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2010-01-08 Singapore's UTAC takes over ASAT Ltd
Semiconductor package design, assembly and test services company ASAT Holdings Ltd has announced the sale of its subsidiaries
2003-08-07 Amkor, UTAC forge test alliance eyeing China
Amkor Technology has announced a business alliance with United Test and Assembly Center Ltd (UTAC), a Singapore-based provider of solutions in assembly and testing of memory and mixed-signal semiconductors.
2013-12-23 TI sets up seventh assembly/test facility in China
The company acquired a building in the Chengdu Hi-Tech Zone from UTAC and will become the company's only end-to-end wafer fabrication and A/T facility
2006-03-21 UTAC, SMIC launch Chengdu joint venture
UTAC and SMIC announced at an opening ceremony for their joint assembly and test facility that the factory has already moved into the pilot production phase
2004-04-19 UTAC to get hold of UTC
Singaporean IC-packaging and test house United Test and Assembly Center Ltd (UTAC) has revealed its plan to acquire UltraTera Corp. (UTC) for about $475.8 million in a share-swap transaction, which will transform the companies into a global independent full-turnkey provider in the memory business.
2006-04-25 UTAC to acquire Bangkok-based SATS provider
UTAC has announced its plan to acquire NS Electronics Bangkok, a full turnkey SATS provider, in an all-cash transaction amounting up to $175 million.
2002-01-18 UTAC teams up with M-Systems on MCPs
United Test and Assembly Center Ltd (UTAC) is collaborating with M-Systems to deliver MCP (Multi-Chip Package) leaded and array packages.
2003-02-26 UTAC selects Teradyne's J750 MSO
United Test and Assembly Center Ltd has added Teradyne Inc.'s J750 Mixed Signal Option to its existing Integra 750 testers.
2006-04-24 UTAC opens second facility in Singapore
United Test and Assembly Center Ltd opened a second facility in the city-state to meet growing demand for its services.
2006-12-08 UTAC expands Thailand packaging operations
United Test and Assembly Center Ltd will pump more than $100 million into its Thailand operations over the next three years as it shifts more low-end packaging activities to the country.
2005-10-14 UTAC drawing strength from overseas partnerships
United Test and Assembly Center Ltd. (UTAC) is on track to nearly double its earnings this year thanks in part to a series of partnerships and customer wins in China and South Korea, UTAC CEO J.C. Lee said Wednesday (Oct. 12).
2007-06-29 Singapore's UTAC marked for private equity bid
Affinity Global Capital and TPG Capital launched a takeover bid for Singapore's UTAC, in yet another indication of private equity's growing interest in the semiconductor industry
2005-04-14 Singapore's UTAC allies with nine Chinese chip firms
United Test and Assembly Center Ltd (UTAC) said it will work with nine Chinese fabless companies in a deal that marks a new stage in the Singapore-based company's regional expansion plans.
2005-05-18 SMIC, UTAC agree to set up chip fab in Chengdu
Semiconductor Mfg Int. Corp. (SMIC) and Singapore-based United Test and Assembly Center Ltd (UTAC) recently agreed on a joint venture and will set up an assembly and testing facility in Chengdu in Sichuan.
2010-06-23 Analysis: Chengdu takes on hi-tech challenges
Chengdu City is fast becoming the next major biotechnology, chip, LED and renewable energy hub in China, making enormous strides to find its niche in IT and software
2007-01-22 UTAC: China testing, packaging industry yet to mature
Singapore's United Test and Assembly Center said that mainland China's IC testing and packaging industry still lacks market potential despite having Taiwan-based companies transfer their business to the region
2005-06-17 UTAC CEO bullish on company, industry growth
United Test and Assembly Center (UTAC) Ltd is confident of strong growth in 2005 and subsequent years on the back of favorable market conditions and the company's blossoming network of alliances in China, UTAC Group President and CEO JC Lee said in an interview.
2015-09-17 IoT not enough to boost semiconductor market
According to Gartner, growth rates for PCs, tablets and smartphones are all down this year, and are expected to rebound somewhat but not strongly in 2016 and beyond
2011-07-25 Taiwan postcards: A reporter's photojournal
EE Times' Rick Merritt shares photographs from his trip to Taipe and Hsinchu, where he visited ODMs, the companies who design and make the vast majority of the world's notebooks, desktops and servers
2009-02-04 Renesas details restructuring plans
Hit hard by the downturn, Japan chipmaker Renesas Technology Corp. has replaced its top executive amid losses, layoffs and plans to shutter older fabs
2007-12-03 Is it a fab-lite diet for analogs, too?
As digital IDMs increasingly turn to foundries for their production needs, an inevitable question arises: Will the big analog IDMs follow the same path and move toward fab-lite or even fabless strategies
2010-10-06 Tessera sues Sony, Renesas over stacked ICs
According to Tessera, the license agreements of the two companies have expired yet they continue to sell products using the technology.
2006-03-08 SMIC could post profit by Q3
SMIC could turn its first profit by the third quarter of this year, a company executive reportedly said earlier this week.
2009-09-11 Singapore launches 3D TSV consortium
The Institute of Microelectronics has announced a 3D through-silicon via (TSV) consortium to boost next-generation 300mm wafer manufacturing capability.
2007-08-17 Shifting trends in packaging industry favor big players
Industry insiders agree the packaging business is getting increasingly expensive, a trend that naturally favors larger players.
2007-05-15 CE sector boom could ease out small players, chip execs warn
The CE boom will continue to drive the semiconductor industry, but it may also create an environment where only the biggest players thrive, executives said at a recent industry forum in Singapore.
2015-09-10 60 start-up companies to watch in 2015
EE Times has selected 30 start-up companies to come on to version 16.1 of its list of 60 firms that are worth keeping an eye on. Readers are welcome to nominate their own emerging companies.
2014-11-07 TI expands presence in China with 300mm bumping facility
The company's new 300mm wafer bumping facility will rise in a second shell that came with the Chengdu site TI purchased back in 2010. The facility is scheduled to begin production in early 2016.
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