Sparc CPUs, according to Sun's David Yen
2015-05-12 Profitability of SMIC's 28nm tech still unclear
During its latest conference call, SMIC failed to disclose as to whether it will generate money from 28nm products this year as it ramps up its most advanced process technology.
2008-10-03 IBM 'fab club' details foundry roadmap
IBM Corp.'s "fab club" has outlined its foundry process road map including a 28nm "half-node" technology, and, in some cases, positioned its 32nm offering as a better alternative to 40nm.
2005-02-01 Charting the way back for a foundry
For Chartered's president and CEO, mutual trust and respect is key to making partnerships work.
2007-06-08 Xilinx marks production qualification milestone of Virtex-5 devices
Xilinx has announced production qualification of its LX50 and LX50T FPGAs, the first two devices in the Virtex-5 65nm series
2011-04-07 TI's new strategy casts doubts on Samsung's foundry ambitions
TI has disclosed that for OMAP 5, it may work with a set of foundries that does not include Samsung, stressing that it will rely on Samsung to a "lesser extent" at 45nm and not partner with it at 28nm
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze
2003-01-10 AMD deal with IBM appears to end earlier alliances
Advanced Micro Devices Inc. has switched partners again, announcing that it will work with IBM Microelectronics to co-develop process technology at the 65nm and 45nm nodes
2004-06-15 Xilinx parts with IBM on 90nm chip production
Programmable logic vendor Xilinx Inc. announced that it does not plan to produce 90nm FPGAs at IBM Microelectronics, and will instead continue to rely on Taiwan's United Microelectronics Corp.
2005-04-29 TSMC sees low-power process as new technology driver
Changing its strategy in midstream, Taiwan Semiconductor Mfg Co. Ltd (TSMC) this week made a major but overlooked announcement.
2008-10-03 TSMC delays high-k offering to 28nm
Taiwan Semiconductor Manufacturing Co. Ltd has rolled out its 28nm process and disclosed it will push out its initial high-k/metal-gate offering until 28nm, putting it slightly behind its rivals in Chartered, IBM and Samsung.
2007-05-22 TI bares details of new 'hybrid' fab strategy
Moving to remain competitive in what has become a brave new world of IC manufacturing, TI had disclosed details of its revised 'hybrid' fab strategy.
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
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