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2014-08-07 Samsung preps future SSDs with 3bit V-NAND chips
The soon-to-be-shipped chips feature a vertical architecture stacking 32 cell layers on top of one another, with each layer fitting 3bits of data. Samsung also launched a smart storage initiative to leverage unused capabilities of flash controllers.
2013-08-07 Samsung embarks on 3D V-NAND mass production
Samsung has begun mass producing 3D vertical NAND flash memory designed for range of application including embedded storage and SSDs.
2015-10-07 SSD boosts performance for high-end PCs, workstations
The 950 PRO SSD is Samsung's first consumer-ready non-volatile memory express (NVMe) M.2 form factor SSD with V-NAND technology supporting the PCIe 3.0 interface.
2013-10-07 3D NAND market share to grow 5.2 per cent in 2014
IHS stated that the share of the overall NAND market accounted for by 3D technology is seen to jump to 5.2 per cent in 2014, and then surge to 30.2 per cent of total flash memory shipments in 2015.
2015-05-22 Why Moore's Law is nowhere near ready to meet its maker
In 2003, Intel predicted an end to Moore's Law shortly after hitting the anticipated 16nm node, but today it seems we're on track for 10nm fairly soon with 7nm not far off.
2015-06-23 What's inside 1Xnm planar NAND?
Double patterning has become mandatory for making the 16nm node NAND flash and the memory makers use a self-aligned double patterning for the active, control gate, floating gate and bitline patterning.
2015-04-02 Toshiba flexes muscle in 3D NAND arena
The transition to 3D NAND is picking up speed as Toshiba announced in late March that it was shipping samples of its 48-layer 3D Bit Cost Scalable (BiCS) stacked cell structure flash.
2015-06-22 SSD standard preps for much-awaited update
As flash becomes more pervasive in data centres, vendors are diversifying their SSD offerings, in part to address different workloads, which JEDEC described in full detail.
2014-05-21 Samsung, Toshiba launch all-out 3D NAND production efforts
Both companies are gearing up for the production of 3D NAND devices, with Samsung in China and Toshiba in Japan, in preparation for the market that is believed to take off in the second half of 2015.
2014-10-17 Samsung to build $14.7B IC fab
In order to maintain leadership in memory IC sales and support new markets, Samsung is building a new wafer fab in South Korea, estimated at $14.7 billion.
2015-08-13 Samsung brings 3D NAND to mainstream
According to a company executive, Samsung will soon start making a version of its 850 EVO SSDs using its latest 48-layer, 3bit per cell, 256Gb 3D NAND chips.
2014-01-16 Mobile, SSDs boost NAND flash demand by 46% in 2013
With SSD applications gradually being sought after by the enterprise clients, demand for NAND flash is expected to reach 36 per cent in 2014, while industry value is set to exceed $27 billion, according to a report from TrendForce.
2014-08-26 Memory process roadmap soldiers on amid looming 3D tech
The constant reduction in feature sizes used to make ICs has improved memory-chip performance by increasing per-chip storage capacities, lowering power consumption, and improving data storage speed.
2015-04-22 Is resistive RAM the next NVM star?
Resistive RAM features low power consumption and a small cell areaboth compelling reasons for their adoption as a non-volatile memory.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2014-08-12 Flash Summit drives memory innovation
The biggest takeaway of the Flash Memory Summit was on the breadth and depth of work to turn solid-state drives into processing nodes for big data centres.
2015-10-30 Flash storage: 3D TLC NAND to beat MLC (Part 2)
In the first instalment of this series, we discuss alternate methods to increase density, as well as how a new innovation addresses SSD challenges surprisingly well.
2015-08-17 Flash Memory Summit paints SSD, flash future
During the event, Mike Jadon, CEO of Radian Memory Systems, revealed his company's Symphonic software that aims to replace the FTL code originally written in 1988 by Robert Norman of SanDisk.
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