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2007-01-17 Chinese city vies for Intel chip plant
Officials in a northern China science park are stoking rumors that Intel Corp. wants to build an advanced chip plant in the area and will announce its intentions as early as March
2015-11-20 China's chip acquisitions send ripples across industry
The technologies and IP targeted by China include disk drives, CMOS image sensors, servers, memory chips and advanced semiconductor packaging and test services.
2008-08-27 Cadence tool steps up IC package, SiP designs
The release of SPB 16.2, due in November of this year, from Cadence Design Systems, delivers advanced IC package/system-in-package miniaturization, design cycle reduction and DFM-driven design, along with a new power integrity modeling solution
2003-10-17 Cadence IC package, PCB design flow runs on Linux
Cadence Design Systems Inc. has announced what it claims is the industry's first complete front-to-back advanced IC package and PCB design flow to run on Linux
2015-12-18 Bid to buy SPIL intensifies
Advanced Semiconductor Engineering increased its bid to buy rival Siliconware Precision Industries after China's Tsinghua Unigroup Ltd agreed to take a minority investment in SPIL
2007-01-03 Back-end memory testing could tighten in '07, says analyst
The back-end memory testing industry may become tighter in the second half of 2007, as memory packaging and testing companies struggle to keep pace with a changing and rapidly growing market
2009-07-21 ASESC kicks off Li-ion battery production
Automotive Energy Supply Corp. (AESC) has begun trial production of advanced Li-ion batteries for a wide range of automotive applications at its Zama Operations Center
2002-12-17 ASE to mass produce image sensor packages
Advanced Semiconductor Engineering Inc. has announced that it is ready for volume production of its image sensor packages
2002-11-05 ASE launches 300mm flip-chip bumping volume production
Advanced Semiconductor Engineering Inc. has announced that its 300mm wafer flip-chip bumping line is ready for volume production
2002-07-30 ASE develops fine pitch wire bonding technology
Advanced Semiconductor Engineering Inc. has completed the development of tri-tier wire bonding technique that will enable ICs to have smaller areas and denser I/Os
2005-12-19 Analog switches feature CSP, very low ON-resistance
Pericom introduced a new family of advanced analog switches created for mobile terminal applications which feature CSP, very low ON-resistance, and wide voltage ranges
2007-11-28 Analog devices improve processor system reliability
ST unveiled an Advanced Analog division that offers a variety of components that support microprocessors in reducing parts counts and lowering system cost, while ensuring system robustness
2003-11-04 Amkor qualifies IC packages for consumer products
Amkor Technology Inc. announced that they have completed qualification for two IC packaging solutions in its J1 factory in Kitakami, Iwate-Prefecture, Japan
2015-10-19 AMD drops test, assembly business
AMD sold a majority stake in its test, assembly and packaging facilities in Asia as part of a joint venture with NFME. The move gains AMD nearly $320 million as it continues to fight persistent sales decline
2003-04-08 AMD adopts Unitive wafer bumping technology
Advanced Micro Devices Inc. has signed Unitive Inc. to provide its proprietary electroplated wafer bumping technology for AMD's microprocessor chipsets assembly process
2008-12-22 Alliance seeks funds to create Li-ion cell fab
The National Advanced Transportation Battery Cell Manufacture alliance is seeking $1 billion or more of U.S. government funding to create a fab for Li-ion cells
2006-12-06 AIT granted leadframe technology patent
Advanced Interconnect Technologies was granted U. S. patent number 7,129,116 for developing a process for the manufacture and use of partially patterned leadframes with near-chip scale packaging lead-counts.
2004-08-17 ADI ADC packs power in 3-by-3mm TSOT package
ADI introduced ten serial ADCs that promise to bring ultra-compact packaging technology to data acquisition equipment and automotive systems
2008-10-22 3D PoP stacks roll as next killer tech for handsets
As part of Moore's law trend of having smaller, sleeker handheld devices, designers can leverage improved packaging and interconnect processes to achieve the miniaturization requirements
2005-05-09 'Most accurate' chargers ICs
The ISL6251 and ISL6255 from Intersil are touted to be the world's most accurate and advanced chemistry-independent battery chargers
2013-09-19 Microchip, element14 announce Raspberry Pi expansion board
The Raspberry Pi chipKIT Expansion Board claims to offer Raspberry Pi Users 3.3V Arduino compatibility and a 3.3V MCU in prototyping-friendly packaging
2011-07-27 LEDs support wavelength customization
ROHM Semiconductor's new LEDsbased on advanced phosphor technologyemit custom colors such as pink, blue green, white and pastels
2012-05-16 Interconnects push LED solution upgrades
Molex has presented solderless LED array holders and other microminiature connectors that the company says can enable advanced lighting solution designs
2016-04-07 Boost functionality of industrial DC/DC converters
Know how modern packaging technology can help improve the performance of industrial DC/DC converters that require more functionality
2007-09-20 Vietnam reaches for electronics dreamdespite hurdles
The Saigon Hi-Tech Park looks a little more than a flattened patch of land on the dusty outskirts of Ho Chi Minh City in Vietnam, but like the country itself, it's a place with big dreams that look set to become a realityhurdles notwithstanding.
2009-08-25 Vietnam IC manufacturing hits roadblocks
Vietnam has hit a few speed bumps along the road in its dreams to develop an IC manufacturing industry.
2008-05-12 Vietnam government approves V-CAPS venture
V-CAPS to move forward with plans to set up a 35,000m? semiconductor assembly and test facility at the Hoa Lac Hi-Tech Park after the government of Vietnam recognized the company as a 100-percent foreign owned high tech venture.
2014-03-14 Vicor CEO shares probable trends in power tech
Phil Davies, VP of global sales and marketing at Vicor, said that large datacom and data centres eyeing HVDC distribution, and packing power in smaller packages as forthcoming trends in 2014.
2010-11-22 Ultratech to inaugurate Singapore headquarters
Lithography and laser-processing systems Ultratech Inc. is set to open a new international headquarters in Singapore on December 6, 2010 to better serve its customer base in Asia.
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
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