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2006-07-06 X-ray analyzer eases advanced chip packaging
Xradia said the MicroXCT is suited for the engineering and failure analysis of next-generation semiconductor packages, including multistacked die and flip-chip architectures.
2013-07-09 USHIO books its interposer stepper for 2.5D/3D packaging
The UX7-3Di LIS 350 has achieved a resolution of 2?m L/S on a 300mm Si wafer as well as an organic substrate and is able to address a warp or expansion/contraction of an organic substrate.
2002-07-05 Unitive adopts Semitool's packaging platform
Semitool Inc. has announced the delivery of its electroplating system product, the Advanced Packaging Platform (APx), to Unitive Inc.
2002-07-19 Tegal joins the IC packaging alliance
Tegal's membership is expected to strengthen APiA's position in the IC packaging and interconnect industry
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2015-02-05 Rudolph sends JetStep for fan-out packaging apps
The JetStep Advanced Packaging Lithography System handles both warped wafers and flexible substrates. It offers 52mm x 66mm field view and 30-reticle library.
2013-09-05 Rudolph rolls NSX tool for IC, MEMS and LED packaging
The NSX 220 is an automated macro defect inspection system that uses grey-scale image analysis to provide accurate inspection and metrology in final manufacturing applications for wafers up to 300mm in size.
2006-01-25 PMDs offer low packaging profiles
NEC Electronics' new low-voltage power management devices promise to deliver very low packaging profiles that enable designers to realize a smaller design footprint
2006-01-30 Pillars replace balls in Intel processor packaging
Intel's Presler and Yonah processors make use of copper pillar bumping as an alternative to lead-tin solder balls, according to Chipworks.
2014-12-17 Packaging and testing industry trends from 2013 to 2014
In 2014, the output value of OSAT industry is seen to grow by 8.4 per cent and the advanced packaging industry is expected to increase by 10 per cent.
2006-11-13 Outsourced IC packaging to reach $13.1B
The market scale of outsourced IC packaging is estimated to hit $13.1 billion in 2006, with Taiwan gradually becoming a powerhouse in the test and packaging industry segment, according to Research and Markets
2004-06-02 Newport system offer "advanced alignment&quot
Newport has added an "advanced alignment" feature to its MRSI-605 packaging die bonder.
2013-07-26 Metrology system configured for advanced packaging
Rudolph Technologies' metrology suite includes specially-designed configurations for wafer level packaging, 2.5D (interposer) and 3D ICs using through-silicon via (TSV) as interconnects
2003-06-12 Mentor PCB acquisition boosts packaging design
The ongoing consolidation of the PCB CAD marketplace has resumed, as Mentor Graphics announced its purchase of the assets of Dansk Data Electronik-EDA A/S.
2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions
2007-11-08 IBM-led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices
2015-08-07 Global IC packaging markets log in $48B revenue in 2014
According to New Venture Research, the IC packaging market is experiencing robust health with worldwide revenues and YoY growth exceeding 10 per cent
2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years
2002-09-20 Fairchild establishes packaging design center in Korea
Fairchild Semiconductor has launched a Package and Technology Knowledge Center in Bucheon, South Korea.
2004-03-10 Chipbond buys Ultratech packaging lithography tool
Taiwan foundry Chipbond Technology Corp. has purchased Ultratech Inc.'s Saturn Spectrum 3e advanced packaging lithography tool.
2003-10-06 Cadence teams with startup for packaging solution
Claiming to offer the industry's first integrated IC packaging design solution, Cadence Design Systems announced the availability of the APE-3D
2011-04-18 Applied announces packaging, display forays
Applied Materials has teamed up with IME to build a center for advanced packaging in Singapore.
2014-04-22 Altera adopts fine-pitch copper packaging for Arria FPGAs
TSMC's flip chip ball grid array package technology utilises fine-pitch copper bumps measuring less than 150?m, providing excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers.
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density.
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2014-08-11 Advanced packaging drives SPTS buyout
Orbotech, a provider of optical inspection equipment for PCBs and flat-panel displays, acquired SPTS, a semiconductor etching and deposition company, for $300 million.
2012-03-09 A*STAR, Applied Materials unveil 3D chip packaging R&D center
The new facility positions Singapore as a global leader in semiconductor R&D and is expected to help accelerate the development and adoption of 3D packaging technology globally
2015-11-12 A*STAR set-ups high density, low-cost packaging consortium
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles.
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics
2005-11-03 Xilinx FPGAs enable advanced telematics platforms
Xilinx Inc. includes Spartan-3e family and Virtex-4 platform FPGA devices in the its XA product family of PLDs.
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