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2006-12-07	Silver-filled adhesives withstand harsh conditions Master Bond's Polymer System AC85 adhesive and sealant features long-term durability, even when exposed to harsh environmental conditions, due to its oxidation- and chemical-resistant properties.
2002-04-22	Loctite offers fiber-optic bonding adhesives The OptiLOC adhesives for fiber-optic bonding applications from Loctite Corp. includes room temperature and heat curable epoxies, and anaerobic adhesives that can be used in telecom, data linking, and networking applications.
2014-01-29	Cost-efficient 3D IC wafer processing without adhesives AML showcased a unique solution to get rid of the adhesive and to allow for a vacuum to be created between the carrier and the wafer to be processed in 3D IC production.
2003-10-28	Adhesives Research to break ground at Singapore center Adhesives Research Pte Ltd announced that it is set to open its new technical center located at the Singapore Science Park 2 on November 10, 2003.
2006-03-13	Adhesives feature low CTE Advanced Applied Adhesives announced the availability of a new series of electrically insulating die attach adhesives that is said to feature a low coefficient of thermal expansion.
2013-10-14	System for contactless dispensing of liquid media unveiled The DELO-DOT PN2 all-round jet system has a modular design, while the DELO-FLEXCAP cartridge system allows bubble-free dispensing of adhesives with a viscosity ranging from low to high.
2002-03-26	Rohm and Haas to construct specialty material plant in India Specialty materials supplier Rohm and Haas Co. will construct a manufacturing facility in Mumbai, India worth $20 million.
2002-03-22	Dow Corning unveils heat dissipation materials Developed to remove and dissipate heat away from electronic devices, the company's 3-6751 and 3-6752 thermally-conductive adhesives, and the 3-6651 thermally-conductive elastomer can be used in applications such as bonding and gap fill.
2002-08-22	Ziptronix develops new wafer bonding technique Ziptronix has introduced a process that achieves permanent, covalent bonding of semiconductor materials at room temperature without adhesives.
2006-04-05	Process for depositing silver epoxy delivers higher throughput DEK announced that it has successfully developed processes for depositing silver epoxy and B-stage adhesives for die attach apps, delivering higher throughput and repeatability.
2002-07-18	Matsushita Electric develops surface mount technology Matsushita Electric Ind. Co. Ltd has developed a surface-mounting technology called AdITR that uses conductive adhesives.
2011-10-14	IBM, 3M partnering for 3D ICs IBM Corp. and 3M Corp. are collaborating on developing the first adhesives that can be used to package semiconductors into densely stacked silicon "towers."
2004-04-16	Zymet underfill encapsulants eyes CSP, BGA apps Zymet has developed a reworkable underfill encapsulant that is designed for CSP and BGA encapsulation.
2014-05-28	Wafer-to-wafer bonding pulls off sub-micron accuracy The sub-micron accuracy was achieved using Ziptronix's technology and EVG's equipment. This approach can be used to manufacture fine-pitch 3D ICs for stacked memory and SoCs, and image sensors.
2014-03-10	Valve controller regulates fluid dispensing cycle The valve controller features modes that allow parameters to be set automatically, and manually via a host PC or programmable logic controller.
2006-04-26	UV sensor shrinks size, maintains performance EMX Industries said its remote ultraviolet luminescence sensor is 87 percent smaller than previous models but still maintains long range, high resolution and ease of use.
2009-02-20	UV LEDs target medical, industrial apps TT electronics Optek Technology has released the OUE8A Series of UV LEDs in the UV-A spectrum offered in a variety of wavelengths and housed in hermetic TO-46 metal can packages.
2012-07-26	Techniques, procedures for die bonding Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world.
2009-10-01	SUSS MicroTec joins ITRI 3D consortium The Advanced Stacked-System Technology and Application Consortium will implement SUSS MicroTec's 300mm technology.
2006-07-12	Silicone polymer react to UV light, humidity Master Bond said its UV/RTV dual cure silicone polymer is formulated to react with both ultraviolet light and atmospheric humidity.
2007-01-01	Samsung piles chips for thin MCPs Samsung Electronics' advanced packaging technology piles 16 chips on top of each at an unbelievable height of only 1.4mm.
2005-11-09	Rogers displays new lines of adhesiveless, API circuit materials Rogers Corp. disclosed that it will showcase its two new lines of 2L-FCCL adhesiveless at next week's Productronica in Germany
2003-09-02	Rogers adhesive material is electrically conductive Rogers Corp. has introduced a conductive adhesive for its BISCO EC-2000 electrically conductive solid silicone series.
2013-10-07	Richardson reveals extrusion profiles from Wakefield-Vette The portfolio features more than 35 extrusion profiles along with various thermal management products such as bonded fin heat sinks and liquid cold plates, as well as thermal management accessories.
2003-01-07	RF connector snaps in without adhesive Bomar Interconnect Products has expanded its E-Snap line of edge-board connectors with a low-profile MCX connector feature.
2016-02-01	Preventing common MEMS failure mechanisms The first step in ensuring MEMS reliability is to avoid common pitfalls during the design and process development phase to assure a stronger and more reliable part-upon-marketplace introduction.
2008-12-16	Practical aspects of touchscreen systems The need for innovative user interface solutions becomes more essential to device design. Projected-capacitance touchscreens can help designers face this challenge.
2002-12-09	Pioneer Tech FCCLs come with ultra-thin cooper foils Pioneer Tech's two-layer adhesiveless FCCLs come with copper foils with thickness ranging from 3?m to 9?m.
2005-11-28	Phase change material offers performance and easy use Laird Technologies introduced a new high-performance phase change material that meets the thermal resistance and reliability requirements needed for advanced apps such as microprocessors, chipsets, graphic processing chips and custom ASICs.
2006-04-14	Omron to increase RFID inlay production capacity Omron revealed more specific plans related to the November 2005 announcement of a $20 million worldwide investment in the RFID business over a two-year period.