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2004-04-27	Tra-Con epoxy adhesive with low viscosity Tra-Con's TRA-DUCT 921M01 epoxy adhesive is designed for apps which require electrical conductivity and a long pot life at a relatively low heat cure.
1999-12-18	Standard 4" wafer adhesive tape specification Specification for standard 4" wafer adhesive tape
2003-05-08	Silver epoxy adhesive suits microelectronics apps Tra-Con Singapore's Tra-Duct 2958 snap cure, conductive silver epoxy adhesive is designed for use in microelectronics systems.
2003-09-02	Rogers adhesive material is electrically conductive Rogers Corp. has introduced a conductive adhesive for its BISCO EC-2000 electrically conductive solid silicone series.
2003-01-07	RF connector snaps in without adhesive Bomar Interconnect Products has expanded its E-Snap line of edge-board connectors with a low-profile MCX connector feature.
2006-07-31	Master Bond launches adjustable mix ratio adhesive Master Bond said its Polymer System EP21 has the unusual characteristic of allowing an adjustment of the properties of the cured system by altering the mix ratio.
2006-11-07	Master Bond adhesive is resistant up to 205°C Master Bond announced it has developed a two-component, high temperature-resistant, thermally conductive epoxy adhesive, sealant and coating that features resistance up to 205°C.
2002-12-16	Fiber-optic adhesive suit high-humidity environments The Tra-Bond F109 fiber-optic adhesive can be used in multi- and single-mode connectors where connections must be made in high-humidity environments.
2002-12-09	Adhesive tape secures ultra-thin wafers on substrates Sekisui Chemical Co. Ltd has announced the development of the SELFA adhesive tape for automated wafer grinding and polishing.
2007-08-23	Adhesive solution cures fast sans external heat Master Bond's EP30-4 is a transparent, low-viscosity, fast-curing adhesive, sealant and coating that is suitable for applications requiring rapid cure without adding external heat.
2007-10-16	Adhesive provides 7,500psi tensile strength Master Bond has unveiled the EP30D-12, a versatile two-component elastomer featuring high strength, toughness and chemical resistance developed.
2008-01-29	Adhesive gels in 3mins, cures to 3,150psi Master Bond's Polymer Adhesive EP44 gels in about 3mins and cures within a few hours at ambient temperatures to develop a high bonding shear strength of more than 3,150psi.
2014-02-05	Adhesive film boasts extreme temperature capabilities Rogers' COOLSPAN thermally and electrically conductive, thermosetting, silver filled adhesive film is used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.
2006-09-06	Adhesive delivers superior strength up to 205°C Master Bond has introduced a uniquely toughened epoxy compound for high-performance bonding, sealing and casting, which promises high peel strength and superior resistance to vibration, impact and shock for service up to 205°C.
2001-03-01	Via-fill materials for next-generation interconnect Via-fill polymers for next-gen interconnects are designed to improve on the performance capabilities of traditional epoxy-based via-plug materials.
2004-01-13	Taiflex Scientific to merge with China Grand Precision Coating Taiflex Scientific Co. Ltd has agreed to merge with China Grand Precision Coating Co. Ltd, an adhesive copper-clad-laminate FCCL and adhesive-coverlay company.
2006-12-07	Silver-filled adhesives withstand harsh conditions Master Bond's Polymer System AC85 adhesive and sealant features long-term durability, even when exposed to harsh environmental conditions, due to its oxidation- and chemical-resistant properties.
2007-02-07	Silicone elastomer withstands high temperature Master Bond's Master Sil 700 silicone elastomer is a high-quality silicone adhesive/sealant that features a combination of flexibility and high temperature resistance.
2002-10-18	Park FR-4 epoxy offers improved thermal stability Park Electrochemical Corp. has announced the availability of the N4000-11 Caf-resistant, FR-4 epoxy material designed for use in lead-free assembly substrates.
2003-03-13	Newport facility obtains ISO 9001 certification Newport Corp. has announced that the company's facility in Chandler, Arizona, U.S.A., has achieved ISO 9001 registration.
2013-11-05	New material for wafer-scale mass processing of lab-on-chips With JSR's innovative photo-patternable adhesive material, Imec has processed microfluidic cell-sorter devices, merging microheaters and sensors with wafer-scale polymer microfluidics.
2002-07-18	Matsushita Electric develops surface mount technology Matsushita Electric Ind. Co. Ltd has developed a surface-mounting technology called AdITR that uses conductive adhesives.
2002-04-22	Loctite offers fiber-optic bonding adhesives The OptiLOC adhesives for fiber-optic bonding applications from Loctite Corp. includes room temperature and heat curable epoxies, and anaerobic adhesives that can be used in telecom, data linking, and networking applications.
2014-10-17	Henkel buys Bergquist to extend reach in APAC region Bergquist's strong business presence in the Asia Pacific will advance Henkel's production and R&D capabilities in adhesive, sealants and functional coatings to help deliver greater sustainable solutions.
2007-01-04	Epoxy resin features 'exceptional' flexibility Master Bond's EP21TDC-2AN exhibits 31 percent elongation, said to be exceptional for a thermal conductive epoxy where the conductivity is 2.6W/m锟?°K.
2007-03-02	Epoxy offers temperature resistance to 205°C Master Bond's new epoxy for general-purpose bonding, casting, coating and potting has a service temperature range that starts at -50°C and reaching to over 205°C.
2007-07-20	Epoxy cures at room temperature, withstands 235°C Master Bond's EP33 is a two-component epoxy that cures at room temperature cure and withstands temperatures in the 205°C to 235°C range.
2007-01-03	Encapsulant suits image sensor assembly Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications.
2002-03-22	Dow Corning unveils heat dissipation materials Developed to remove and dissipate heat away from electronic devices, the company's 3-6751 and 3-6752 thermally-conductive adhesives, and the 3-6651 thermally-conductive elastomer can be used in applications such as bonding and gap fill.
2000-09-01	Dispensing for high-yield assembly As components are becoming smaller and more complex, the ability to dispense increasingly tiny dots of adhesive or solder paste at precise locations on a board has become a vital requirement for many applications.