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2003-08-07 ZyDAS taps UMC for 802.11b-compliant IC
ZyDAS Technology has selected United Microelectronics Corp. to manufacture its recently released ZD1202 - an 802.11b fully compliant single-chip MAC and BBP.
2006-02-14 Zoran settles with MediaTek, UMC
Zoran and its wholly-owned subsidiary, Oak Technology, have entered into an agreement to settle litigation between Oak and both MediaTek and UMC.
2003-04-01 Xilinx qualifies for 300mm production at UMC
Xilinx Inc. has announced production qualification for its 130nm Virtex-II Pro on 300mm wafers with fab partner United Microelectronics Corp. at the latter's manufacturing facility, Fab12a, in Taiwan.
2005-12-06 Xilinx inks 65nm agreements with UMC, Toshiba
Xilinx announced the extension of foundry relationships with Toshiba and United Microelectronics Corp. to include 65nm technology.
2002-05-20 Virage Logic to supply embedded memories to UMC
Virage Logic will supply embedded memories for UMC's 0.135m MPU CMOS logic process that utilizes phase-shifting technology from Numerical Technologies Inc. to generate 70nm transistor gates.
2005-01-13 Varian Semicon installs ion implanter at UMC's 300mm fab
Varian Semiconductor Equipment Associates Inc. announced that it has completed the installation of a third single wafer VIISta 80HP high current ion implanter to enhance United Microelectronics Corp.'s advanced process capacity at its 300mm Fab in Tainan, Taiwan.
2002-12-19 UMC, Xilinx ready for 90nm chip manufacturing in '03
United Microelectronics Corp. and Xilinx Inc. have announced that they are on track to produce Xilinx's latest family of programmable chips in 2H of 2003, utilizing UMC's 90nm chipmaking process technology.
2005-07-25 UMC, Virage Logic to enable optimal IP development
Taiwan-based semiconductor foundry United Microelectronics Corp. and Virage Logic Corp., a pioneer in Silicon Aware IP, have announced an agreement where Virage Logic will extend its IP and circuit design expertise to jointly work with UMC to enable optimal IP development for UMC's 65nm process technology.
2013-02-12 UMC, Synopsys partner for design verification at 28nm
UMC selected Synopsys' IC Validator physical verification product for lithography hot-spot checking to accelerate physical signoff at 28nm.
2013-07-25 UMC, SuVolta team up for 28nm low-power process tech
The joint effort aims to yield a process that integrates SuVolta's Deeply Depleted Channel transistor technology into UMC's 28nm High-K Metal Gate high-performance mobile process.
2003-07-02 UMC, Spirea to produce WLAN radio chips
United Microelectronics Corp. has delivered Spirea AB's TripleTraC and gTraC WLAN radios using its 0.18?m RF CMOS process.
2003-03-31 UMC, Silicon7 form strategic partnership
Silicon7 Inc. and United Microelectronics Corp. have formally entered into a partnership after years of cooperation on the development and manufacturing of memory products for the mobile handset and communications market.
2012-07-05 UMC, Samsung supply 28nm chips to Qualcomm
A report in the Taiwan Economic News says that Qualcomm has enlisted United Microelectronics Corp. and Samsung Electronics Co. Ltd as 28nm chip suppliers.
2001-03-01 UMC, Photobit target handset, still-camera
United Microelectronics Corp. said it has readied a special CMOS image sensor process for a twin assault on the digital still-camera and cellphone camera markets.
2006-07-11 UMC, NTU partner on RF chip for WiMAX
UMC and National Taiwan University today announced that their research collaboration has resulted in the delivery of a fully-integrated RF receiver design for WiMAX.
2006-10-24 UMC, NDL to sponsor Taiwan nanotech research
UMC and National Nano Device Laboratories have agreed to support researchers in Taiwan's nanotechnology field with the establishment of the UMC-NDL Scholar Sponsorship Program.
2007-07-09 UMC, Melexis develop 0.18?m embedded flash for cars
Melexis and UMC have collaborated to deliver chips using the latter's 0.18?m eFlash process and eFlash macro, aimed at various automotive applications.
2006-12-12 UMC, Integrand expand collaboration to 90nm, 0.13?m RFCMOS
Integrand Software and UMC announced that their ongoing collaboration has resulted in enhanced capabilities for RF/mixed mode IC designers designing into 90nm and 0.13?m nodes.
2006-10-05 UMC, IME co-develop RF modeling for 90nm
United Microelectronics Corp. have partnered with Singapore's Institute of Microelectronics to jointly develop RF modeling solutions for 90nm technologies.
2013-06-17 UMC, IBM augment FinFET venture to 10nm
UMC will send researchers to work on the development of 10nm FinFET process technology with IBM.
2002-02-21 UMC, Hitachi halt Trecenti joint venture agreement
United Microelectronics Corp. and Hitachi Ltd have agreed to discontinue the joint management of Trecenti Technologies Inc. located in Ibaraki, Japan.
2003-07-04 UMC, HBA announce 90nm silicon success
Semiconductor foundry UMC and High Bandwidth Access (HBA) have announced the successful prototyping of the latter's IC based on the foundry's 90nm process.
2005-09-02 UMC, EDA firm offer inductor synthesis
United Microelectronics Corp., a semiconductor foundry based in Taiwan, has collaborated with EDA software company Integrand Software Inc. (Berkeley Heights, New Jersey) to improve a virtual inductor library applicable to a UMC 0.13?m CMOS process.
2003-07-25 UMC, Barcelona to collaborate on analog synthesis solutions
Semiconductor foundry United Microelectronics Corp. (UMC) and Barcelona Design Inc., a supplier of analog synthesis solutions, have agreed to jointly develop synthesizable PLL and ADC solutions targeted at UMC's process technologies, including 0.18? 0.15?m and 0.13 ?m.
2007-07-24 UMC, ATDF to bring promising new technologies to market
ATDF and UMC have collaborated to evaluate emerging-technology products and bring to market those that are most promising.
2003-06-03 UMC, Artisan co-develop PCI-Express PHY core
Semiconductor foundry UMC and Artisan Components Inc. have agreed upon a long-term IP collaboration focused on the development of a PCI-Express PHY IP core for UMC's 0.13?m chip designs.
2007-06-12 UMC, ARM team on 65nm SOI solutions
United Microelectronics Corp. and ARM announced that a test chip built with ARM silicon-on-insulator libraries was taped-out successfully on UMC's 65nm SOI process.
2015-05-20 UMC, ARM bare 55nm IP platform for IoT apps
The 55nm ultra low-power IP platform, ARM Artisan, is the new physical IP offering from ARM and Taiwan-based UMC that enables low-power cost-sensitive designs for wearable devices.
2005-02-07 UMC, Ansoft tackle RFCMOS with spiral inductor kit
United Microelectronics Corp. (UMC) and Ansoft Corp. have announced a parameterized spiral inductor design kit based on full-wave simulation.
2004-05-10 UMC, AMIC team up in 90nm SRAM production
UMC and AMIC Technology Corp. announced that they have produced AMIC's high-speed Zero Bus Latency (ZeBL) SRAM using UMC's 90nm process.
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