Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > advanced packaging

advanced packaging Search results

?
?
total search813 articles
2003-08-27 AVX filters aim for EMI suppression
Expanding circuit designers' options for EMI suppression, AVX Corp. has released a series of miniature ceramic chip components that combines capacitor and inductor elements in a single distributed constant circuit filter.
2003-10-30 ASE, Compeq team on IC substrate joint venture
Advanced Semiconductor Engineering and Compeq Mfg have agreed to set up a joint venture in IC substrate manufacturing to serve the IC substrate market
2008-05-13 ASE soon to seal ASE Test acquisition
Taiwan's Advanced Semiconductor Engineering expects that its acquisition of ASE Test will be completed by May 30
2006-06-30 ASE reaches settlement with insurers
Advanced Semiconductor Engineering has reached a $247 million settlement with insurers regarding a fire that damaged its plant last year
2003-12-19 ASE packages austriamicrosystems wireless communication device
Advanced Semiconductor Engineering Inc. (ASE), a semiconductor packaging and testing company, announced that austriamicrosystems' new low-power radio transmitter/receiver ASIC has been packaged using ASE's Quad Flat No Lead (QFN) solution.
2002-11-25 ASE develops Cadence-based package design flow
Advanced Semiconductor Engineering Inc. has established an analysis-driven IC packaging design flow based on Cadence Design Systems Inc.'s Advanced Package Engineer.
2003-12-04 ASE deploys multiple 300mm wafer bumping system
SUSS MicroTec AG announced that Advanced Semiconductor Engineering Inc. (ASE) has recently purchased and installed multiple 300mm SUSS lithography systems
2013-04-24 Applied Materials reclaims top spot in chip equipment market
In 2012, Applied Materials reclaimed the No. 1 spot based on its relative strength in deposition and process control, Gartner said.
2002-08-30 Amkor, PMC-Sierra begin 2G flip-chip production
Amkor Technology Inc. and PMC-Sierra have released for production its jointly developed second generation flip-chip packaging solutions
2004-07-26 Amkor to take hold of Unitive
Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina (Unitive), and to obtain a majority interest of about 60 percent in Taiwan-based Unitive Semiconductor Taiwan Corp. (UST), a joint venture between Unitive and various Taiwanese investors.
2002-01-29 Amkor to acquire Citizen's semiconductor assembly business
Amkor Technology Inc. has signed a definitive agreement to acquire the semiconductor assembly business of Japan-based Citizen Watch Co. Ltd.
2006-10-19 Amkor opens new wafer bump facility in Singapore
Amkor Technology began operations of its new 300mm wafer bump factory in Singapore on Oct. 16.
2010-07-16 AMEC announces Asia expansion plans
Advanced Micro-Fabrication Equipment Inc. has grown rapidly since 2007, as proven by the milestones achieved by the company in three years
2004-09-07 AMD selects InSite apps for production operations
Advanced Micro Devices Inc. (AMD) has revealed that it is replacing its existing Manufacturing Execution System (MES) with Camstar Systems Inc.'s InSite application suite for test, assembly and packaging operations at its five manufacturing facilities in Singapore, Penang and Kuala Lumpur in Malaysia, Suzhou, China and Bangkok, Thailand.
2003-03-13 AMD rolls mobile Athlon XP processors for notebooks
Advanced Micro Devices has introduced a series of Athlon XP-M processors in ?PGA packaging for integration into thin-and-light notebooks.
2002-01-15 ACE Technology to open wafer plant
Advanced Chip Engineering Technology Inc. (ACE Technology)'s newly established 28,000-square-meter plant is scheduled to begin mass production this week
2002-11-18 VRM: Using a virtual sample to diagnose defects
This technical article details how an advanced acoustic technique makes it possible to create a "virtual package" that preserves the full 3D detail of an IC package as a matrix file
2002-07-18 RVSI ball placement system targets grid array packages
Robotic Vision Systems Inc.'s SP-6800 high-volume ball placement system that is designed to address the high throughput requirements of grid array package manufacturing.
2010-06-10 ON Semi China test JV plans $30M expansion
ON Semiconductor Inc.'s joint IC-assembly and test venture in China outlined its roadmap and expansion plans amid growing but choppy demand for the U.S. chipmaker.
2002-05-20 Fujitsu develops eight-stacked MCP
Fujitsu Microelectronics has developed a high-density multichip package (MCP) that supports up to eight chips and has a profile of 2mm, making it suitable for use in high-capacity LSIs found in mobile phones, digital A/V products, HDDs, and IC cards.
2005-01-10 When bad packages kill good PCBs
How to avoid packaging problems in off-the-shelf ICs and FPGAs, and ASICs
2010-12-08 Ultratech opens manufacturing facility in Singapore
Ultratech Inc. officially opened a manufacturing facility in Singapore. The plant is set to be capable of making over 100 lithography steppers yearly for the advanced packaging and the HB-LED markets.
2009-04-23 TI ramps production in Philippine test plant
Texas Instruments Inc.'s new assembly/test facility within the Clark Freeport Zone in the Philippines is now fully operational and ramping production with the latest packaging technologies
2014-05-19 Silicon photonics oil the works for high-speed switching
Optical components are integrated with multi-chip modules using packaging advancements with micro bumps and module substrates. The next target is to scale the technology in a cost-efficient approach
2007-01-01 Samsung piles chips for thin MCPs
Samsung Electronics' advanced packaging technology piles 16 chips on top of each at an unbelievable height of only 1.4mm.
2005-07-20 New voltage translators from Pericom offer 160Mbps data rate
Pericom expanded its translator portfolio with a patented, advanced ULS technology that allows customers to use a bi-directional automatic direction sensor for supporting different voltage levels being designed into next-gen apps
2006-11-21 Motion-SPM eases inverter motor drive designs
Fairchild said the high integration level and advanced packaging of its Motion-SPM devices simplify the design of small inverter motor drive applications, speed time to market and reduce total system cost.
2011-01-04 Market trends and the electronics industry
As the cost of IC design advanced nodes increases, companies are also looking at embedded systems to shorten the development cycle and increase the potential for hardware reuse
2014-07-25 Li-ion battery controller aimed at smartphones, tablets
The LC05111CMT from ON Semi uses analogue circuit technology, MOSFET technology and advanced packaging expertise to incorporate controller and driver functions in a single circuit.
2004-02-12 Kulicke & Soffa sells flip-chip business
Kulicke & Soffa Ind. Inc. has sold all the assets associated with its advanced packaging technology segment.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top