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2009-11-25 Applied buys Semitool for $364M
Applied Materials and Semitool have entered a definitive agreement for Applied to acquire Semitool's outstanding shares for $11 per share in an all-cash tender offer.
2006-12-21 AMD goes 'green' with Pb-free bumping tech
Advanced Micro Devices has entered into an agreement to license Amkor Technology's Pb-free electroplated wafer bumping technology
2003-04-11 AIT upgrades assembly, test operations in Indonesia
Advanced Interconnect Technologies Inc. has announced that it will expand operations at its factory in Batam, Indonesia
2008-02-26 Yole sees increasing WLP adoption in ICs
Yole Dveloppement released an analysis on the adoption of WLP in semiconductors based on the idea that WLP technology can be implemented in the most cost sensitive applications.
2006-06-09 Work begins on SemIndia fab
The foundation stone for the $3 billion SemIndia wafer fab was laid at Shamshabad in southern Andhra Pradesh state.
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors.
2008-06-20 Unisem, FlipChip deal zeroes in on wafer technologies
Unisem and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies
2002-07-16 TwinMOS, ACE forge alliance agreement
Taiwan memory module company TwinMOS Technologies Inc. has signed a production agreement with Advanced Chip Engineering Technology Inc
2001-01-01 Thick photoresist patterning for WLP applications
Solder bumps, gold bumps, copper posts and copper wires for redistribution in wafer-level chip-size packaging require a resist mold that is later electroplated to form the final metal structures in advanced interconnect technologies.
2016-04-01 There's more to IC design than just circuits
It takes a village to get complex semiconductors out to market, from design, packaging, test and manufacture. It benefits everyone in the team to know where a product is headed
2016-03-15 The endless pursuit of smaller packages
In this article, we explore the creativity in semiconductor package integration, while anticipating the release of the Samsung's Galaxy S7 and the iPhone 7.
2011-07-26 Taiwan IC industry to benefit from Apple
Many Taiwan semiconductor companies, as well as packaging companies, are set to benefit from Apple's spending cycle
2006-06-09 Taiwan IC assemblers, silicon foundry see gains in May
Taiwan's IC assemblers and a silicon foundry provider separately reported a slight jump in sales for May amid mixed signals in the overall semiconductor industry.
2006-05-03 Taiwan allows IC assemblers in China
The Taiwan government has reportedly relaxed the rules for Taiwanese IC-packaging and assembly houses to invest and set up shop in China
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market
2010-12-15 STATS ChipPac flip chip biz grows over 50%
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units
2007-12-14 Smallest load switches give 60% space savings
Fairchild Semiconductor Corp. has released the industry's smallest advanced load switches
2006-02-07 Small board simultaneously measures temperature, air flow
Advanced Thermal Solutions is releasing its ISD board designed to measure air temperature and velocity from two independent sensors
2004-01-20 SIPA approves investment petitions
The Science-Based Industrial Park Administration has approved the petition of Hermes Microvision, Accuway Machinery, Advanced Bearing, OCTTEL Communication, Syratek Corp. to establish their manufacturing plants in various industrial parks in Taiwan
2007-03-05 Singapore private equity eyes STATS ChipPAC
Singapore's Temasek Holdings is offering of up to $1.6 billion for local packaging house STATS ChipPACa bid that analysts said may undervalue the once-troubled firm
2005-06-27 Simulator leaps to 64 bits
Better accuracy, higher capacity, and quicker results are promised with a 64-bit version of Agilent Technologies' Momentum 3-D planar electromagnetic simulator software.
2002-07-23 Semiconductor equipment market to see gradual recovery
The recovery in the semiconductor market will be gradual, technology innovation will continue to be unabated, and China is expected to play an increasingly important supply and demand role in the coming years.
2014-07-24 Semicon R&D joint labs to advance future electronics
A*STAR IME and industry partners formed the Advanced Semiconductor Joint Labs to develop and innovate semiconductor technologies for future electronics markets
2005-07-08 Quarter-brick IBCs extend to 450W
Georgia Institute of Technology researchers have developed a chip-cooling process that they hope will replace the bulky, bolt-on metal towers used with microprocessors like the G5.
2006-11-28 Private equity eyes Taiwan test house
Private equity firm Carlyle Group is making a move to acquire Advanced Semiconductor Engineering Inc., a Taiwan test and assembly house, for $5.46 billion
2007-01-01 PMC-Sierra announces scalable framer solutions
PMC-Sierra Inc. has announced the PM8310 TEMUX 336, the industry's most integrated and scalable framer solution for next generation voice, wireless and router platforms.
2006-06-14 Organic semicon help develop printed electronics
Advance Nanotech announced progress in the development of new organic semiconductors.
2006-05-31 New FPGA family from Xilinx offers 30 percent increased performance
Xilinx unveiled its latest family of FPGAs, which is said to be built upon the industry's most advanced 65nm triple-oxide technology, new ExpressFabric technology and ASMBL architecture
2005-09-21 New AUP CMOS logic from Philips consumes ultra-low power
Royal Philips Electronics introduced its family of Advanced Ultra-low Power CMOS logic, featuring ultra-low power consumption
2012-01-05 New 28nm platforms: Transforming Asia from world's factory to global R&D hub
The convergence of several long-term economic, market and technological trends are driving demand for a new class of devices that combine the capacity and customizability of ASICs, flexibility of FPGAs and cost effectiveness of ASSPs.
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