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2012-09-24 Zurich University reveals FRAM tech for green wireless apps
A research from Zurich University reveals that the use of FRAM nonvolatile memory in energy harvesting applications can cut energy consumption of the wireless sensor node by more than 40 per cent.
2006-04-21 ZiLOG to establish two research facilities with Jiliang University
ZiLOG announced that it has signed a five-year agreement with the China Jiliang University in Hangzhou, China to establish two research facilities in Jiliang University's campus.
2003-12-31 Zhejiang University develops 12-inch nitrogen silicon monocrystalline
Zhejiang University, State Key Lab of Silicon Material has developed its first 12-inch nitrogen doped silicon monocrystalline.
2002-07-17 Xtera, University of Michigan receives patent for Raman amplification
Xtera Communications Inc. and the University of Michigan have been granted U.S. patent no. 6,239,902 on Xtera's development of long-haul transport systems employing Lumped or Distributed Raman amplification on most types of NZ-DSF fibers.
2002-01-15 Xidian University establishes nanotechnology R&D center
Xidian University has established an R&D center on nanotechnology.
2012-08-27 Vietnam university partners with NI
The deal between RMIT University Vietnam and NI aims to support the university's technology and engineering programs through joint training and educational activities.
2015-10-21 University wins infringement case against Apple
Apple was ordered to pay the University of Wisconsin $234 million in damages after a Wisconsin court decided that Apple's A7, A8 and A8X application processors had infringed its patent.
2007-07-30 University researchers demo advances in spintronics
A University of Delaware research group has demonstrated the electronic injection and detection of spin-polarized electronsthe first step towards the goal of spintronics.
2010-10-05 University physicists break color barrier for sending, receiving photons
University of Oregon scientists have invented a way to change the color of single photons in a fiber optic cable. This laser-tweaked feat could be a quantum step forward in terms of transferring and receiving high volumes of secured data for future generations of the Internet.
2002-05-22 UDC extends organic light deal with Princeton University, USC
Universal Display Corp., Princeton University, and the University of Southern California have expanded their collaborative research agreement on advanced organic thin film devices through 2007.
2011-06-10 U.K. university studies advanced energy-saving methods
University researchers will explore how and why people use energy in the home, find high-tech ways to cut energy usage, and enable the design and evaluation of next-gen intervention strategies.
2008-04-16 U.K. university debuts first single-photon logic gate
Physicists at Bristol University in the United Kingdom have demonstrated the first logic gates on a silicon chip that can process individual photons, bringing quantum computing a step closer to reality.
2011-02-22 TSMC, Taiwan university create multi-angle 3D chip
The 3D TV chip allows TV viewers to see an object in stereo from various angles. It also comes with traditional HDTV and 3DTV functions.
2004-06-03 Tsinghua University to set up SMT lab
Tsinghua University will establish an SMT lab to promote electronic manufacturing development in mainland China. It's a collaboration with Flextronics Inc.
2004-04-13 Tsinghua University selects InfiniBand switch fabric
National Tsinghua University of China has selected InfiniCon Systems Inc. to supply a 10Gbps switch fabric for a 128-node, InfiniBand-based cluster.
2002-01-24 Tsinghua University ramps up production of blue LEDs
Tsinghua University has installed a GaN MOCVD reactor, purchased from AIXTRON AG, to ramp up production of blue LED epitaxial wafers.
2007-12-11 Toshiba sets up software lab in Vietnam university
Toshiba has established a software development laboratory at the College of Technology Coltech, Vietnam National University in Hanoi.
2013-02-18 Toronto University, KIT build nanoscale silicon-based LEDs
A research team from the Toronto University and the Karlsruhe Institute of Technology have created nanoscale silicon based LEDs, offering a significant potential as highly efficient light emitters.
2006-12-14 Tokyo university, Taiwan firms develop 512-core chip
The University of Tokyo recently finished up work on a 512 core chip in collaboration with Taiwan Semiconductor Manufacturing Co. and Alchip Technologies, a fabless ASIC company also from Taiwan.
2011-01-20 Tokyo University designs NVM architecture using Docea's Aceplorer
By using Docea Power's Aceplorer software to model power consumption at the ESL, University of Tokyo's Takeuchi Laboratory hopes to evaluate the optimum NVL architecture design and share power consumption data with system architects.
2006-08-14 Tohoku University, Epson agree on research, training tie-up
Tohoku University and Seiko Epson reached an agreement to cooperate in R&D, training and other possible fields of joint endeavor to help enhance science and technology capabilities in Japan.
2002-02-13 Tianjin University to establish design center for CMOS image sensors
Tianjin University will establish an ASIC design center that will focus in the design and development of CMOS image sensors.
2007-04-05 TI taps Indian university for R&D, chip innovation
Although the prospect of setting up a manufacturing facility is far from his plans in India, Texas Instruments CEO Rich Templeton is certainly excited about the Indian semiconductor policy that was announced a few weeks ago.
2006-03-31 Taiwan's Chung Hua University upgrades research capabilities
Tektronix announced that the Engineering College of Chung Hua University in Taiwan has selected its AFG3000 arbitrary/function generators to upgrade its electronic engineering research and teaching capabilities.
2005-01-06 SVT Group, Northeast University sign technology transfer pact
SVT Group, an investment company from Nanjing, mainland China, recently signed an agreement with Northeast University regarding technology transfers.
2010-06-23 ST, Tsinghua University expand R&D partnership
ST will provide the Tsinghua University with digital multimedia and advanced analog chips, expert support and advanced design tools, and jointly cooperate on applications engineering projects.
2002-12-23 SRC, North Carolina State University sign IP licensing pact
The Semiconductor Research Corp. (SRC) and the North Carolina State University (NCSU) have entered into a joint licensing and commercialization partnership, focused on commercializing selected inventions arising from SRC-sponsored university research programs at NCSU.
2011-05-31 SPTS, Griffith University to develop SiC-on-Si wafers
A joint agreement has been forged between SPTS and Griffith University for the commercial development of SiC-on-silicon wafers as viable semiconductor material for LED, power and MEMS devices.
2002-10-28 Shenzhen STS Micro, Tsinghua University to co-establish ASIC center
Shenzhen STS Microelectronics and Shenzhen Graduate School of Tsinghua University have collaborated to establish a joint ASIC Research Center in Shenzhen, China.
2003-01-21 Seiko Instruments to set up lab in Shanghai Jiao Tong University
Seiko Instruments Inc. has collaborated with Shanghai Jiao Tong University in the enhancement of its fine semiconductor process technology.
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