Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > advanced packaging

advanced packaging Search results

?
?
total search813 articles
2012-03-20 Japan's TEL buys deposition vendor
Nexx's advantages in electronmechanical deposition will help TEL's strategy to advance wafer level packaging
2014-01-16 Imec modelling tool estimates cost of chip technology nodes
Imec and AlixPartners are co-developing a cost modelling solution to assess the cost of advanced semiconductor technology options. This modelling will assess the cost of various patterning options for N10/N7 nodes, advanced packaging solutions, and 3D NAND memory.
2009-08-31 Fujitsu, TSMC collaborate on 28nm process
Fujitsu Microelectronics' 28nm logic ICs will be produced using TSMC's advanced technology platform
2015-03-05 Embedded die in substrate shows promise in processing tech
Yole Dveloppement revealed that embedding die in laminate substrates is a promising packaging principle, but it has to overcome several challenges, which include the supply chain
2003-01-03 DRAM makers prep multichip cell phone memories
Eyeing the growing market for cellular phones, DRAM vendors are seeking ways to fold more non-volatile memory and advanced packaging techniques into their game plans.
2005-12-07 Casio uses Semitool's Raider tool for Pb-free electroplating apps
Semitool announced the delivery of a follow-on order for Semitool's electroplating Raider tool by Japan-based Casio Micronics Co. Ltd. Casio will use the Raider for advanced Pb-free electroplating applications
2014-09-18 Bionic ear promises to deliver remarkable sound experience
The bionic hearing module from AT&S, Soundchip and STMicroelectronics integrates various advanced electronics to enhance the on-the-go audio experience, including head-tracking and other sensing
2014-10-23 Attaching HotRod QFN package to PCB
HotRod QFN is a packaging type that improves electrical and thermal performance over traditional leaded packages. This application note presents information about attaching HotRod QFN devices to PCBs
2006-05-18 Xilinx unveils 65nm FPGAs
Xilinx announced its new Virtex-5 family of FPGAs, which is built on 65nm triple-oxide technology, ExpressFabric technology and advanced silicon modular block architecture
2009-05-19 Virtex-5 FPGAs tailored for defense, aerospace
Xilinx Inc. has rolled out a specialized family of Virtex-5 FPGA with features such as ruggedized packaging and advanced cryptographic capabilities tailored for the aerospace and defense industry.
2011-09-20 U.S. gov't backs printed electronics
Fuel efficiency, cost reduction and advanced electronics performance drive the ever-increasing government support for printed electronics
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics
2004-04-13 TSMC readies new business strategy
Taiwan Semiconductor Mfg Co. Ltd (TSMC) will unveil a revamped business strategy meant to take on the increasingly difficult task of designing, manufacturing and testing advanced semiconductor devices
2014-11-11 TSMC envisions the next big thing
The framework for "the next big thing," according to TSMC, is being cast at advanced foundries that offer one-stop shopping for fabless innovators who want to integrate MEMS sensors and actuators alongside CMOS circuitry on the same SoC
2006-12-12 Transceivers include power-saving function
Sipex has announced four advanced RS-232 transceivers that incorporate the Auto On-line Plus power-saving function
2008-07-17 Tiny load switches control high current rails in UMPC
Micrel Inc. has launched the MIC94040/1/2/3, a new family of high side load switches featuring a breakthrough packaging technology
2006-07-28 Thermal effects not an immediate concern, says TI exec
Contrary to popular belief, the impact of high temperature on a chip design is not among the most immediate concerns for advanced IC design, according to Texas Instruments' Robert Pitts
2005-05-20 Tessera signs substrate pact with Japanese board company
Tessera Technologies Inc. announced that it would expand a business and technology relationship with Japanese pc board technology supplier North Corp. to develop and make available advanced substrate technologies for next-generation electronics
2004-06-15 Synopsys IC, SoC tool reduces design time, cost
The new coreAssembler from Synopsys can be used to implement an IP based flow that can reduce design time, risk and cost of advanced SoC platforms and ICs
2009-01-15 Switches pack low quiescent current, ESD protection
Fairchild Semiconductor has launched the IntelliMAX advanced load switches that claim to offer the lowest quiescent current and prolong battery life
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications
2014-07-29 ST opens MEMS lab in Taiwan
With the increasing demand for advanced microphone applications in the Greater China region, it is imperative for ST to strengthen its local technology and application support
2008-10-17 Spansion, ASE ink JV deal on China facility
Spansion Inc. and Advanced Semiconductor Engineering (ASE) have signed a memorandum of understanding to establish a joint venture to jointly own the Spansion Suzhou, China final manufacturing facility
2010-04-27 Smart sensor packs multiple touch-powered functions
AuthenTec has released the AES1750 advanced smart sensor for the mobile systems market that combines multiple touch-powered functions
2009-08-10 Simulation tool goes online
Fairchild Semiconductor has released a Web-based simulation tool to help designers of portable applications to quickly and accurately assess the performance of advanced load switches in actual application circuits
2007-05-30 SerDes core is PCIe 2.0-compatible
At last week's PCI-SIG Developers Conference in the U.S., NEC Electronics America has introduced a new SerDes core based on its advanced 90nm process technology
2012-08-21 SEMICON Taiwan to focus on MEMS dev't, trends
SEMICON Taiwan 2012 will feature both Taiwan MEMS suppliers and global MEMS elites who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment
2007-07-19 RFMD expands Beijing plant capability
RF Micro Devices Inc. will expand its Beijing facility to include increased assembly capacity and new advanced capabilities
2010-10-07 Qualcomm launches augmented reality SDK for Android
Qualcomm Incorporated has just announced the immediate availability of its Augmented Reality Software Development Kit for Android smartphones. Marketed through Qualcomm's online developer network, QDevNet, Qualcomm's SDK will spawn a new breed of applications that give interactive 3D experiences on everyday objects, such as immersive 3D gaming experiences on tabletops and interactive media experiences on product packaging and promotional items
2004-07-09 PMC-Sierra clock generator accelerates design process
PMC-Sierra introduced the CM5470 system clock generator, the latest addition to its family of Advanced Clock Management products
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top