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2013-04-15	How to recover lost yield A systematic optimisation methodology may be used to shape the design's digital power noise signature, and counteract both dynamic voltage drop and on-chip noise to recover the lost yield
2013-05-30	Collaboration to yield low cost interposers for 2.5D ICs ASTAR Institute of Microelectronics*, Qualcomm Technologies and STATS ChipPAC teamed up to address issues related to high volume manufacturing of 2.5D interposers
2013-11-27	MagnaChip, YMC tout 0.35um, 0.18um embedded MTP IP sol'ns The solution covers several standard memory cell sizes and is intended for embedded applications such as display, PMIC and LED controllers.
2003-08-07	Wolfson powers digital audio apps with new release Wolfson Microelectronics plc has introduced two digital audio interface products for the consumer audio and professional markets
2006-06-27	UMC is getting 65nm interest According to major silicon foundry United Microelectronics Corp., it has been getting a lot of interest in 65nm designs
2003-03-14	KLA-Tencor launches online Taiwan customer support center KLA-Tencor Corp. has opened its first online support center in Taiwan.
2004-01-20	Innovation to drive chip performance curve When a guy like Bernard S. Meyerson, CTO of IBM Microelectronics, tells a roomful of Taiwanese designers and process engineers that traditional CMOS scaling is dead, they take it in stride
2002-06-19	Chip industry tackles escalating mask costs The rapid increase in the cost of photomask sets for advanced IC processes has made a lot of news in recent months.
2003-01-10	Camtek selects KDC as distributor in Japan Camtek Ltd has signed Kanematsu Devices Corp. to distribute its products for microelectronics manufacturing in Japan
2005-07-25	UMC, Virage Logic to enable optimal IP development Taiwan-based semiconductor foundry United Microelectronics Corp. and Virage Logic Corp., a pioneer in Silicon Aware IP, have announced an agreement where Virage Logic will extend its IP and circuit design expertise to jointly work with UMC to enable optimal IP development for UMC's 65nm process technology
2014-10-30	UMC grabs large piece of 28nm business United Microelectronics Corp. said that it has grabbed a larger piece of the 28nm business that is dominated by TSMC. UMC reiterated its capital expenditure for this year is at about $1.3 billion
2004-12-23	UMC enhances 90nm manufacturability with Synopsys AA-PSM United Microelectronics Corp. is using Synopsys Inc.'s alternating aperture phase-shift mask (AA-PSM) technology to enhance manufacturability for its 90nm process
2005-05-26	UMC adopts Synopsys i-Virtual stepper system for photomask United Microelectronics Corp. (UMC) has adopted Synopsys Inc.'s i-Virtual Stepper system (i-VSS) for photomask inspection qualification
2013-07-18	UMC adopts Cadence's DFM flows for 28nm node The flows address both random and systematic yield issues and incorporate DFM prevention, analysis, and signoff capabilities
2005-11-23	Synopsys, UMC partner on low power 90nm reference flow EDA giant Synopsys Inc. and Taiwanese foundry United Microelectronics Corp. (UMC) Monday (Nov. 21) announced the availability of a 90nm reference design flow that is said to be optimized for low-power system-on-chip (SoC) designs
2005-10-19	Speedy-Tech shareholders say yes to merger with IMI Philippine EMS provider Integrated Microelectronics, Inc. (IMI) has announced that the shareholders of Speedy-Tech Electronics Ltd of Singapore have approved the merger of the two companies
2011-12-30	Rapid acoustic inspection for 300MM wafer generation (Part 1) As wafers become larger and individual die become smaller, acoustic micro imaging is developing the non-destructive tools that can remove defective die to boost reliability and yield
2008-11-12	IBM transits to 45nm SOI With an objective to lead in an emerging technology, IBM's Microelectronics Group has launched what it claims as the industry's first 45nm, SOI foundry offering
2004-04-21	IBM reports $150M loss in IC unit, blames fab yields IBM Corp. on Thursday (April 15, 2004) disclosed a $150-million loss within its former technology unit, mostly due to ongoing chip yield issues and a drop in intellectual property revenues
2010-07-13	EVG, IME join hands on 3D IC integration EV Group and Singapore's Institute of Microelectronics (IME) signed a two-year agreement to cooperate on developing 3D IC integration technologies
2010-06-23	Elpida, PTI, UMC team on 3D IC integration for 28nm Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm
2006-08-07	Automatic die bonder offers increased precision, accuracy Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area
2004-01-16	Audio chip aims at loaded cellphones Wolfson Microelectronics introduced a low-power audio chip that integrates many of the audio-related components a cellular multimedia system would need
2008-11-21	Actel turns to UMC for 65nm eFlash FPGAs Actel Corp. has tapped United Microelectronics Corp.'s (UMC) foundry service for the production of its next-generation flash-based FPGAs
2013-07-25	UMC, SuVolta team up for 28nm low-power process tech The joint effort aims to yield a process that integrates SuVolta's Deeply Depleted Channel transistor technology into UMC's 28nm High-K Metal Gate high-performance mobile process
2004-09-15	Cost pressures spotlight design reuse The ultimate ultra-low-k material that complies with future microelectronics has not yet been found
2014-02-26	400MHz RF transceiver geared for wireless smart energy apps Cubic Micro and ASTAR IME collaboration yield* low-power RF transceiver for wireless smart energy management and remote industrial monitoring
2016-05-13	0.18μm MTP-IP devices enable cost-effective manufacturing The new multiple-time programmable intellectual property (MTP-IP) was developed by using MagnaChip's 0.18μm mixed signal 5V processes, which significantly reduce the number of mask layers and manufacturing process steps.
2002-07-08	Xilinx struggles to fulfill orders Xilinx Inc. said it is struggling to fulfill orders for some of its newer FPGA products following reports that programmable-logic players may be in for a rocky second half of the year.
2005-05-25	WiMax upheaval on course Read an update on WiMax broadband access technology.