Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > advanced packaging

advanced packaging Search results

total search813 articles
2003-03-14 Cadence adds wire bonding capability to packaging tool
Cadence Design Systems has added a new wire bonding capability to its Advanced Package Designer for designs using stacked packages
2005-05-31 Athlon dual-core processor fits in 939-pin micro PGA packaging
AMD says its new Athlon 64 X2 dual-core processor delivers the performance of a multi-core processor with the same 939-pin micro PGA type packaging as the single-core Athlon 64 CPU
2002-08-19 Amkor qualifies Strand substrates for leadframe packaging
Amkor Technology Inc. has qualified Strand Interconnect's SiliconMate substrates for its MQFP family of leadframe packages.
2008-09-05 Alchip taps Sony Semi's packaging tech for ASICs
Open foundry ASIC provider Alchip Technologies Inc. has selected Sony Corp.'s Semiconductor Group to be their package partner in advanced SoC ASIC solutions for its worldwide customers
2007-02-01 Advanced package-stacking fits more functions
The primary benefit in multiple-die packaging is the dramatic increase in component density. The size and weight of the product is likely to be reduced and functionality enhanced. The functional enhancement is achieved through the integration of several device types
2006-09-27 Ultratech releases new AP lithography tools
Ultratech has introduced two advanced-packaging lithography tools built on its customizable Unity Platform.
2012-04-09 Suss MicroTec buys projection litho tool vendor
The new acquisition will expand Suss MicroTec's lithography segment by adding a new product line and core technology, both of which are highly complementary to the company's existing exposure capability.
2007-10-25 STATS ChipPAC opens second China facility
STATS ChipPAC has announced the opening of a second manufacturing facility in Shanghai, China.
2014-01-23 STATS ChipPAC makes IEEE patent ranking
STATS ChipPAC was recognised for patent innovations by the IEEE for the third consecutive year.
2012-02-03 STATS ChipPAC closes Thai plant
Damages to the facility was so extensive that economic restoration is no longer possible.
2012-01-16 STATS ChipPAC builds new factory
Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet).
2002-06-07 Stacked package trims Motorola's Bluetooth radio
While others tout the benefits of single-chip Bluetooth radio transceivers, Motorola Inc.'s Semiconductor Products Sector has turned to advanced packaging as an alternative to CMOS integration.
2002-11-20 Shipley purchases SUSS lithography equipment
SUSS MicroTec has received an order for its 200mm Mask Aligner from Shipley Co. LLC.
2002-12-09 SEZ expands market to China
ACE Semiconductor Co. Ltd has ordered four immersion systems for batch processing of 200mm wafers from The SEZ Group of Switzerland.
2003-07-07 SECAP installs wafer line at Hsinchu
The Semiconductor Equipment Consortium for Advanced Packaging has installed a 300mm wafer bumping and WLP line at Unitive Semiconductor located in Hsinchu, Taiwan.
2002-10-18 SatCon to design power converter for U.S. Navy
SatCon Technology Corp. has been awarded a $1.1 million contract from EDO Corp., Marine and Aircraft Systems, for the design and development of a power converter for a new mine sweeping system for the U.S. Navy.
2002-09-20 RVSI mulls semiconductor tool business sale
Robotic Vision Systems Inc. announced that it has started discussing the sale of its Semiconductor Equipment Group with interested parties.
2012-12-24 Rudolph buys Azores, enters back-end litho market
Rudolph has entered the back-end advanced packaging lithography market with the new JetStep Lithography System, a disruptive innovation featuring a 2X reduction stepper.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions
2002-07-04 NEXX Systems joins SECAP
NEXX Systems has joined the Semiconductor Equipment Consortium for Advanced Packaging.
2015-01-14 Kulicke & Soffa buys Assemblon for $98M
K&S aims to expand its presence in industrial, automotive and advanced packaging markets with its acquisition of Assemblon in accretive transaction.
2002-06-21 ITI expands photomask operations
Image Technology Inc., a wholly owned subsidiary of SUSS MicroTec, has expanded its precision photomask operations to Taiwan.
2002-03-18 Fujitsu develops eight-stacked MCP
Fujitsu Ltd has developed an ultra-high density, multi-chip package (MCP) that can support up to eight chips mounted on a single MCP.
2004-01-06 FastRamp changes name to STATS FastRamp Test Services
ST Assembly Test Services Ltd (STATS) announced that FastRamp Test Services Inc. has changed its name to STATS FastRamp Test Services.
2013-07-03 EVG unveils room-temperature debonding platform
The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding systems in addition to the company's ZoneBOND technology.
2012-01-03 Component assembly tool touts force control as low as 10g
The MRSI-605 Assembly Work Cell system is designed and configured for advanced packaging solutions required for semiconductor packaging.
2004-05-07 ChipMOS to offer gold-bump services using Saturn tool
ChipMOS Technologies Ltd has purchased Saturn Spectrum 3e advanced packaging lithography tool from Ultratech Inc.
2003-04-29 China's GAPT deploys Teradyne device test system
Global Advanced Packaging Technology Co. Ltd has purchased another test system from Teradyne Inc. - the Catalyst, for a wide range of device testing.
2011-06-29 Bridgepoint buys Sumitomo business unit
Equity firm Bridgepoint has acquired SPTS from Sumitomo Precision Products, boosting SPTS' position in the MEMS, compound semiconductor, advanced packaging and power markets.
2007-11-27 ASE places litho order with Suss MicroTec
German semiconductor equipment manufacturer Suss MicroTec AG has received multiple orders for its lithography production equipment from Taiwan-based chip packaging technology provider ASE Group
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top