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2008-02-26 Yole sees increasing WLP adoption in ICs
Yole Dveloppement released an analysis on the adoption of WLP in semiconductors based on the idea that WLP technology can be implemented in the most cost sensitive applications.
2001-01-01 Thick photoresist patterning for WLP applications
Solder bumps, gold bumps, copper posts and copper wires for redistribution in wafer-level chip-size packaging require a resist mold that is later electroplated to form the final metal structures in advanced interconnect technologies.
2014-08-19 Monolithic 3D accelerometer boasts WLP tech
The MXC400xXC three-axis accelerometer boasts a technology breakthrough in combining the 3D IC sensor with full WLP that translates directly to a 60 per cent cost and 50 per cent size reduction.
2006-06-14 Infineon introduces first BAW filters using WLP tech
Infineon Technologies announced the extension of its Bulk Acoustic Wave filter product portfolio for UMTS/W-CDMA cell phones at the MTT International Microwave Symposium.
2003-06-20 Wafer Level Package Technology
This application note discusses the properties and functions of the Wafer Level Package technology
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2014-03-13 STATS ChipPAC unveils novel wafer level manufacturing
FlexLine claims to provide freedom from wafer diameter constraints while enabling supply chain simplification and cost reductions that are not possible with a conventional manufacturing flow.
2013-04-16 Slow but continuous growth for glass substrate market
Yole Dveloppement's report noted that the demand for glass is growing, and glass has already been adapted for various and unique wafer-processing functionalities and platforms supporting a wide range of end-applications.
2015-02-05 Rudolph sends JetStep for fan-out packaging apps
The JetStep Advanced Packaging Lithography System handles both warped wafers and flexible substrates. It offers 52mm x 66mm field view and 30-reticle library.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2004-03-26 Amkor, Casio join forces on wafer-level packaging
Amkor Technology Inc., Casio Computer Co. Ltd and Casio Micronics Co. Ltd have established business and technology licensing agreements for assembly and test of wafer-level semiconductor packages, commonly known as WLP.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2003-07-07 SECAP installs wafer line at Hsinchu
The Semiconductor Equipment Consortium for Advanced Packaging has installed a 300mm wafer bumping and WLP line at Unitive Semiconductor located in Hsinchu, Taiwan.
2009-10-14 Flash driver offers two switching frequency options
Maxim Integrated Products is offering the MAX8834, a 1.5A white-LED (WLED) flash driver IC in a tiny, 5mm x 5mm wafer-level package (WLP).
2011-10-10 eWLB tech aimed for mobile, cloud apps
STATS ChipPAC's FO-WLP technology platform combines eWLB, TSV and IPD to enhance packaging solutions.
2005-01-20 Casio licenses packaging technology to Renesas
Casio Computer Co. Ltd has licensed its wafer level packaging (WLP) technology to Renesas Technology Corp. in an attempt to create an industry de facto packaging standard.
2008-12-09 Board mounting application note for 0.800mm pitch devices
To simplify board mounting and improve reliability, International Rectifier manufactures WLP devices to exacting standards. These high standards have evolved through evaluating many different materials and designs. Although such evaluations have yielded good results, the recommendations in this application note may need to be adjusted to suit specific production environments.
2009-06-17 Board mounting 0.5A FlipKY
The 0.5A FlipKY package is a Schottky diode device delivered in the form of a wafer level package (WLP). This application note is designed to help the customer prepare for and assemble 0.5A FlipKY in an effective manner.
2005-03-11 Alphasem rolls out 'ultimate tool' for die sorting
Alphasem AG disclosed that its Easyline 8031T is the ultimate tool for die sorting into carrier tapes or onto surf tapes for subsequent processes like WLP, COB and FCOB.
2003-10-16 Yamato Works reflow oven suits 300mm wafers
The N2 reflow oven for solder bump forming from Yamato Works Co. Ltd features hot plate and upper far-infrared rays that can be used for heating.
2010-03-31 WLED driver ensures precise brightness control
Maxim Integrated Products is rolling out a high-efficiency WLED driver with an integrated boost converter and five GPIO ports.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field.
2004-11-10 Wafer processing device provides quick, accurate leveling
CyberOptics announced a wireless, wafer-like device that enables quick and accurate leveling of semiconductor wafer processing and automation equipment.
2003-07-16 Wafer coating system eyes deep-UV lithography
Dainippon Screen Mfg. Co. Ltd has released its RF3 offering that is a 300mm coating/developing system for advanced deep-UV lithography.
2012-02-22 USB charger detectors boast universal usability
Maxim's MAX14578E and MAX14578AE operate from -40?C to 85?C and have an on-chip LDO that provides 5.3V output to power a USB transceiver.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2009-08-03 Touch-interface systems pack haptic controller
Maxim Integrated Products has developed the MAX11810 and MAX11811, the first touch-interface systems with integrated 4-wire touchscreen controllers, haptic controller drivers, and IR-based proximity sensing.
2009-10-09 Tiny WiMAX transceiver maximizes data throughput
Maxim Integrated Products a MIMO RF transceiver that maximizes data throughput in nomadic and mobile WiMAX subscriber applications
2008-08-27 Tiny OVPs brandishes negative polarity protection
Maxim Integrated Products introduces the MAX4970/MAX4971/MAX4972, a family of tiny, 2mm x 1.5mm OVPs that guard low-voltage systems against faults up to 28V.
1999-11-17 The role of silicon germanium in optimum technology matching
This paper will examine the process of OTM (Optimum Technology Matching), and discuss the role of SiGe within that framework.
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