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2006-07-12 Microbonds rolls out evaluation kit for X-Wire tech
The X-wire 2.0 Head Start Kit enables users to conduct a feasibility evaluation of X-Wire Technology, for its use as an interconnect option for IC packages, Microbonds said.
2006-07-10 Cookson, Microbonds to align technology roadmaps
Cookson Electronics and Microbonds partner to align the technology roadmaps of Microbonds' insulated wire bonding technology with Cookson's molding compounds.
2005-07-26 K&S, Microbonds form bonder alliance
Kulicke & Soffa Ind. Inc. and Microbonds Inc. announced a joint process development project.
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