Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > advanced packaging

advanced packaging Search results

total search813 articles
2013-05-06 MOSIS joins push for silicon photonics tech
The firm's partnership with ePIXfab gives MOSIS customers access to Imec's modern fully integrated silicon photonics processes and Tyndall's advanced silicon photonics packaging technology.
2004-08-13 MKS, Umetrics to provide process control solution
MKS Instruments Inc. and Umetrics AB have collaborated to offer semiconductor manufacturers a turn-key solution for advanced process control (APC) and e-diagnostics
2014-06-02 Mitigating counterfeiting requires a combination of methods
Layering a combination of method to come up with a more robust solution to foil the entry of counterfeit products in the supply chain involves considering the product, packaging and other labelling
2010-05-31 Malaysia's Unisem sets sight on China market
Malaysia IC-packaging and test specialist Unisem plans to expand in China, develop an automotive expertise and look for acquisitions in the market
2006-08-30 LCD boost converter delivers 100mA at 24V
Designed for single-cell portable products, the new boost converter from Advanced Analogic Technologies delivers 100mA at 24V for OLEDs, LCDs and CCDs
2003-05-27 Infineon, APT enter purchase agreement
Infineon Technologies has agreed on the purchase of its COOLMOS power MOSFET die by Advanced Power Technology
2007-10-02 Infineon licenses DirectFET technology from IR
Infineon will license from International Rectifier the latter's patented advanced power management packaging technology, DirectFET.
2012-10-04 Globalfoundries partners up with timing product specialist
Sand 9's micro-electromechanical systems (MEMS) timing devices provide an alternative with performance and quality improvements over legacy quartz crystal solutions.
2002-03-19 FSA survey points to turnaround in wafer demand
Results of the Fabless Semiconductor Association's eighth annual Wafer and Packaging Demand survey pointed to short-term increase in wafer demand from the fourth quarter of 2001 to first quarter this year
2013-08-13 Fluid dispensing system for cleanroom applications
Spectrum S-820-C fluid dispenser can be used in applications that are extremely sensitive to contamination by sub-micron-sized particles, such as wafer-level packaging
2006-02-14 FlipChip begins construction of bumping facility
FlipChip International announced that it started construction of an advanced bumping facility for a new joint venture in China with Millennium Microtech (Shanghai) Co. Ltd
2012-03-14 Flextronics buy expands its medical, defense offerings
The acquisition will increase Flextronics' offerings to include microelectronic design and manufacturing services to support customers with unique manufacturing needs and those requiring specific certifications.
2003-09-05 Fenghua resistor networks operate to 125C
With 1/8W rated power, the RCML and RCMC series of 4-pin to 11-pin resistor networks from Fenghua Advanced Technology (Group) Co. Ltd have an operating voltage of 200V, and resistance tolerance of 1 percent, 2 percent, and 5 percent
2003-08-28 Fenghua diodes designed for overvoltage protection
The FHD, FHBAS, FHVBAT, FHV, and FHZ SOT-23 diodes from Fenghua Advanced Technology (Group) Co. Ltd are designed for use in pulse-circuit, overvoltage protection, dynamo speed, and photoelectricity testing
2003-08-21 Fenghua chip inductors have 4lb component adhesion
The CMI and VHF series of wirewound chip inductors from Fenghua Advanced Technology (Group) Co. Ltd has a 4lb component adhesion
2003-09-15 Fenghua ceramic multilayer capacitors have 1?F rating
Fenghua Advanced Technology (Group) Co. Ltd has released its ACC series of ceramic multilayer capacitors that has 0.5pF to 1?F ratings
2009-03-18 FCI, SMIC: new 300mm flip chip allies
FlipChip International (FCI) has formed a partnership alliance with Semiconductor Manufacturing International Corp. for 300mm flip chip bumping and wafer-level packaging
2011-10-10 eWLB tech aimed for mobile, cloud apps
STATS ChipPAC's FO-WLP technology platform combines eWLB, TSV and IPD to enhance packaging solutions
2009-07-21 EVG, Applied ink 3D wafer bonding deal
EV Group (EVG) has partnered with Applied Materials Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in 3D IC packaging applications
2007-04-19 Equity firm abandons ASE acquisition plans
An equity group has dropped plans to acquire Taiwan's Advanced Semiconductor Engineering Inc
2004-08-30 Ener1, Delphi to form joint venture for lithium batteries
Ener1 Inc. and Delphi Corp. have signed a non-binding letter of intent to create a joint venture to leverage their combined expertise in lithium batteries.
2011-11-16 Embedded die tech-based 3D package unveiled
ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed
2011-06-02 Elpida, PTI, UMC join forces for TSV tech
The three-way collaboration of Elpida, PTI, and UMC will deliver 3D IC integration technologies including 28nm.
2005-06-01 Driving 10Gb Serial ATCA backplanes
The Backplane Ethernet Task Force is focused on developing three new PHYs: 1000BASE-KX, 10GBASE-KX4 and 10GBASE-KR
2003-08-07 Cree to acquire APT SiC die
Cree has reached an agreement with Advanced Power Technology for the purchase of its SiC Zero Recovery Schottky Diode die
2006-06-01 Choosing the best bumping option
The flip-chip packaging market has rapidly grown in recent years, bolstered by market demands for increased package performance and smaller form factors, an increase in infrastructure, and finally, the development of new substrate technologies and assembly processes
2006-02-02 Camtek gets $1.9M order from Taiwan
Camtek announced that it has received two orders totaling $1.9 million from a Taiwan manufacturer of advanced IC substrates
2005-08-26 Cadence solution to improve productivity, accuracy of design time
Cadence Design Systems announced the latest advances in its IC packaging technology, designed to improve productivity and accuracy for shorter design cycle time
2003-12-12 BTU obtains ISO 9001:2000 certification
BTU Int. Inc., a supplier of advanced thermal processing equipment for semiconductor packaging, surface mount, and advanced materials processing, has received ISO 9001:2000 certification. This certification signifies that BTU has successfully transitioned its quality management system to meet the new, enhanced ISO requirements.
2004-02-23 BTU launches plant in Shanghai
BTU Int. Inc., a supplier of thermal processing equipment for semiconductor packaging, surface-mount, and advanced materials processing, has opened a manufacturing facility in Shanghai, China.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top