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2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2008-04-10 VI bricks feature advanced modular power platform
The VI BRICK, from Vicor's brick business unit, touts an advanced modular power platform incorporating the technical attributes of the company's V?I Chip technology and robust packaging that facilitates enhanced thermal management and through-hole assembly.
2006-09-25 VGA SoC image sensor integrates advanced ISP algorithms
Fabless semiconductor company Pixelplus Co. Ltd unveiled its new customized VGA SoC image sensor designed for various mobile and non-mobile applications.
2010-09-17 Verigy bags SEMI's 1st advanced testing innovation award
Verigy, has won Semiconductor Equipment and Materials International's (SEMI) first Advanced Testing Innovation Award
2014-03-14 Tunable laser expands system capacity in advanced optical networks
A*STAR IME and NTU claimed the smallest wavelength-tunable laser fabricated by MEMS technology and can generate light from 1531.2-1579.5nm of the near-infrared region.
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2006-10-05 Transceivers feature advanced power saving function
Sipex has announced two new RS-232 transceivers said to be the first to incorporate the Auto On-line Plus advanced power saving function
2008-09-04 Tegal secures products, IP for 3D packaging, MEMS
Tegal Corp. has signed an agreement with AMMS and Alcatel-Lucent to acquire products and the related intellectual property, directed at advanced 3D wafer-level packaging applications.
2015-09-28 SiP, PVS tech enabled for TSMC InFO packaging
Cadence said the Allegro SiP design tools and PVS allow TSMC customers to cut the InFO design and verification cycle by offering an integrated solution that automates the design-rule checking (DRC) flow.
2007-08-17 Shifting trends in packaging industry favor big players
Industry insiders agree the packaging business is getting increasingly expensive, a trend that naturally favors larger players
2015-01-12 Samsung reveals advanced mobile memory
While the LPDDR4 chip received an honorary innovation award at CES, it won't make its way to flagship phones until later this year when Samsung partners ship devices now in development.
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology.
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development
2004-04-28 Optimal design tools suit IC, packaging, PCB
Optimal has released its O-Wave series of products for 3D, full-wave signal integrity simulation, analysis and verification for high-speed IC, packaging and PCB
2004-03-05 Omron laser sensor offers advanced object detection
Omron's photoelectric laser sensor provides advanced object detection, positioning and high-resolution sensing
2007-02-06 NXP, ASE to build testing and packaging center in China
NXP Semiconductors and Advanced Semiconductor Engineering will form a joint venture in Suzhou, China focused on semiconductor testing and packaging for mobile communications, consumer electronics and automotive products.
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies
2008-09-22 Next-generation embedded packaging solution rolls
Imbera Electronics introduces its next-generation integrated module board technology, available across the company's full range of turnkey manufacturing services.
2006-07-26 New wafer bonding system targets advanced MEMS
Touted to be an industry-first, SUSS MicroTec's field upgradable load locked wafer bonding system was developed for advanced MEMS devices
2004-09-21 Molex acquires packaging supplier INCEP Technologies
Interconnection components supplier Molex Inc. has acquired INCEP Technologies Inc., in an attempt to penetrate the market for power delivery interconnect solutions.
2002-05-15 Logic offered in no-lead QFN packaging
Texas Instruments, Integrated Device Technology, and Hitachi Semiconductor are launching 20-, 16- and 14-pin QFN packaging for gate- and octal-bit-width logic devices for PDAs, cell phones, and other handheld consumer electronics
2009-05-27 ITC favors Tessera in packaging patent suit
The U.S. International Trade Commission (ITC) has issued a limited exclusion order blocking the import of chips from six companies it has determined infringed two packaging patents of Tessera Technologies Inc
2007-11-14 Infineon reveals new packaging technology
Infineon Technologies unveils a new package technology, and has tapped Advanced Semiconductor Engineering as its IC packaging partner.
2015-11-26 Industrial controller streamlines advanced IoT designs
NI's IC-3173 packs dual-core Intel i7 processors with user-programmable Xilinx Kintex-7 160T FPGAs for advanced signal and image processing, customisable digital I/O and high-speed closed-loop control
2007-10-18 Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies
2012-06-18 IME, Rolls-Royce partner for advanced power converters
A*STAR is working with Rolls-Royce to develop GaN power devices that would measure various physical parameters at temperatures up to 300C and environmental pressure of up to 30kpsi.
2005-12-27 IC packaging providers upbeat
Continued strength in the IC packaging and test sector during the fourth quarter and possibly beyond has prompted an investment banking firm to raise its estimates for Amkor, Siliconware and STATS ChipPAC
2012-01-19 IC market to tug chip packaging, testing sales
For Q1, testing and packaging firms forecast a dip in sales from 5-10 percent, although a rebound is forecast for Q3
2004-05-21 IBM jettisons IC-packaging units, sells plants to Amkor
IBM Corp. has moved to jettison its chip assembly and packaging operations, announcing a major deal with Amkor Technology Inc
2007-06-01 IBM gets on the road to 3D packaging
News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging
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